Lens driving device, and camera module and optical device comprising same

ABSTRACT

A lens moving apparatus includes a housing; a bobbin arranged inside the housing; a first coil arranged on the bobbin; first magnets arranged on first to fourth corner portions of the housing, respectively; a first circuit board which is arranged on a first side portion of the housing, and which comprises a first terminal, a second terminal, a third terminal, and a fourth terminal; a first position sensor arranged on the first circuit board and electrically connected to the first to fourth terminals; a first upper elastic unit arranged on the first corner portion of the housing; a second upper elastic unit arranged on the second corner portion of the housing; a third upper elastic unit arranged on the third corner portion of the housing; and a fourth upper elastic unit arranged on the fourth corner portion of the housing.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. application Ser. No.16/636,529, filed on Feb. 4, 2020, which is the National Phase of PCTInternational Application No. PCT/KR2018/008603, filed on Jul. 30, 2018,which claims priority under 35 U.S.C. 119(a) to Patent Application No.10-2017-0098882, filed in the Republic of Korea on Aug. 4, 2017, PatentApplication No. 10-2017-0108542, filed in the Republic of Korea on Aug.28, 2017, and Patent Application No. 10-2018-0073242, filed in theRepublic of Korea on Jun. 26, 2018, all of which are hereby expresslyincorporated by reference into the present application.

TECHNICAL FIELD

Embodiments relate to a lens moving apparatus, and a camera module andoptical instrument including the same.

BACKGROUND ART

It is difficult to apply technology of a voice coil motor (VCM) used inexisting general camera modules to a subminiature, low-power cameramodule, and therefore research related thereto has been activelyconducted.

Demand for and production of electronic products, such as smartphonesand mobile phones equipped with cameras have increased. A camera formobile phones is on a trend of increased resolution and miniaturization.As a result, an actuator has also been miniaturized, increased indiameter, and increased in functionality. In order to realize ahigh-resolution camera for mobile phones, improvement in performance ofthe camera for mobile phones and additional functions thereof, such asautofocus, handshake compensation, and zooming, are required.

DISCLOSURE Technical Problem

Embodiments provide a lens moving apparatus capable of reducing magneticfield interference, reducing size, reducing current consumption, andimproving sensitivity in OIS driving, and a camera module and opticalinstrument including the same.

In addition, embodiments provide a lens moving apparatus capable ofreducing resistance of a path along which a power signal is provided toa first position sensor, reducing power consumption, and improvingsolderability between a circuit board, at which the first positionsensor is disposed, and upper elastic units, and a camera module and anoptical instrument including the same.

Technical Solution

In one embodiment, a lens moving apparatus includes a housing includinga first side portion, a second side portion, a third side portion, afourth side portion, a first corner located between the first sideportion and the second side portion, a second corner located between thefirst side portion and the fourth side portion, a third corner locatedbetween the third side portion and the fourth side portion, and a fourthcorner located between the second side portion and the third sideportion, a bobbin disposed in the housing, a first coil disposed at thebobbin, first magnets disposed at the first to fourth corners of thehousing, a first circuit board disposed at the first side portion of thehousing, the first circuit board including a first terminal, a secondterminal, a third terminal, and a fourth terminal, a first positionsensor disposed at the first circuit board, the first position sensorbeing connected to the first to fourth terminals, a first upper elasticunit disposed at the first corner, a second upper elastic unit disposedat the second corner, a third upper elastic unit disposed at the thirdcorner, and a fourth upper elastic unit disposed at the fourth corner,wherein one end of the first upper elastic unit extends from the firstcorner to the first side portion so as to be coupled to the firstterminal, one end of the second upper elastic unit extends from thesecond corner to the first side portion so as to be coupled to thesecond terminal, one end of the third upper elastic unit extends fromthe third corner to the first side portion so as to be coupled to thethird terminal, and one end of the fourth upper elastic unit extendsfrom the fourth corner to the first side portion so as to be coupled tothe fourth terminal.

The lens moving apparatus may further include a first lower elastic unitand a second lower elastic unit coupled to a lower portion of thehousing and connected to the first coil, wherein the first circuit boardmay further include a fifth terminal and a sixth terminal coupledrespectively to the first lower elastic unit and the second lowerelastic unit.

The lens moving apparatus may further include a second circuit boarddisposed under the first and second lower elastic units, a firstsupporting member disposed at the first corner to interconnect the firstupper elastic unit and the second circuit board, a second supportingmember disposed at the second corner to interconnect the second upperelastic unit and the second circuit board, a third supporting memberdisposed at the third corner to interconnect the third upper elasticunit and the second circuit board, and a fourth supporting memberdisposed at the fourth corner to interconnect the fourth upper elasticunit and the second circuit board.

The housing may be provided in the first side portion thereof with afirst recess in which the first circuit board is disposed and a secondrecess in which the first position sensor is disposed.

Each of the first to fourth upper elastic units may include a firstouter frame including a first coupling portion coupled to acorresponding one of the first to fourth supporting members, a secondcoupling portion coupled to a corresponding one of the first to fourthcorners, a connection portion configured to interconnect the firstcoupling portion and the second coupling portion, and an extensionportion extending from the second coupling portion to a correspondingone of the first to fourth terminals.

Alternatively, the lens moving apparatus may further include a firstsupporting member disposed at the first corner of the housing, the firstsupporting member being connected to the first terminal via the firstupper elastic unit, and a second supporting member disposed at thesecond corner of the housing, the second supporting member beingconnected to the second terminal via the second upper elastic unit,wherein the first terminal and the second terminal of the first circuitboard may be terminals configured to provide a power signal of the firstposition sensor, and the first terminal of the first circuit board maybe adjacent to the first corner while the second terminal may beadjacent to the second corner.

In addition, the lens moving apparatus may further include a thirdsupporting member disposed at the third corner of the housing, the thirdsupporting member being connected to the third terminal of the firstcircuit board, and a fourth supporting member disposed at the fourthcorner of the housing, the fourth supporting member being connected tothe fourth terminal of the first circuit board, wherein the thirdterminal and the fourth terminal of the first circuit board may bedisposed between the first terminal and the second terminal of the firstcircuit board, and the third terminal of the first circuit board may bea terminal configured to provide a clock signal while the fourthterminal of the first circuit board may be a terminal configured toprovide a data signal.

The first circuit board may include a body portion at which the firstterminal and the second terminals are disposed and an extension portionextending downwards from the body portion, and the first terminal andthe second terminals may be disposed adjacent to opposite ends of thebody portion.

The first position sensor may be disposed at a first surface of thefirst circuit board facing the bobbin while the first to fourthterminals may be disposed at a second surface of the first circuit boardopposite the first surface of the first circuit board, the first circuitboard may include a first recess formed between the second terminal andthe fourth terminal and a second recess formed between the firstterminal and the third terminal, a portion of the third upper elasticunit may be disposed in the first recess of the first circuit board, anend of the portion of the third upper elastic unit being coupled to thethird terminal of the first circuit board, and a portion of the fourthupper elastic unit may be disposed in the second recess of the firstcircuit board, an end of the portion of the fourth upper elastic unitbeing coupled to the fourth terminal of the first circuit board.

The first and second upper elastic units may be spaced apart from thebobbin.

Advantageous Effects

According to embodiments, it is possible to reduce magnetic fieldinterference, to reduce size, to reduce current consumption, and toimprove sensitivity in OIS driving.

In addition, according to embodiments, it is possible to reduceresistance of a path along which a power signal is provided to a firstposition sensor, to reduce power consumption, and to improvesolderability between a circuit board, at which the first positionsensor is disposed, and upper elastic units.

DESCRIPTION OF DRAWINGS

FIG. 1 is an exploded perspective view of a lens moving apparatusaccording to an embodiment.

FIG. 2 is an assembled perspective view of the lens moving apparatus ofFIG. 1 with a cover member removed.

FIG. 3 is a perspective view of a bobbin, a first coil, a second magnet,and a third magnet shown in FIG. 1 .

FIG. 4 is a separated perspective view of a housing, a first magnet, acircuit board, and a first position sensor shown in FIG. 1 .

FIG. 5 is a coupled perspective view of the housing, the first magnet,the circuit board, and the first position sensor shown in FIG. 4 .

FIG. 6 is a sectional view of the lens moving apparatus shown in FIG. 2when cut in an AB direction.

FIG. 7 is a sectional view of the lens moving apparatus shown in FIG. 2when cut in a CD direction.

FIG. 8 is an enlarged view of the circuit board and the first positionsensor shown in FIG. 4 .

FIG. 9 shows an embodiment of the first position sensor shown in FIG. 8.

FIG. 10 is a plan view of an upper elastic member shown in FIG. 1 .

FIG. 11 is a plan view of a lower elastic member shown in FIG. 1 .

FIG. 12 is a coupled perspective view of the upper elastic member, thelower elastic member, a base, a supporting member, a second coil, andthe circuit board shown in FIG. 1 .

FIG. 13 is a separated perspective view of the second coil, the circuitboard, the base, and a second position sensor shown in FIG. 1 .

FIG. 14 is a bottom perspective view of a housing, first magnets, thelower elastic member, and the circuit board shown in FIG. 1 .

FIG. 15 shows arrangement of the first magnets, second and thirdmagnets, the first position sensor, and the circuit board.

FIG. 16A is a conceptual view showing a connection relationship amongfirst outer frames of first to sixth upper springs, a first coil, and acircuit board according to another embodiment.

FIG. 16B is a conceptual view showing a connection relationship amongfirst outer frames of first to sixth upper springs, a first coil, and acircuit board according to another embodiment.

FIG. 17 is an exploded perspective view of a lens moving apparatusaccording to another embodiment.

FIG. 18 is an assembled perspective view of the lens moving apparatus ofFIG. 17 with a cover member removed.

FIG. 19A is a perspective view of a bobbin, a second magnet, and a thirdmagnet shown in FIG. 17 .

FIG. 19B shows a first coil coupled to a bobbin.

FIG. 20A is a perspective view of a housing, a circuit board, a firstposition sensor, and a capacitor shown in FIG. 17 .

FIG. 20B is a coupled perspective view of the housing, a first magnet,the circuit board, the first position sensor, and the capacitor.

FIG. 21 is a sectional view of the lens moving apparatus shown in FIG.18 in an AB direction.

FIG. 22 is a sectional view of the lens moving apparatus shown in FIG.18 in a CD direction.

FIG. 23 is an enlarged view of the circuit board and the first positionsensor of FIG. 17 .

FIG. 24 shows an upper elastic member shown in FIG. 17 .

FIG. 25 shows a lower elastic member shown in FIG. 17 .

FIG. 26 is a coupled perspective view of the upper elastic member, thelower elastic member, a base, a supporting member, a second coil, andthe circuit board.

FIG. 27 shows coupling between first to fourth terminals of the circuitboard and upper elastic units.

FIG. 28 is a bottom view of fifth and sixth terminals of the circuitboard and lower elastic units.

FIG. 29 is a separated perspective view of a second coil, the circuitboard, the base, and a second position sensor.

FIG. 30 is a bottom view of the housing, the first magnet, the lowerelastic member, and the circuit board.

FIG. 31 shows arrangement of the first magnet, second and third magnets,the first position sensor, the capacitor, and the circuit board.

FIG. 32 is a side view of FIG. 31 .

FIG. 33 is a perspective view of a lens moving apparatus according toanother embodiment.

FIG. 34 is an exploded view of the lens moving apparatus shown in FIG.33 .

FIG. 35 is an assembled view of the lens moving apparatus of FIG. 33with a cover member removed.

FIG. 36A is a perspective view of a bobbin shown in FIG. 34 .

FIG. 36B is a bottom perspective view of the bobbin and a first coil.

FIG. 37A is a first perspective view of a housing shown in FIG. 34 .

FIG. 37B is a second perspective view of the housing shown in FIG. 37A.

FIG. 38A is a perspective view of an upper elastic member.

FIG. 38B is a perspective view of a lower elastic member.

FIG. 39 shows the housing, the upper elastic member, and a coil chip.

FIG. 40 is an enlarged view of the coil chip shown in FIG. 39 .

FIG. 41 is a perspective view of the upper elastic member, the lowerelastic member, the coil chip, a supporting member, a second coil, acircuit board, and a base of FIG. 34 .

FIG. 42 is a separated perspective view of the base, the circuit board,and the second coil of FIG. 34 .

FIG. 43 is a sectional view of the lens moving apparatus 2100 shown inFIG. 35 in an AB direction.

FIG. 44A shows a recess for mounting a coil chip according to anotherembodiment.

FIG. 44B shows upper springs connected to the coil chip disposed in therecess of FIG. 44A.

FIG. 45 shows arrangement of a coil chip according to anotherembodiment.

FIG. 46 shows another embodiment of the upper elastic member configuredto be coupled to the coil chip shown in FIG. 45 .

FIG. 47 shows a connection relationship between the coil chip of FIG. 46and upper springs of FIG. 46 .

FIG. 48 shows arrangement of a coil chip according to anotherembodiment.

FIG. 49 shows first and second upper springs according to anotherembodiment configured to be coupled to the coil chip of FIG. 48 .

FIG. 50 is an exploded perspective view of a camera module according toan embodiment.

FIG. 51 is a perspective view of a portable terminal according to anembodiment.

FIG. 52 shows construction of the portable terminal shown in FIG. 51 .

BEST MODE

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings. In the followingdescription of the embodiments, it will be understood that, when a layer(film), region, pattern, or structure is referred to as being “on” or“under” another layer (film), region, pattern, or structure, it can be“directly” on or under the other layer (film), region, pattern, orstructure or can be “indirectly” formed such that an intervening elementis also present. In addition, terms such as “on” or “under” should beunderstood on the basis of the drawings.

In the drawings, the sizes of respective elements are exaggerated,omitted, or schematically illustrated for convenience and clarity ofdescription. Further, the sizes of the respective elements do not denotethe actual sizes thereof. In addition, wherever possible, the samereference numbers will be used throughout the drawings to refer to thesame or like parts.

Hereinafter, a lens moving apparatus according to an embodiment will bedescribed with reference to the accompanying drawings. For convenienceof description, the lens moving apparatus according to the embodimentwill be described using a Cartesian coordinate system (x, y, z).However, the disclosure is not limited thereto. Other differentcoordinate systems may be used. In the drawings, an x axis and a y axisare directions perpendicular to a z axis, which is an optical-axisdirection. The z-axis direction, which is the optical-axis direction,may be referred to as a “first direction,” the x-axis direction may bereferred to as a “second direction,” and the y-axis direction may bereferred to as a “third direction.”

The lens moving apparatus according to the embodiment may perform an“autofocus function.” Here, the autofocus function means a function ofautomatically focusing an image of a subject on the surface of an imagesensor.

In addition, the lens moving apparatus according to the embodiment mayperform a “handshake compensation function.” Here, the handshakecompensation function means a function of preventing the contour of acaptured still image from being blurred due to vibration caused byhandshake of a user when capturing the still image.

FIG. 1 is an exploded perspective view of a lens moving apparatus 100according to an embodiment, and FIG. 2 is an assembled perspective viewof the lens moving apparatus 100 of FIG. 1 with a cover member 300removed.

Referring to FIGS. 1 and 2 , the lens moving apparatus 100 includes abobbin 110, a first coil 120, a first magnet 130, a housing 140, anupper elastic member 150, a lower elastic member 160, a first positionsensor 170, and a second magnet 180.

In order to perform a handshake compensation function, the lens movingapparatus 100 may further include a supporting member 220, a second coil230, and a second position sensor 240.

In addition, the lens moving apparatus 100 may further include a thirdmagnet 185, a circuit board 190, a base 210, a circuit board 250, and acover member 300.

The cover member 300 receives the bobbin 110, the first coil 120, thefirst magnet 130, the housing 140, the upper elastic member 150, thelower elastic member 160, the first position sensor 170, the secondmagnet 180, the circuit board 190, the supporting member 220, the secondcoil 230, the second position sensor 240, and the circuit board 250 in areceiving space formed together with the base 210.

The cover member 300 may be formed in the shape of a box, the lowerportion of which is open and which includes an upper plate and sideplates. The lower portion of the cover member 300 may be coupled to theupper portion of the base 210. The shape of the upper plate of the covermember 300 may be polygonal, e.g. quadrangular or octagonal.

The cover member 300 may be provided in the upper plate thereof with anopening, through which a lens (not shown) coupled to the bobbin 110 isexposed to external light. The cover member 300 may be made of anonmagnetic material, such as SUS, in order to prevent a phenomenon inwhich the first magnet 130 attracts the cover member. Alternatively, thecover member may be made of a magnetic material so as to perform thefunction of a yoke that increases electromagnetic force between thefirst coil 120 and the first magnet 130.

Next, the bobbin 110 will be described.

The bobbin 110 is disposed inside the housing 140, and may be moved inan optical-axis (OA) direction or a first direction (e.g. a Z-axisdirection) as the result of electromagnetic interaction between thefirst coil 120 and the first magnet 130.

FIG. 3 is a perspective view of the bobbin 110, the first coil 120, thesecond magnet 180, and a third magnet 185 shown in FIG. 1 .

Referring to FIG. 3 , the bobbin 110 may have an opening, in which alens or a lens barrel is mounted. For example, the shape of the openingof the bobbin 110 may be circular, oval, or polygonal. However, thedisclosure is not limited thereto.

The lens may be directly mounted in the opening of the bobbin 110.However, the disclosure is not limited thereto. In another embodiment, alens barrel, in which at least one lens is mounted or coupled, may becoupled or mounted in the opening of the bobbin 110. The lens or thelens barrel may be coupled to an inner circumferential surface 110 a ofthe bobbin 110 in various manners.

The bobbin 110 may include first side portions 110 b-1 spaced apart fromeach other and second side portions 110 b-2 spaced apart from eachother. Each of the second side portions 110 b-2 may interconnect twoadjacent first side portions. For example, the horizontal length or thetransverse length of each of the first side portions 110 b-1 of thebobbin 110 may be larger than the horizontal length of the transverselength of each of the second side portions 110 b-2 thereof.

The bobbin 110 may be provided at the upper surface thereof with a guideportion 111 for guiding the installation position of the upper elasticmember 150. For example, as shown in FIG. 3 , the guide portion 111 ofthe bobbin 110 may protrude from the upper surface thereof in the firstdirection (e.g. the Z-axis direction) so as to guide a path along whicha frame connection portion 153 of the upper elastic member 150 extends.

In addition, the bobbin 110 may be provided at the outer surface thereofwith a protrusion 112 protruding in a second and/or third direction. Aninner frame 151 of the upper elastic member 150 may be settled on theupper surface 112 a of the protrusion 112 of the bobbin 110.

The protrusion 112 of the bobbin 110 may serve to prevent the bobbin 110from directly colliding with the housing 140 even in the case in whichthe bobbin is moved beyond a predetermined range due to external impactwhen the bobbin 110 is moved in the optical-axis direction in order toperform autofocus.

The protrusion 112 of the bobbin 110 may correspond to a recess 25 a ofthe housing 140, may be inserted or disposed in the recess 25 a of thehousing 140, and may inhibit or prevent the bobbin 110 from beingrotated about the optical axis beyond a predetermined range.

The bobbin 110 may include a first stopper 116 protruding from the uppersurface thereof. The stopper 116 may serve to prevent the upper surfaceof the bobbin 110 from directly colliding with the inside of an upperplate of the cover member 300 even in the case in which the bobbin 110is moved beyond the predetermined range due to external impact when thebobbin 110 is moved in the first direction in order to perform anautofocus function.

The bobbin 110 may include a second stopper (not shown) protruding fromthe lower surface thereof, and the second stopper of the bobbin 110 mayprevent the lower surface of the bobbin 110 from directly colliding withthe base 210, the second coil 230, or the circuit board 250 even in thecase in which the bobbin 110 is moved beyond the predetermined range dueto external impact when the bobbin 110 is moved in the first directionin order to perform the autofocus function.

The bobbin 110 may include a first coupling portion 113 configured to becoupled and fixed to the upper elastic member 150. For example, in FIG.3 , the first coupling portion 113 is a protrusion. However, thedisclosure is not limited thereto. In another embodiment, the firstcoupling portion 113 of the bobbin 110 may be a recess or a plane. Inaddition, the bobbin 110 may include a second coupling portion (notshown) configured to be coupled and fixed to the lower elastic member160, and the second coupling portion of the bobbin 110 may be aprotrusion, a recess, or a plane.

A coil settlement recess, in which the first coil 120 is settled,inserted, or disposed, may be provided in the outer circumferentialsurface of the bobbin 110. The coil settlement recess may be a recessformed inwardly from an outer surface 110 b of each of the first andsecond side portions 110 b-1 and 110 b-2 of the bobbin 110, and may havea shape coinciding with the shape of the first coil 120 or a closed-loopshape (e.g. a ring shape).

A second magnet settlement recess 180 a, in which the second magnet 180is settled, inserted, fixed, or disposed, may be provided in the outersurface of the bobbin 110.

The second magnet settlement recess 180 a of the bobbin 110 may have astructure recessed from the outer surface of the bobbin 110, and mayhave an opening formed in the upper surface of the bobbin 110. However,the disclosure is not limited thereto.

The second magnet settlement recess 180 a of the bobbin 110 may belocated at the upper side of the coil settlement recess, in which thefirst coil 120 is disposed, and may be spaced apart from the coilsettlement recess. However, the disclosure is not limited thereto.

In addition, a third magnet settlement recess 185 a, in which the thirdmagnet 185 is settled, inserted, fixed, or disposed, may be provided inthe upper surface of the bobbin 110.

The third magnet settlement recess 185 a may have a structure recessedfrom the outer circumferential surface 110 b of the bobbin 110, and mayhave an opening formed in the upper surface of the bobbin 110. However,the disclosure is not limited thereto.

The third magnet settlement recess 185 a of the bobbin 110 may belocated at the upper side of the coil settlement recess, in which thefirst coil 120 is disposed, and may be spaced apart from the coilsettlement recess. However, the disclosure is not limited thereto.

The second magnet settlement recess 180 a may be provided at one of thesecond side portions 110 b-2 of the bobbin 110, and the third magnetsettlement recess 185 a may be provided at another of the second sideportions 110 b-2 of the bobbin 110.

The third magnet settlement recess 185 a may be disposed so as to facethe second magnet settlement recess 18. For example, the second andthird magnet settlement recesses 180 a and 185 a may be provided in twofacing second side portions of the bobbin 110.

The second magnet 180 and the third magnet 185 may be disposed oraligned in the bobbin 110 so as to face the first position sensor 170.As a result, the second magnet 180 and the third magnet 185 may bebalanced in weight, whereby accuracy in autofocus (AF) driving may beimproved.

The first coil 120 is disposed on the outer surface of the bobbin 110.

The first coil 120 may be disposed under the second and third magnets180 and 185. However, the disclosure is not limited thereto. Forexample, the first coil 120 may not overlap the second and third magnets180 and 185 in a second direction or a third direction. However, thedisclosure is not limited thereto.

For example, the first coil 120 may be disposed in the coil settlementrecess, the second magnet 180 may be inserted or disposed in the secondmagnet settlement recess 180 a, and the third magnet 185 may be insertedor disposed in the third magnet settlement recess 185 a.

Each of the second magnet 180 and the third magnet 185 disposed at thebobbin 110 may be spaced apart from the first coil 120 in theoptical-axis (OA) direction. However, the disclosure is not limitedthereto. In another embodiment, each of the second magnet 180 and thethird magnet 185 disposed at the bobbin 110 may abut the first coil 120,or may overlap the first coil 120 in the second direction or the thirddirection.

The first coil 120 may wrap the outer surface of the bobbin 110 in adirection that rotates about the optical axis OA.

The first coil 120 may be directly wound around the outer surface of thebobbin 110. However, the disclosure is not limited thereto. In anotherembodiment, the first coil 120 may be wound around the bobbin 110 usinga coil ring, or may be configured as an angular ring-shaped coil block.

When a driving signal (e.g. driving current) is supplied to the firstcoil 120, electromagnetic force may be formed through electromagneticinteraction between the first coil and the first magnet 130, and thebobbin 110 may be moved by the formed electromagnetic force in theoptical-axis (OA) direction.

At an initial position of an AF operation unit, the bobbin 110 may bemoved in an upward or downward direction, which is referred to asbidirectional driving of the AF operation unit. Alternatively, at theinitial position of the AF operation unit, the bobbin 110 may be movedin the upward direction, which is referred to as unidirectional drivingof the AF operation unit.

At the initial position of the AF operation unit, the first coil 120 maybe disposed so as to correspond to the first magnet 130 disposed at thehousing 140 or to be aligned with or overlap the first magnet in adirection perpendicular to the optical axis OA.

For example, the AF operation unit may include the bobbin 110 andcomponents coupled to the bobbin 110 (e.g. the first coil 120 and thesecond and third magnets 180 and 185). The initial position of the AFoperation unit may be the original position of the AF operation unit inthe state in which no power is applied to the first coil 120 or theposition at which the AF operation unit is located as the result of theupper and lower elastic members 150 and 160 being elastically deformeddue only to the weight of the AF operation unit.

In addition, the initial position of the bobbin 110 may be the positionat which the AF operation unit is located when gravity acts in thedirection from the bobbin 110 to the base 210 or when gravity acts inthe direction from the base 210 to the bobbin 110.

The second magnet 180 may be disposed in the second magnet settlementrecess 180 a of the bobbin 110, and a portion of one surface of thesecond magnet 180 facing the first position sensor 170 may be exposedfrom the second magnet settlement recess 180 a. However, the disclosureis not limited thereto.

For example, the interface between an N pole and an S pole of each ofthe second and third magnets 180 and 185 disposed at the bobbin 110 maybe parallel to a direction perpendicular to the optical axis OA. Forexample, the surfaces of the second and third magnets 180 and 185 facingthe first position sensor 170 may have an N pole and an S pole,respectively. However, the disclosure is not limited thereto.

For example, in another embodiment, the interface between the N pole andthe S pole of each of the second and third magnets 180 and 185 disposedat the bobbin 110 may be parallel to the optical axis OA.

For example, each of the second and third magnets 180 and 185 may be amonopolar magnetized magnet or a bipolar magnetized magnet.

The second magnet 180 may be moved together with the bobbin 110 in theoptical-axis direction, and the first position sensor 170 may sense theintensity of a magnetic field of the second magnet 180 moved in theoptical-axis direction. Since the intensity of the magnetic field sensedby the first position sensor 170 varies depending on the displacement ofthe bobbin 110 in the optical-axis direction, the displacement of thebobbin 110 in the optical-axis direction may be sensed based on theintensity of the magnetic field sensed by the first position sensor 170.

Next, the housing 140 will be described.

The housing 140 receives the bobbin 110 therein, and supports the firstmagnet 130 and the circuit board 190, in which the first position sensor170 is disposed.

The housing 140 may generally have a hollow pillar shape. For example,the housing 140 may have a polygonal (e.g. quadrangular or octagonal) orcircular opening.

FIG. 4 is a separated perspective view of the housing 140, the firstmagnet 130, the circuit board 190, and the first position sensor 170shown in FIG. 1 , and FIG. 5 is a coupled perspective view of thehousing 140, the first magnet 130, the circuit board 190, and the firstposition sensor shown in FIG. 4 .

Referring to FIGS. 4 and 5 , the housing 140 may include a plurality ofside portions 141-1 to 141-4 and a plurality of corners 142-1 to 142-4.

For example, the housing 140 may include first to fourth side portions141-1 to 141-4 spaced apart from each other and first to fourth corners142-1 to 142-4 spaced apart from each other.

Each of the corners 142-1 to 142-4 of the housing 140 may be disposed orlocated between two adjacent side portions 141-1 and 141-2, 141-2 and141-3, 141-3 and 141-4, or 141-4 and 141-1, and may interconnect theside portions 141-1 to 141-4.

For example, the corners 142-1 to 142-4 may be located at the cornerportions of the housing 140.

For example, the number of side portions of the housing 140 may be four,and the number of corners thereof may be four. However, the disclosureis not limited thereto.

The transverse length of each of the side portions 141-1 to 141-4 of thehousing 140 may be larger than the transverse length of each of thecorners 142-1 to 142-4 thereof. However, the disclosure is not limitedthereto.

For example, the side portions 141-1 to 141-4 of the housing 140 maycorrespond to the first side portions 110 b-1 of the bobbin 110, and thecorners 142-1 to 142-4 of the housing 140 may correspond to the secondside portions 110 b-2 of the bobbin 110.

The first magnet 130 may be disposed or installed at each of the corners142-1 to 142-4 of the housing 140.

Supporting members 220-1 to 220-4 may be disposed at the corners 142-1to 142-4 of the housing 140.

In order to avoid interference with the protrusion 112 of the bobbin 110when the bobbin 110 is moved in the optical-axis (OA) direction, thehousing 140 may be provided, at a position thereof corresponding to theprotrusion 112 of the bobbin 110, with a settlement recess 146.

The housing 140 may have a settlement portion 141 a for receiving thefirst magnet 130, a mounting recess 14 a for receiving the circuit board190, and a mounting recess 14 b for receiving the first position sensor170.

The settlement portion 141 a of the housing 140 may be provided at thelower end of at least one of the corners 142-1 to 142-4 of the housing140.

For example, the settlement portion 141 a of the housing 140 may beprovided at the lower end of each of the four corners 142-1 to 142-4.Each of the first magnets 130-1 to 130-4 may be inserted into and fixedto a corresponding one of the settlement portions 141 a of the housing140.

The settlement portion 141 a of the housing 140 may be formed as aconcave recess having a size corresponding to the size of the firstmagnet 130. However, the disclosure is not limited thereto.

Recesses 61, through which an adhesive for attaching the first magnets130-1 to 130-4 to the settlement portions 141 a of the housing 140 isinjected, may be provided in the side portions 141-1 to 141-4 of thehousing 140. For example, the recesses 61 of the housing 140 may bethrough holes, and may be connected to the settlement portions 141 a ofthe housing 140.

For example, an opening may be formed in the lower surface of thesettlement portion 141 a of the housing 140 facing the second coil 230,and an opening may be formed in the side surface of the settlementportion 141 a of the housing 140 facing the first coil 120.

For example, the lower surface of the first magnet 130 fixed to thesettlement portion 141 a of the housing 140 may face the second coil 120in the optical-axis direction.

The mounting recess 14 a of the housing 140 may be provided in the upperportion or the upper end of one of the side portions 141-1 to 141-4 ofthe housing 140 (for example, 141-1).

The mounting recess 14 a of the housing 140 may be a recess, the upperportion of which is open and which has a side surface and a bottom, foreasy mounting of the circuit board 190, and may have an opening formedtoward the inside of the housing 140. The shape of the mounting recess14 a of the housing 140 may correspond to or coincide with the shape ofthe circuit board 190.

The mounting recess 14 b of the housing 140 may be provided in the innersurface of the first side portion 141-1 of the housing 140, and may beconnected to the mounting recess 14 a.

In addition, the mounting recess 14 b of the housing 140 may be open inthe upper portion thereof for easy mounting of the first position sensor170, and may have an opening formed toward the inner surface of thefirst side portion 141-1 of the housing 140 in order to increasesensitivity in sensing. The shape of the mounting recess 14 b of thehousing 140 may correspond to or coincide with the shape of the firstposition sensor 170.

The first magnet 130 may be fixed to the settlement portion 141 a of thehousing 140 using an adhesive, and the circuit board 190 may be fixed tothe mounting recess 14 a of the housing 140 using an adhesive. Forexample, the adhesive may be epoxy or double-sided tape. However, thedisclosure is not limited thereto.

Each of the side portions 141-1 to 141-4 of the housing 140 may bedisposed parallel to a corresponding one of the side plates of the covermember 300.

Holes 147 defining paths along which the supporting members 220-1 to220-4 extend may be provided in the corners 142-1 to 142-4 of thehousing 140. For example, the housing 140 may include holes 147 formedthrough the upper portions of the corners 142-1 to 142-4.

In another embodiment, the holes provided in the corners 142-1 to 142-4of the housing 140 may be depressed from the outer surfaces of thecorners of the housing 140, and at least a portion of each of the holesmay be open toward the outer surface of a corresponding one of thecorners.

The number of holes 147 of the housing 140 may be equal to the number ofsupporting members. One end of the supporting member 220 may beconnected or bonded to the upper elastic member 150 via a correspondingone of the holes 147.

For example, the diameter of each hole 147 may gradually increase in thedirection from the upper surface to the lower surface of the housing 140for easy application of a damper. However, the disclosure is not limitedthereto. In another embodiment, the diameter of each hole 147 may beuniform.

In addition, the housing 140 may be provided at the upper portion, theupper end, or the upper surface thereof with a stopper 145 in order toprevent the housing from directly colliding with the inner surface ofthe upper plate of the cover member 300 shown in FIG. 1 .

For example, the stopper 145 may be provided at the upper surface ofeach of the corners 142-1 to 142-4 of the housing 140.

For example, the holes 147 of the housing 140 may be located between theoutsides of the upper surfaces of the corners 142-1 to 142-4 of thehousing 140 and the stoppers 145.

In addition, the housing 140 may be provided on the edge of each of thecorners 142-1 to 142-4 thereof with a guide protrusion 144 forpreventing overflow of the damper.

The housing 140 may have at least one first coupling portion 143 and Q1to Q4 coupled to an outer frame 152 of the upper elastic member 150.

For example, each of the first coupling portions 143 and Q1 to Q4 may bea protrusion. However, the disclosure is not limited thereto. In anotherembodiment, each of the first coupling portions may be a recess or aplane.

The first coupling portions 143 and Q1 to Q4 of the housing 140 may bedisposed at at least one of the side portions 141-1 to 141-4 or thecorners 142-1 to 142-4 of the housing 140.

For example, the first coupling portions 143 of the housing 140 may bedisposed at the side portions 141-1 to 141-4 of the housing 140, and thefirst coupling portions Q1 to Q4 of the housing 140 may be disposed atthe corners 142-1 to 142-4 of the housing 140.

The housing 140 may be provided at the lower surface thereof with asecond coupling portion 149 coupled and fixed to an outer frame 162 ofthe lower elastic member 160. For example, the second coupling portion149 of the housing 140 may be a protrusion. However, the disclosure isnot limited thereto. In another embodiment, the second coupling portionmay be a recess or a plane.

In order to define a path along which the supporting member 220 extendsand to secure a space for filling with a damping member (for example,gel-type silicone), the housing 140 may have concave recesses 142 aformed in the lower portions or the lower ends of the corners 142-1 to142-4 thereof. That is, in order to alleviate vibration of thesupporting member 220, the concave recesses 142 a of the housing may befilled with the damping member, such as silicone.

The housing 140 may be provided with at least one stopper (not shown)protruding from the outer surfaces of the side portions 141-1 to 141-4thereof. The at least one stopper may prevent the housing 140 fromcolliding with the cover member 300 when moved in the second and/orthird direction.

In order to prevent the lower surface of the housing 140 from collidingwith the base 210 and/or the circuit board 250, the housing 140 may befurther provided with a stopper (not shown) protruding from the lowersurface thereof.

At the initial position of the AF operation unit, the first magnets130-1 to 130-4 may be disposed at the housing 140 such that at least aportion of each of the magnets overlaps the first coil 120 in adirection perpendicular to the optical axis OA.

For example, each of the first magnets 130-1 to 130-4 may be insertedinto or disposed in the settlement portion 141 a of a corresponding oneof the corners 142-1 to 142-4 of the housing 140.

In another embodiment, the first magnets 130-1 to 130-4 may be disposedat the outer surfaces of the corners 142-1 to 142-4 of the housing 140.

The shape of each of the first magnets 130-1 to 130-4 may be polyhedralsuch that the magnets are easily settled in the corners of the housing140.

For example, the area of a first surface 11 a of each of the firstmagnets 130-1 to 130-4 may be larger than the area of a second surface11 b thereof. The first surface 11 a of each of the first magnets 130-1to 130-4 may be a surface facing one surface of the first coil 120 (orthe outer surface of the bobbin 110), and the second surface 11 b may beopposite the first surface 11 a.

For example, the transverse length of the second surface 11 b of each ofthe first magnets 130-1 to 130-4 may be smaller than the transverselength of the first surface 11 a thereof.

For example, the transverse direction of the first surface 11 a may be adirection of the first surface 11 a perpendicular to the direction fromthe lower surface to the upper surface of each of the magnets 130-1 to130-4 or a direction of the first surface 11 a perpendicular to theoptical-axis direction.

For example, the transverse direction of the second surface 11 b may bea direction of the second surface 11 b perpendicular to the directionfrom the lower surface to the upper surface of each of the magnets 130-1to 130-4 or a direction of the second surface 11 b perpendicular to theoptical-axis direction.

For example, the transverse length of each of the first magnets 130-1 to130-4 may gradually decrease from the center of the housing 140 to thecorner 142-1, 142-2, 142-3, or 142-4 of the housing 140.

For example, the transverse length of each of the first magnets 130-1 to130-4 may decrease from the first surface 11 a to the second surface 11b thereof.

Here, the transverse direction may be the transverse direction (or thehorizontal direction) of the first surface 11 a of each of the firstmagnets 130-1 to 130-4 perpendicular to the direction from the uppersurface to the lower surface of each of the magnets 130-1 to 130-4.

Each of the first magnets 130-1 to 130-4 may be configured as a singlebody, and may be disposed such that the first surface 11 a facing thefirst coil 120 has an S pole and the second surface 11 b has an N pole.However, the disclosure is not limited thereto. In another embodiment,the first surface 11 a of each of the first magnets 130-1 to 130-4 mayhave an N pole, and the second surface 11 b thereof may have an S pole.

The first magnets 130-1 to 130-4 may be disposed or installed in thecorners of the housing 140 such that at least two thereof face eachother.

For example, two pairs of first magnets 130-1 to 130-4 facing each otherso as to intersect each other may be disposed at the corners 142-1 to142-4 of the housing 140. In this case, the planar shape of each of thefirst magnets 130-1 to 130-4 may be triangular, pentagonal, rhombic, orthe like.

In another embodiment, a pair of first magnets facing each other may bedisposed at only two corners of the housing 140 facing each other.

FIG. 6 is a sectional view of the lens moving apparatus 100 shown inFIG. 2 when cut in an AB direction, and FIG. 7 is a sectional view ofthe lens moving apparatus shown in FIG. 2 when cut in a CD direction.

Referring to FIGS. 6 and 7 , each of the second and third magnets 180and 185 may not overlap the first coil 120 in a direction perpendicularto the optical axis OA. However, the disclosure is not limited thereto.In another embodiment, each of the second and third magnets 180 and 185may overlap the first coil 120 in a direction perpendicular to theoptical axis OA.

In addition, at the initial position of the AF operation unit, thesecond magnet 180 may overlap or be aligned with the third magnet 185 ina direction perpendicular to the optical axis OA.

In addition, at the initial position of the AF operation unit, the firstposition sensor 170 may overlap each of the second and third magnets 180and 185 in a direction perpendicular to the optical axis OA. However,the disclosure is not limited thereto. In another embodiment, the firstposition sensor 170 may not overlap at least one of the second or thirdmagnet 180 or 185 in a direction perpendicular to the optical axis OA.

In addition, the first position sensor 170 may not overlap the firstmagnets 130-1 to 130-4 in a direction from the first position sensor 170to the first coil 120 or a direction perpendicular to the outer surfaceof the first side portion 141-1 of the housing 140.

Next, the first position sensor 170 and the circuit board 190 will bedescribed.

FIG. 8 is an enlarged view of the circuit board 190 and the firstposition sensor 170 shown in FIG. 4 , and FIG. 9 shows an embodiment ofthe first position sensor 170 shown in FIG. 8 .

Referring to FIG. 8 , the first position sensor 170 may be mounted tothe circuit board 190 disposed at the housing 140, and may be fixed tothe housing 140. For example, the first position sensor 170 may be movedtogether with the housing 140 during handshake compensation.

The first position sensor 170 may sense the intensity of a magneticfield of the second magnet 180 mounted to the bobbin 110 when the bobbin110 is moved, and may output an output signal based on the result ofsensing.

The first position sensor 170 may be disposed at a first surface of thecircuit board 190. Here, the first surface of the circuit board 190 maybe the surface of the circuit board 190 facing the bobbin 110 when thecircuit board 190 is mounted to the housing 140.

Referring to FIG. 9 , the first position sensor 170 may include a Hallsensor 61 and a driver 62.

For example, the Hall sensor 61 may be made of silicon, and the outputVH of the Hall sensor 61 may increase as ambient temperature increases.For example, the ambient temperature may be temperature of the lensmoving apparatus, such as temperature of the circuit board 190,temperature of the Hall sensor 61, or temperature of the driver 62.

In another embodiment, the Hall sensor 61 may be made of GaAs, and theoutput VH of the Hall sensor 61 may have a gradient of about −0.06%/° C.to the ambient temperature.

The first position sensor 170 may further include a temperature sensingelement 63 capable of sensing ambient temperature. The temperaturesensing element 63 may output a temperature sensing signal Ts based onthe result of measuring temperature around the first position sensor 170to the driver 62.

For example, the Hall sensor 61 of the first position sensor 170 maygenerate output VH based on the result of sensing the intensity ofmagnetic force of the second magnet 180.

The driver 62 may output a driving signal dV for driving the Hall sensor61 and a driving signal Id1 for driving the first coil 120.

For example, the driver 62 may receive a clock signal SCL, a data signalSDA, and power signals VDD and GND from controllers 830 and 780 usingdata communication using a protocol, such as I2C communication.

The driver 62 may generate the driving signal dV for driving the Hallsensor 61 and the driving signal Id1 for driving the first coil 120using the clock signal SCL and the power signals VDD and GND.

The first position sensor 170 may include four terminals fortransmitting and receiving the clock signal SCL, the data signal SDA,and the power signals VDD and GND and two terminals for providing adriving signal to the first coil 120.

In addition, the driver 62 may receive the output VH of the Hall sensor61, and may transmit the clock signal SCL and the data signal SDA aboutthe output VH of the Hall sensor 61 to the controllers 830 and 780 usingdata communication using a protocol, such as I2C communication.

In addition, the driver 62 may receive the temperature sensing signal Tsmeasured by the temperature sensing element 63, and may transmit thetemperature sensing signal Ts to the controllers 830 and 780 using datacommunication using a protocol, such as I2C communication.

The controllers 830 and 780 may perform temperature compensation on theoutput VH of the Hall sensor 61 based on a change in ambient temperaturemeasured by the temperature sensing element 63 of the first positionsensor 170.

For example, when the driving signal dV or a bias signal of the Hallsensor 61 is 1 [mA], the output VH of the Hall sensor 61 of the firstposition sensor 170 may be −20 [mV] to +20 [mV].

In the case of temperature compensation on the output VH of the Hallsensor 61 having a negative gradient to a change in ambient temperature,the output VH of the Hall sensor 61 of the first position sensor 170 maybe 0 [mV] to +30 [mV].

When the output of the Hall sensor 61 of the first position sensor 170is shown using an xy coordinate system, the reason that the output rangeof the Hall sensor 61 of the first position sensor 170 is put in a firstquadrant (for example, 0 [mV] to +30 [mV]) is as follows.

Since the output of the Hall sensor 61 in the first quadrant and theoutput of the Hall sensor 61 in a third quadrant of the xy coordinatesystem move in opposite directions depending on a change in ambienttemperature, accuracy and reliability of the Hall sensor may be reducedin the case in which both the first and third quadrants are used as anAF driving control section. In order to accurately perform compensationbased on a change in ambient temperature, therefore, a predeterminedrange of the first quadrant may be used as an output range of the Hallsensor 61 of the first position sensor 170.

The first position sensor 170 may include first to third terminals forthe clock signal SCL and the two power signals VDD and GND, a fourthterminal for the data signal SDA, and fifth and sixth terminals forproviding a driving signal to the first coil 120.

Referring to FIGS. 5 and 7 , the first to sixth terminals of the firstposition sensor 170 may be connected to corresponding pads 1 to 6 of thecircuit board 190.

The circuit board 190 may include first to fourth pads 1 to 4 providedat the upper portion or the upper end of a second surface thereof andfifth and sixth pads 5 and 6 provided at the lower portion or the lowerend of a first surface of the circuit board 190. However, the disclosureis not limited thereto. The pads may be disposed on at least one of thefirst surface or the second surface of the circuit board 190 in variousforms.

In another embodiment, the first position sensor 170 may be realized asa position detection sensor, such as a Hall sensor, alone.

The circuit board 190 may include an upper end portion S1 and a lowerend portion S2 located under the upper end portion S1. The side surfaceof the upper end portion S1 may protrude from the side surface of thelower end portion S2. However, the disclosure is not limited thereto.

For example, the first to fourth pads may be disposed on a secondsurface of the upper end portion S1 so as to be spaced apart from eachother, and the fifth and sixth pads 5 and 6 may be disposed on a firstsurface of the lower end portion S2 so as to be spaced apart from eachother.

In order to avoid spatial interference with one end 164 a of a secondframe connection portion 163 of a lower spring 162-2 (FIG. 11 ) of thelower elastic member 160, a recess 8 a may be provided in the lowerportion or the lower end of the circuit board 190. For example, therecess 8 a may be disposed in the middle of the lower end portion S2 ofthe circuit board 190.

The circuit board 190 may include a circuit pattern or wiring (notshown) for interconnecting the first to sixth pads 1 to 6 and the firstto sixth terminals of the first position sensor 170.

For example, the circuit board 190 may be a printed circuit board or anFPCB.

The first to fourth pads 1 to 4 of the circuit board 190 may beconnected to terminals 251 of the circuit board 250 via upper springs150-1 to 150-4 and the supporting members 220-1 to 220-4, whereby thefirst position sensor 170 may be connected to the circuit board 250.

The fifth pad 5 and the sixth pad 6 of the circuit board 190 may becoupled to lower springs 160-1 and 160-2, and the first position sensor170 may be connected to the first coil 120 via the lower springs 160-1and 160-2.

For example, the fifth pad 5 of the circuit board 190 may be coupled tothe first lower springs 160-1, and the sixth pad 6 of the circuit board190 may be coupled to the second lower springs 160-2.

Next, the upper elastic member 150, the lower elastic member 160, andthe supporting member 220 will be described.

FIG. 10 is a plan view of the upper elastic member 150 shown in FIG. 1 ,FIG. 11 is a plan view of the lower elastic member 160 shown in FIG. 1 ,FIG. 12 is a coupled perspective view of the upper elastic member 150,the lower elastic member 160, the base 210, the supporting member 220,the second coil 230, and the circuit board 250 shown in FIG. 1 , FIG. 13is a separated perspective view of the second coil 230, the circuitboard 250, the base 210, and the second position sensor 240 shown inFIG. 1 , and FIG. 14 is a bottom perspective view of the housing 140,the first magnets 130-1 to 130-4, the lower elastic member 160, and thecircuit board 190 shown in FIG. 1 .

The upper elastic member 150 may be coupled to the upper portion of thebobbin 110 and to the upper portion of the housing 140 and may supportthe upper portion of the bobbin 110 and the upper portion of the housing140.

The lower elastic member 160 may be connected to the lower portion ofthe bobbin 110 and to the lower portion of the housing 140 in order tosupport the lower portion of the bobbin 110 and the lower portion of thehousing 140.

The upper elastic member 150 and the lower elastic member 160 mayelastically support the bobbin 110 relative to the housing 140.

The supporting member 220 may support the housing 140 such that thehousing is movable relative to the base 210 in a direction perpendicularto the optical axis, and may connect at least one of the upper or lowerelastic member 150 or 160 to the circuit board 250.

Referring to FIG. 10 , the upper elastic member 150 may include aplurality of upper springs 150-1 to 150-4 separated from each other.FIG. 10 shows four upper springs separated from each other; however, thedisclosure is not limited as to the number thereof. In addition, theupper springs may also be referred to as “upper elastic units.”

The upper elastic member 150 may include first to fourth upper springs150-1 to 150-4 directly bonded to first to fourth pads 191-1 to 191-4 ofthe circuit board 190 so as to be connected thereto.

A portion of each of the upper springs may be disposed at the first sideportion 141-1 of the housing 140 at which the circuit board 190 isdisposed, and at least one upper spring may be disposed at each of thesecond to fourth side portions 141-2 to 141-4, excluding the first sideportion 141-1.

Since the four pads 1 to 4 provided at the upper end portion 51 of thecircuit board 190 disposed at the first side portion 141-1 of thehousing 140 are directly connected to the four upper springs 150-1 to150-4, a portion of a first outer frame 152 of each of the four uppersprings 150-1 to 150-4 may be disposed at the first side portion 141-1of the housing 140.

Each of the upper springs 150-1 to 150-4 may be disposed at acorresponding one of the corners 142-1 to 142-4 of the housing 140, andmay have a corresponding one of extension portions P1 to P4 extending tothe first side portion 141-1 of the housing 140.

The extension portions P1 to P4 of the upper springs 150-1 to 150-4 maybe directly coupled to the four pads 1 to 4 provided at the upper endportion 51 of the circuit board 190 via a conductive adhesive member,such as solder.

The first upper spring 150-1 may be disposed at the first corner 142-1of the housing 140, the second upper spring 150-2 may be disposed at thesecond corner 142-2 of the housing 140, the third upper spring 150-3 maybe disposed at the third corner 142-3 of the housing 140, and the fourthupper spring 150-4 may be disposed at the fourth corner 142-4 of thehousing 140.

Each of the first to fourth upper springs 150-1 to 150-4 may include afirst outer frame coupled to the housing 140. For example, each of thefirst to fourth upper springs 150-1 to 150-4 may include a first outerframe coupled to a corresponding one of the first to fourth corners142-1 to 142-4 of the housing 140.

At least one of the first to fourth upper springs 150-1 to 150-4 mayfurther include a first inner frame 151 coupled to the bobbin 110 and afirst frame connection portion 153 for interconnecting the first innerframe and the first outer frame.

In FIG. 10 , each of the first to third upper springs 150-1 to 150-3includes only the first outer frame, but does not include the firstinner frame and the first frame connection portion. Only the fourthupper spring 150-4 includes the first inner frame 151, the first outerframe, and the first frame connection portion 153. However, thedisclosure is not limited thereto.

For example, a hole 151 a, to which the first coupling portion 113 ofthe bobbin 110 is coupled, may be provided in the first inner frame 151.However, the disclosure is not limited thereto.

Holes 152 a, to which the first coupling portions 143 and Q1 to Q4 ofthe housing 140 are coupled, may be provided in the first outer framesof the first to fourth upper elastic members 150-1 to 150-4.

The first outer frame of each of the first to fourth upper springs 150-1to 150-4 may include a first coupling portion 510 coupled to acorresponding one of the supporting members 220-1 to 220-4, a secondcoupling portion 520 coupled to a corresponding one of the corners ofthe housing 140, a connection portion 530 for interconnecting the firstcoupling portion 510 and the second coupling portion 520, and acorresponding one of extension portions P1 to P4 connected to the firstcoupling portion 510 and extending to the first side portion 141-1 ofthe housing 140.

For example, one end of the first supporting member 220-1 may be coupledto the first coupling portion 510 of the first upper spring 150-1, oneend of the second supporting member 220-2 may be coupled to the firstcoupling portion 510 of the second upper spring 150-2, one end of thethird supporting member 220-3 may be coupled to the first couplingportion 510 of the third upper spring 150-3, and one end of the fourthsupporting member 220-4 may be coupled to the first coupling portion 510of the fourth upper spring 150-4, via solder or a conductive adhesivemember.

The first coupling portion 510 may have a hole 52, through which each ofthe supporting members 220-1 to 220-4 extends. One end of each of thesupporting members 220-1 to 220-4 extending through the hole 52 may bedirectly coupled to the first coupling portion 510 via a conductiveadhesive member or solder 901 (see FIG. 12 ), and the first couplingportion 510 may be connected to each of the supporting members 220-1 to220-4.

For example, the first coupling portion 510 is a region in which thesolder 901 is disposed for coupling with each of the supporting members220-1 to 220-4, and may include a hole 52 and a region around the hole52.

The second coupling portion 520 may include at least one coupling region5 a and 5 b coupled to each of the corners 142-1 to 142-4 of the housing140.

For example, the coupling regions 5 a and 5 b of the second couplingportion 520 may include at least one hole 152 a coupled to the firstcoupling portions Q1 to Q4 of the housing 140.

In FIG. 10 , each of the coupling regions 5 a and 5 b of the secondcoupling portion 520 includes two holes 152 a, and four first couplingportions Q1 to Q4 corresponding to the holes of the coupling regions 5 aand 5 b are provided at each of the corners of the housing 140. However,the disclosure is not limited as to the number of holes 152 a and thenumber of first coupling portions. For example, each of the couplingregions 5 a and 5 b may have one or more holes, and one or more firstcoupling portions corresponding thereto may be provided in each of thecorners 142-1 to 142-4 of the housing 140.

For example, in order to support the housing 140 in a balanced state,the coupling regions 5 a and 5 b of the second coupling portions 520 ofthe first to fourth upper springs 150-1 to 150-4 may be symmetrical withrespect to reference lines 501 to 504. However, the disclosure is notlimited thereto.

In addition, the first coupling portions Q1 to Q4 of the housing 140 maybe symmetrical with respect to the reference lines 501 to 504, and twofirst coupling portions may be provided at each of both sides of eachreference line. However, the disclosure is not limited as to the numberthereof.

Each of the reference lines 501 to 504 may be a straight line passingthrough a central point 101 and a corresponding one of the corners 142-1to 142-4 of the housing 140. Here, the central point 101 may be thecenter of the housing 140, the center of the bobbin 110, or the centerof the upper elastic member 150. In addition, for example, the edges ofthe corners 142-1 to 142-4 of the housing 140 may be edges aligned withor corresponding to the middles of the corners of the housing 140.

In the embodiment of FIG. 10 , each of the coupling regions 5 a and 5 bof the second coupling portion 520 is realized so as to include a hole.However, the disclosure is not limited thereto. In another embodiment,the coupling regions may be realized in various forms sufficient to becoupled to the housing 140, such as recesses.

For example, the hole 152 a of the second coupling portion 520 may haveat least one cut portion (not shown), through which an adhesive memberpermeates a gap between the first coupling portion 143 of the housing140 and the hole 152 a.

The connection portion 530 may interconnect the first coupling portion510 and the coupling regions 52 a and 52 b of the second couplingportion 520.

For example, the connection portion 530 may include a first connectionportion 530 a for interconnecting the first coupling region 52 a of thesecond coupling portion 520 of each of the first to fourth upper springs150-1 to 150-4 and the first coupling portion 510 and a secondconnection portion 530 b for interconnecting the second coupling region52 b of the second coupling portion 520 and the first coupling portion510.

Each of the first and second connection portions 530 a and 530 b mayinclude a bent portion that is bent at least once or a curved portionthat is curved at least once. However, the disclosure is not limitedthereto. In another embodiment, each connection portion may be straight.

For example, the second coupling portion 510 may contact the uppersurface of each of the corners 142-1 to 142-4 of the housing 140, andmay be supported by each of the corners 142-1 to 142-4 of the housing140. For example, the connection portion 530 may not be supported by theupper surface of the housing 140, and may be spaced apart from thehousing 140. In addition, an empty space between the connection portion530 and the housing 140 may be filled with a damper (not shown) in orderto prevent oscillation due to vibration.

The width of each of the first and second connection portions 530 a and530 b may be smaller than the width of the second coupling portion 520,whereby the connection portion 530 may be easily moved in the firstdirection, and therefore stress applied to the upper springs 150-1 to150-4 and stress applied to the supporting members 220-1 to 220-4 may bedispersed.

Each of the extension portions P1 to P4 of the first outer frames of thefirst to fourth upper springs 150-1 to 150-4 may extend from the secondcoupling portion 520 toward a corresponding one of the first to fourthpads 1 to 4 of the circuit board 190 disposed at the first side portion141-1 of the housing 140.

One end of each of the extension portions P1 to P4 may be coupled to acorresponding one of the pads 1 to 4 of the circuit board 190 via solderor a conductive adhesive member.

In another embodiment, the extension portions of the first outer framesof the first to fourth upper springs may extend from the first couplingportion.

One end of each of the first and second extension portions P1 and P2 maybe bent inwardly from the outer surface of the first side portion 141-1of the housing 140 so as to be easily coupled to a corresponding one ofthe pads of the circuit board 190. However, the disclosure is notlimited thereto.

The first outer frame of the third upper spring 150-3 may furtherinclude an extension frame 154 connected between the second couplingportion 520 and the extension portion P3 and disposed at the fourth sideportion 141-4 and the fourth corner 142-4 of the housing 140. In orderto increase force of coupling with the housing 140 and thus to preventloosening of the third upper spring 150-3, the extension frame 154 mayhave a hole 152 a 1, to which a first coupling portion provided at thefourth corner 142-4, e.g. a protrusion, is coupled.

The first outer frame of the fourth upper spring 150-4 may furtherinclude first to fourth frames 155 a to 155 d disposed at the first tofourth side portions 141-1 to 141-4 of the housing 140, and each of thefirst to fourth frames 155 a to 155 d may have at least one hole, towhich the first coupling portion 143 of the housing 140 is coupled.

The third frame 155 c disposed at the third side portion 141-3 of thehousing may be connected to the second coupling portion 520 of thefourth upper spring 150-4, and may extend to the third side portion141-3 of the housing 140.

The fourth upper spring 150-4 may include four frame connection portions153, and each of the frame connection portions 153 may interconnect acorresponding one of the first to fourth frames 155 a to 155 d and thefirst inner frame 151.

The extension portion P4 of the fourth upper spring 150-4 may beconnected to the first frame 155 a disposed at the first side portion141-1 of the housing 140.

As described above, the first to fourth upper springs may includeextension portions P1 to P4 disposed on the first side portion 141-1 ofthe housing 140, and the upper springs 150-1 to 150-4 may be easilycoupled to the four pads 1 to 4 provided at the upper end portion S1 ofthe circuit board 190 via the extension portions P1 to P4.

Referring to FIG. 11 , the lower elastic member 160 may include aplurality of lower springs 160-1 and 160-2. The lower springs may alsobe referred to as “lower elastic units.”

For example, each of the first and second lower springs 160-1 and 160-2may include a second inner frame 161 coupled or fixed to the lowerportion, the lower surface, or the lower end of the bobbin 110, secondouter frames 162-1 to 162-3 coupled or fixed to the lower portion, thelower surface, or the lower end of the housing 140, and a second frameconnection portion 163 for interconnecting the second inner frame 161and the second outer frames 162-1 to 162-3.

The second inner frame 161 may be provided with a hole 161 a, to whichthe second coupling portion of the bobbin 110 is coupled, and each ofthe second outer frames 162-1 to 162-3 may be provided with a hole 162a, to which the second coupling portion 149 of the housing 140 iscoupled.

For example, each of the first and second lower springs 160-1 and 160-2may include three second outer frames and two second frame connectionportions. However, the disclosure is not limited thereto. In anotherembodiment, each of the first and second lower springs 160-1 and 160-2may include one or more second outer frames and one or more second frameconnection portions.

Each of the first and second lower springs 160-1 and 160-2 may includeconnection frames 164-1 and 164-2 for interconnecting the second outerframes 162-1 to 162-3.

The width of each of the connection frames 164-1 and 164-2 may besmaller than the width of each of the first inner frames. However, thedisclosure is not limited thereto.

The connection frames 164-1 and 164-2 may be located outside secondcoils 230-1 to 230-4 and the first magnets 130-1 to 130-4 based on theOIS coils 230-1 to 230-4 and the magnets 130-1 to 130-4 in order toavoid spatial interference with the second coils 230 and the firstmagnets 130-1 to 130-4. In this case, the outside of the second coils230-1 to 230-4 and the first magnets 130-1 to 130-4 may be opposite aregion in which the center of the bobbin 110 or the center of thehousing 140 is located based on the second coils 230-1 to 230-4 and thefirst magnets 130-1 to 130-4.

In addition, for example, the connection frames 164-1 and 164-2 may belocated so as not to overlap the second coils 230-1 to 230-4 and/or thefirst magnets 130-1 to 130-4 in the optical-axis direction. However, thedisclosure is not limited thereto. In another embodiment, at leastportions of the connection frames 164-1 and 164-2 may be aligned with oroverlap the second coils 230-1 to 230-4 and/or the first magnets 130-1to 130-4 in the optical-axis direction.

Each of the upper springs 150-1 to 150-4 and the lower springs 160-1 and160-2 may be realized as a leaf spring; however, the disclosure is notlimited thereto. Each of the upper springs and the lower springs may berealized as a coil spring or the like.

Next, the supporting members 220-1 to 220-4 will be described.

The supporting members 220-1 to 220-4 may be disposed so as tocorrespond to the corners 142-1 to 142-4 of the housing 140, and mayinterconnect the upper springs 150-1 to 150-4 and the circuit board 250.

The supporting members 220-1 to 220-4 may independently interconnect thefirst to fourth upper springs 150-1 to 150-4 and the circuit board 250.

The supporting members 220-1 to 220-4 may be spaced apart from thehousing 140, not fixed to the housing 140, and one end of each of thesupporting members 220-1 to 220-4 may be directly connected or coupledto the first coupling portion 510. In addition, the other end of each ofthe supporting members 220-1 to 220-4 may be directly connected orcoupled to the circuit board 250.

For example, each of the supporting members 220-1 to 220-4 may extendthrough the hole 147 formed in a corresponding one of the corners 142-1to 142-4 of the housing 140. However, the disclosure is not limitedthereto. In another embodiment, the supporting members may be disposedadjacent to boundary lines between the side portions 141-1 to 141-4 andthe corners 142 of the housing 140, and may not extend through thecorners 142-1 to 142-4 of the housing 140.

The first coil 120 may be directly connected or coupled to acorresponding one of the second inner frames of the first and secondlower springs 160-1 and 160-2.

The four pads 1 to 4 of the circuit board 190 may be connected to thecircuit board 250 via the four upper springs 150-1 to 150-4corresponding thereto and the supporting members 220-1 to 220-4connected to the upper springs 150-1 to 150-4.

In addition, each of the two pads 5 and 6 of the circuit board 190 maybe connected or coupled to the second outer frame 162-3 of acorresponding one of the first and second lower springs 160-1 and 160-2.

For example, the fifth and sixth pads 5 and 6 of the circuit board 190may be coupled to holes h1 and h2 provided in the second outer frames162-3 of the first and second lower springs 160-1 and 160-2 via solderor a conductive adhesive member.

The first position sensor 170 may transmit or receive signals GND, VDD,SCL, and SDA for data communication to or from the circuit board 250through the upper springs 150-1 to 150-4 and the supporting members220-1 to 220-4.

In addition, the first coil 120 may be connected to the first and secondlower springs 160-1 and 160-2, and the fifth and sixth pads 5 and 6 ofthe circuit board 190 may be directly connected to the first and secondlower springs 160-1 and 160-2, whereby the first position sensor 170 andthe first coil 120 may be connected to each other, and the firstposition sensor 170 may provide a driving signal to the first coil 120.

The supporting member 220 may be realized as an elastic supportingmember, such as a suspension wire, a leaf spring, or a coil spring.Also, in another embodiment, the supporting member 220 may be integrallyformed with the upper elastic member 150.

Next, the base 210, the circuit board 250, and the second coil 230 willbe described.

Referring to FIG. 13 , the base 210 may have an opening corresponding tothe opening of the bobbin 110 and/or the opening of the housing 140, andmay be configured in a shape coinciding with or corresponding to theshape of the cover member 300, such as a quadrangular shape.

The base 210 may be provided with a stair 211, which may be coated withan adhesive when fixing the cover member 300 by adhesion. In this case,the stair 211 may guide the side plate of the cover member 300 coupledto the upper side thereof, and the lower end of the side plate of thecover member 300 may contact the stair 211. The stair 211 of the base210 may be fixed to the lower end of the side plate of the cover member300 by adhesion using an adhesive.

A prop portion 255 may be provided at a region of the base 210 facingthe terminal 251 of the circuit board 250. The prop portion 255 maysupport a terminal surface 253 of the circuit board 250 at which theterminal 251 is formed.

The base 210 may be provided in the corners thereof corresponding to thecorners of the cover member 300 with concave recesses 212. In the casein which the corners of the cover member 300 protrude, protrusions ofthe cover member 300 may be fastened to the base 210 in the concaverecesses 212.

In addition, the base 210 may be provided in the upper surface thereofwith settlement recesses 215-1 and 215-2, in which the second positionsensor 240 is disposed. A settlement portion (not shown), at which afilter 610 of a camera module 200 is installed, may be formed in thelower surface of the base 210.

The second coil 230 may be disposed at the upper portion of the circuitboard 250, and OIS position sensors 240 a and 240 b may be disposed inthe settlement recesses 215-1 and 215-2 of the base 210 located underthe circuit board 250.

The second position sensor 240 may include first and second OIS positionsensors 240 a and 240 b, and the OIS position sensors 240 a and 240 bmay sense displacement of an OIS operation unit in a directionperpendicular to the optical axis. Here, the OIS operation unit mayinclude the AF operation unit and components mounted to the housing 140.

For example, the OIS operation unit may include the AF operation unitand the housing 140. In some embodiments, the magnets 130-1 to 130-4 maybe further included. For example, the AF operation unit may include thebobbin 110 and components mounted to the bobbin 110 so as to be movablewith the bobbin 110. For example, the AF operation unit may include thebobbin 110 and the lens (not shown) and the first coil 120 mounted tothe bobbin 110.

The circuit board 250 is disposed on the upper surface of the base 210,and may have an opening corresponding to the opening of the bobbin 110,the opening of the housing 140, and/or the opening of the base 210. Thecircuit board 250 may be configured in a shape coinciding with orcorresponding to the shape of the upper surface of the base 210, such asa quadrangular shape.

The circuit board 250 may be provided with at least one terminal surface253 which is bent from the upper surface thereof and at which aplurality of terminals 251 or pins for receiving electrical signals fromoutside is provided.

The second coil 230 is disposed at the upper portion of the circuitboard 250 so as to correspond to the first magnets 130-1 to 130-4disposed at the housing 140.

The second coil 230 may be disposed so as to be opposite or overlap thefirst magnets 130-1 to 130-4 disposed at the corners 142-1 to 142-4 ofthe housing 140 in the optical-axis direction.

For example, the second coil 230 may include four second coils 230-1 to230-4 disposed or formed at four corners of a quadrangular circuitmember 231.

For example, the second coil 230 may include two second coils 230-1 and230-3 for the second direction and two second coils 230-2 and 230-4 forthe third direction. However, the disclosure is not limited thereto. Inanother embodiment, the second coil 230 may include a single second coilfor the second direction and a single second coil for the thirddirection, or may include four or more second coils.

The housing 140 may be moved in the second and/or third direction, e.g.in the x-axis and/or y-axis direction, due to interaction between thefirst magnets 130-1 to 130-4 and the second coils 230-1 to 230-4,whereby handshake compensation may be performed.

In FIG. 13 , the second coils 230-1 to 230-4 may be provided at thecircuit member 231, rather than the circuit board 250. However, thedisclosure is not limited thereto. In another embodiment, each of thesecond coils 230-1 to 230-4 may be configured in the form of aring-shaped coil block or an FP coil. In a further embodiment, each ofthe second coils may be configured in the form of a circuit patternformed on the circuit board 250.

The circuit board 250 and the circuit member 231 are separatecomponents, which are referred to individually. However, the disclosureis not limited thereto. In another embodiment, the circuit board 250 andthe circuit member 231 may be commonly referred to as a “circuitmember.” In this case, the other end of each of the supporting membersmay be coupled to the “circuit member” (e.g. the lower surface of thecircuit member).

In order to avoid spatial interference with the supporting members 220-1to 220-4, recesses 23 may be provided in the corners of the circuitmember 231, and the supporting members may extend through the recesses23. In another embodiment, the circuit member may be provided with holesformed through the circuit member 231 instead of the recesses 23.

Each of the OIS position sensors 240 a and 240 b may be a Hall sensor.Any sensor may be used as long as the sensor is capable of sensing theintensity of a magnetic field. For example, each of the OIS positionsensors 240 a and 240 b may be configured in the form of a driverincluding a Hall sensor, or may be realized as a position detectionsensor, such as a Hall sensor, alone.

Terminals 251 may be provided at the terminal surface 253 of the circuitboard 250.

Signals SCL, SDA, VDD, and GND for data communication with the firstposition sensor 190 may be transmitted and received through a pluralityof terminals 251 installed at the terminal surface 253 of the circuitboard 250, driving signals may be supplied to the OIS position sensors240 a and 240 b, and signals output from the OIS position sensors 240 aand 240 b may be received and output to the outside.

According to the embodiment, the circuit board 250 may be an FPCB.However, the disclosure is not limited thereto. The terminals of thecircuit board 250 may be directly formed on the surface of the base 210using a surface electrode method or the like.

The circuit board 250 may include holes 250 a through which thesupporting members 220-1 to 220-4 extend. The position and number ofholes 250 a may correspond to or coincide with the position and numberof supporting members 220-1 to 220-4.

The supporting members 220-1 to 220-4 may extend through the holes 250 aof the circuit board 250 and may be connected to circuit patternsdisposed on the lower surface of the circuit board 250 throughsoldering. However, the disclosure is not limited thereto.

In another embodiment, the circuit board 250 may have no holes, and thesupporting members 220-1 to 220-4 may be connected to circuit patternsor pads formed on the upper surface of the circuit board 250 throughsoldering.

Alternatively, in another embodiment, the supporting members 220-1 to220-4 may be connected to the circuit member 231, and the circuit membermay be connected to the circuit board.

Since a driving signal is directly provided from the first positionsensor 170 to the first coil 120 in the embodiment, it is possible toreduce the number of supporting members and to simplify the connectionstructure, compared to the case in which a driving signal is directlyprovided to the first coil 120 through the circuit board 250.

In addition, since the first position sensor 170 may be realized as adriver IC capable of measuring temperature, the output of the Hallsensor may be compensated so as to have the minimum change depending ona change in temperature, or the output of the Hall sensor may becompensated so as to have a uniform gradient depending on a change intemperature, whereby it is possible to improve accuracy of AF drivingirrespective of a change in temperature.

FIG. 15 shows arrangement of the first magnets 130-1 to 130-4, thesecond and third magnets 180 and 185, the first position sensor 170, andthe circuit board 190.

Referring to FIG. 15 , the first position sensor 170 may be locatedbetween two magnets 130-1 and 130-2 disposed at two corners 142-1 and142-2 of the housing 140.

For example, at least one of the first position sensor 170 or thecircuit board 190 may be disposed between the first magnet 130-1disposed at the first corner 142-1 and the second magnet 130-2 disposedat the second corner 142-2.

In addition, the second magnet 180 may be disposed between the firstmagnet 130-1 disposed at the first corner 142-1 and the second magnet130-2 disposed at the second corner 142-4.

The second magnet 180 may overlap the first surface 11 a of each of thefirst and second magnets 130-1 and 130-2 in a direction parallel to thedirection from the first corner 142-1 to the second corner 142-2 of thehousing 140.

In addition, the third magnet 185 may be disposed between a secondmagnet 130-2 disposed at the second corner 142-2 and a third magnet130-3 disposed at the third corner 142-3.

The third magnet 185 may overlap the first surface 11 a of each of thethird and fourth magnets 130-3 and 130-4 in a direction parallel to thedirection from the third corner 143-1 to the fourth corner 142-4 of thehousing 140.

The first position sensor 170 may overlap the first magnet 130-1 and thesecond magnet 130-2 in a direction parallel to the direction from thefirst corner 142-1 to the second corner 142-2 of the housing 140, andmay not overlap the first and second magnets 130-1 and 130-2 in adirection perpendicular to the direction from the first corner 142-1 tothe second corner 142-2 of the housing 140.

For example, the first position sensor 170 may overlap a corner 51 a ofeach of the first and second magnets 130-1 and 130-2 in a directionparallel to the direction from the first corner 142-1 to the secondcorner 142-2 of the housing 140.

Since the transverse lengths L1 and L2 of the first magnets 130-1 and130-2 decrease in directions from the center of the housing 140 to thecorners 142-1 and 142-2 of the housing 140, magnetic field interferencebetween the second magnet 180 and the first magnets 130-1 and 130-2 maybe reduced.

Since magnetic field interference between the second magnet 180 and thefirst magnets 130-1 and 130-2 is alleviated in the embodiment, it ispossible to prevent a reduction in AF driving force due to magneticfield interference and thus to obtain desired AF driving force without aseparate yoke.

Since the transverse lengths of the first magnets 130-3 and 130-4decrease in directions from the center of the housing 140 to the corners142-3 and 142-4 of the housing 140, magnetic field interference betweenthe third magnet 185 and the first magnets 130-3 and 130-4 may bereduced.

In the embodiment, as described above, it is possible to reduce thenumber of supporting members and to reduce the size of the lens movingapparatus due to a reduction in the number of supporting members.

In addition, since the number of supporting members is reduced, it ispossible to reduce resistance of the supporting members, whereby it ispossible to reduce consumption of current and to improve sensitivity ofOIS driving.

In addition, it is possible to increase the thickness of the supportingmembers in order to obtain the same elastic force instead of reducingthe number of supporting members, and it is possible to reduce theinfluence of external impact on the OIS operation unit as the thicknessof the supporting members is increased.

In another embodiment, the first coil 120 may be connected to thecircuit board 190 via the lower springs, the supporting members, and theupper springs. For such connection, the upper elastic member may includesix upper springs, and the lower elastic member may include two lowersprings.

Six supporting members may be included. Two supporting members may bedisposed at each of two corners of the housing 140 so as to face eachother, and one supporting member may be disposed at each of the othertwo corners so as to face each other.

FIG. 16A is a conceptual view showing a connection relationship amongfirst outer frames of first to sixth upper springs 150-1′ to 150-6′, afirst coil 120, and a circuit board 190-1 according to anotherembodiment.

Referring to FIG. 16A, the circuit board 190-1 may be disposed at thefirst side portion 141-1 of the housing, and may include six pads 1 a to6 a. The six pads 1 a to 6 a may be disposed on at least one of a firstsurface or a second surface of the circuit board 190-1, and may belocated at an upper end portion S1 thereof.

For example, first outer frames 151-1 to 151-4 of the first to fourthupper springs 150-1′ to 150-4′ may be disposed at the first to fourthcorners 142-1 to 142-4 of the housing 140.

A first outer frame 151-5 of the fifth upper spring 150-5′ may bedisposed at one of the first to fourth corners 142-1 to 142-4, and afirst outer frame 151-6 of the sixth upper spring 150-6′ may be disposedat another of the first to fourth corners 142-1 to 142-4.

For example, the first outer frames 151-1 and 151-5 of the first andfifth upper springs 150-1′ and 150-5′ may be disposed at the firstcorner 142-1 of the housing 140 so as to be spaced apart from eachother, and the first outer frames 151-3 and 151-6 of the third and sixthupper springs 150-3′ and 150-6′ may be disposed at the third corner142-3 of the housing 140 so as to be spaced apart from each other.

The first outer frames 151-1 to 151-6 of the first to sixth uppersprings 150-1′ to 150-6′ may include first coupling portions coupled tosupporting members 220-1 to 220-6, second coupling portions coupled tothe corners of the housing 140, connection portions for interconnectingthe first coupling portions and the second coupling portions, andextension portions P11 to P16 extending from the first coupling portionstoward the pads 1 a to 6 a of the circuit board 190-1.

Although not shown in FIG. 16A, at least one of the first to sixth uppersprings 150-1′ to 150-6′ may include a first inner frame coupled to thebobbin 110 and a first frame connection portion for interconnecting thefirst inner frame and the first outer frame.

For direct coupling to the pads 1 a to 6 a of the circuit board 190-1,at least a portion of each of the first to sixth extension portions P11to P16 may be disposed at the first side portion 141-1 of the housing140 (for example, the upper portion, the upper surface, or the upper endof the first side portion 141-1).

One end of each of the first to fourth supporting members 220-1 to 220-4may be coupled to the first coupling portion of a corresponding one ofthe first outer frames 151-1 to 151-4 of the first to fourth uppersprings 150-1′ to 150-4′. The other end of each of the first to fourthsupporting members 220-1 to 220-4 may be coupled to the circuit board250, and may be connected to a corresponding one of the terminals of thecircuit board 250.

One end of each of the fifth and sixth supporting members 220-5 and220-6 may be coupled to the first coupling portion of a correspondingone of the first outer frames 151-5 and 151-6 of the fifth and sixthupper springs 150-5′ and 150-6′. The other end of each of the fifth andsixth supporting members 220-5 and to 220-6 may be coupled to the secondouter frame of a corresponding one of the first and second lowersprings.

The first coil 120 may be coupled to the second inner frames of thefirst and second lower springs, and may be connected thereto.Consequently, the first coil 120 may be connected to the first andsecond lower springs, to the fifth and sixth supporting members 220-5and 220-6 connected thereto, and to the fifth and sixth upper springs150-5′ and 150-6′, and the first coil 120 may be connected to the pads 5a and 6 a of the circuit board 190-1 via the extension portions P15 andP16.

FIG. 16B is a conceptual view showing a connection relationship amongfirst outer frames of first to sixth upper springs 150-1″ to 150-6″, afirst coil 120, and a circuit board 190-2 according to anotherembodiment.

Referring to FIG. 16B, a first position sensor 170-1 may be realized asa position detection sensor, such as a Hall sensor including no driver,alone. The circuit board 190-1 may be disposed at the first side portion141-1 of the housing 140, and may include four pads 1 b to 4 b.

The upper elastic member 150 may include first to sixth upper springs150-1″ to 150-6″.

The first to fourth upper springs 150-1″ to 150-4″ may include firstouter frames 151-1″ to 151-4″ disposed at the corners 142-1 to 142-4 ofthe housing 140, and the fifth and sixth upper springs 150-5″ and 150-6″may include first outer frames 151-5″ and 151-6″ disposed at the firstand third corners 142-1 and 142-3 of the housing 140.

The first upper springs 150-1″, the third upper springs 150-3″, thefifth upper springs 150-5″, and the sixth upper springs 150-6″ mayinclude extension portions P21 to P24 extending from the first outerframes 151-1″, 151-3″, 151-5″, and 151-6″ to the pads 1 b to 4 b of thecircuit board 190-2. Each of the extension portions P21 to P24 may becoupled to a corresponding one of the pads 1 b to 4 b.

The supporting member 220 may include eight supporting members 220-1″,220-2 a, 220-2 b, 220-3″, 220-4 a, 220-4 b, 220-5″, and 220-6″.

Two supporting members may be disposed at each of the corners 142-1 to142-4 of the housing 140.

Each of the four supporting members 220-1″, 220-3″, 220-5″, and 220-6″may connect a corresponding one of the first upper springs 150-1″, thethird upper springs 150-3″, the fifth upper springs 150-5″, and thesixth upper springs 150-6″ to the circuit board 250, and the firstposition sensor 170-1 and the circuit board 250 may be connected to eachother.

One end of each of the two supporting members 220-2 a and 220-2 b may beconnected to the first outer frame 151-2″ of the second upper springs150-2″. For example, the first outer frame 151-2″ of the second uppersprings 150-2″ may include two first coupling portions, and one end ofeach of the two supporting members 220-2 a and 220-2 b may be coupled toa corresponding one of the first coupling portions of the first outerframe 151-2″.

One end of each of the two supporting members 220-4 a and 220-4 b may beconnected to the first outer frame 151-4″ of the fourth upper springs150-4″. For example, the first outer frame 151-4″ of the fourth uppersprings 150-4″ may include two first coupling portions, and one end ofeach of the two supporting members 220-4 a and 220-4 b may be may becoupled to a corresponding one of the first coupling portions of thefirst outer frame 151-4″.

In addition, the first coil 120 may be connected to two lower springs160-1 and 160-2. The other end of the supporting member 220-2 a may beconnected to a second outer frame of the first lower spring 160-1, andthe other end of the supporting member 220-2 b may be connected to thecircuit board 250 and may be connected to a corresponding one of theterminals of the circuit board.

The other end of the supporting member 220-4 a may be connected to asecond outer frame of the second lower spring 160-2, and the other endof the supporting member 220-4 b may be connected to the circuit board250 and may be connected to a corresponding one of the terminals of thecircuit board 250.

That is, the first coil 120 may be connected to the circuit board 250via the supporting members 220-2 a, 220-2 b, 220-4 a, and 220-4 b andthe upper springs 150-2″ and 150-4″, and may directly receive a drivingsignal from the circuit board 250.

FIG. 17 is an exploded perspective view of a lens moving apparatus 1100according to another embodiment, and FIG. 18 is an assembled perspectiveview of the lens moving apparatus 1100 of FIG. 17 with a cover member1300 removed.

Referring to FIGS. 17 and 18 , the lens moving apparatus 1100 includes abobbin 1110, a first coil 1120, a first magnet 1130, a housing 1140, anupper elastic member 1150, a lower elastic member 1160, a first positionsensor 1170, a circuit board 1190, and a second magnet 1180.

In order to perform a handshake compensation function, the lens movingapparatus 1100 may further include a supporting member 1220, a secondcoil 1230, and a second position sensor 1240.

In addition, the lens moving apparatus 1100 may further include a thirdmagnet 1185, a base 1210, a circuit board 1250, and a cover member 1300.

In addition, the lens moving apparatus 1100 may further include acapacitor 1195 mounted to the circuit board 1190.

Hereinafter, the “coil” may also be referred to as a coil unit, and the“elastic member” may also be referred to as an elastic unit or a spring.

The bobbin 1110 is disposed inside the housing 1140, and may be moved inthe optical-axis (OA) direction or the first direction (e.g. the Z-axisdirection) as the result of electromagnetic interaction between thefirst coil 1120 and the first magnet 1130.

FIG. 19A is a perspective view of the bobbin 1110, the second magnet1180, and the third magnet 1185 shown in FIG. 17 , and FIG. 19B showsthe first coil 1120 coupled to the bobbin 1110. In another embodiment,the description of the bobbin 1110, the second magnet 1180, the thirdmagnet 1185, and the first coil 1120 may be applied to the bobbin 110,the second magnet 180, the third magnet 185, and the first coil 120 ofFIG. 1 , and vice versa.

Referring to FIGS. 19A and 19B, the bobbin 1110 may have an opening, inwhich a lens or a lens barrel is mounted. For example, the opening ofthe bobbin 1110 may be a through hole formed through the bobbin 1110 inthe optical-axis direction, and the shape of the opening of the bobbin1110 may be circular, oval, or polygonal. However, the disclosure is notlimited thereto.

The lens may be directly mounted in the opening of the bobbin 1110.However, the disclosure is not limited thereto. In another embodiment, alens barrel, in which at least one lens is mounted or coupled, may becoupled or mounted in the opening of the bobbin 1110. The lens or thelens barrel may be coupled to the inner circumferential surface of thebobbin 1110 in various manners.

The bobbin 1110 may include first side portions 1110 b-1 spaced apartfrom each other and second side portions 1110 b-2 spaced apart from eachother. Each of the second side portions 1110 b-2 may interconnect twoadjacent first side portions. For example, the horizontal length or thetransverse length of each of the first side portions 1110 b-1 of thebobbin 1110 may be different from the horizontal length or thetransverse length of each of the second side portions 1110 b-2 thereof.

The bobbin 1110 may be provided at the outer surface thereof with aprotrusion 1115. For example, the protrusion 1115 may be disposed at theouter surface of each of the second side portions 1110 b-2 of the bobbin1110. However, the disclosure is not limited thereto. The protrusion1115 may protrude in a direction parallel to a straight line that passesthrough the center of the opening of the bobbin 1110 and isperpendicular to the optical axis. However, the disclosure is notlimited thereto.

The protrusion 1115 of the bobbin 1110 may correspond to a recess 1025 aof the housing 1140, may be inserted into or disposed in the recess 1025a of the housing 1140, and may inhibit or prevent the bobbin 1110 frombeing rotated about the optical axis while deviating from apredetermined range.

In addition, the protrusion 115 may serve as a stopper for inhibitingand preventing the lower surface of the bobbin 1110 from directlycolliding with the base 1210, the second coil 1230, or the circuit board1250 even when the bobbin 1110 is moved in the optical-axis direction(e.g. the direction from the upper elastic member 1150 to the lowerelastic member 1160) while deviating from the predetermined range due toexternal impact.

A first escape recess 1112 a for avoiding spatial interference with afirst frame connection portion 1153 of the upper elastic member 1150 maybe provided in the upper surface of the bobbin 1110. For example, thefirst escape recess 1112 a may be disposed at each of the second sideportions 1110 b-2 of the bobbin 1110. However, the disclosure is notlimited thereto.

The bobbin 1110 may be provided at the upper surface thereof with aguide portion 1111 for guiding the installation position of the upperelastic member 1150. For example, as shown in FIG. 19A, the guideportion 1111 of the bobbin 1110 may be disposed in the first escaperecess 1112 a in order to guide a path along which the frame connectionportion 1153 of the upper elastic member 1150 extends. For example, theguide portion 1111 may protrude from the bottom surface of the firstescape recess 1112 a in the optical-axis direction.

The bobbin 1110 may include a stopper 1116 protruding from the uppersurface thereof.

The stopper 1116 of the bobbin 1110 may serve to prevent the uppersurface of the bobbin 1110 from directly colliding with the inside of anupper plate of the cover member 1300 even in the case in which thebobbin 1110 is moved while deviating from the predetermined range due toexternal impact when the bobbin 1110 is moved in the first direction inorder to perform an autofocus function.

The bobbin 1110 may include a first coupling portion 1113, which iscoupled and fixed to the upper elastic member 1150. For example, in FIG.19A, the first coupling portion 1113 of the bobbin 1110 is a protrusion.However, the disclosure is not limited thereto. In another embodiment,the first coupling portion of the bobbin 1110 may be a recess or aplane.

In addition, the bobbin 1110 may include a second coupling portion 1117,which is coupled and fixed to the lower elastic member 1160. In FIG.19B, the second coupling portion 1117 of the bobbin 1110 is aprotrusion. However, the disclosure is not limited thereto. In anotherembodiment, the second coupling portion of the bobbin 1110 may be arecess or a plane.

A settlement recess 1105, in which the first coil 1120 is settled,inserted, or disposed, may be provided in the outer surface of thebobbin 1110. The settlement recess 1105 may be a recess formed inwardlyfrom the outer surface of each of the first and second side portions1110 b-1 and 1110 b-2 of the bobbin 1110, and may have a shapecoinciding with the shape of the first coil 1120 or a closed-loop shape(e.g. a ring shape).

In addition, guide recesses 1116 a and 1116 b may be provided in thelower surfaces of two first side portions 1110 b-1 or two second sideportions 1110 b-2 of the bobbin 1110 located so as to be opposite eachother in order to inhibit separation of the coil 1120 and to guide bothends of the coil 1120 when the coil is connected to lower elasticmembers 1160-1 and 1160-2.

In addition, a settlement recess 1180 a, in which the second magnet 1180is settled, inserted, fixed, or disposed, may be provided in the outersurface of the bobbin 1110.

The settlement recess 1180 a of the bobbin 1110 may have a structurerecessed from the outer surface of the bobbin 1110, and may have anopening formed in at least one of the upper surface or the lower surfaceof the bobbin 1110. However, the disclosure is not limited thereto.

In addition, a settlement recess 1185 a, in which the third magnet 1185is settled, inserted, fixed, or disposed, may be provided in the outersurface of the bobbin 1110.

The settlement recess 1185 a of the bobbin 1110 may have a structurerecessed from the outer surface of the bobbin 1110, and may have anopening formed in at least one of the upper surface or the lower surfaceof the bobbin 1110. However, the disclosure is not limited thereto.

Each of the settlement recesses 1180 a and 1185 a of the bobbin 1110 maybe located at the upper side of the settlement recess 1105, in which thefirst coil 1120 is disposed, and may be connected to or may abut thesettlement recess 1105. However, the disclosure is not limited thereto.In another embodiment, both may be spaced apart from each other.

The settlement recess 1180 a of the bobbin 1110 may be provided at oneof the first side portions 1110 b-1 of the bobbin 1110, and thesettlement recess 1185 a of the bobbin 1110 may be provided at anotherof the first side portions 1110 b-1 of the bobbin 1110.

For example, the settlement recesses 1180 a and 1185 a may be disposedat two facing first side portions or two opposite first side portions.

Since the second magnet 1180 and the third magnet 1185 are disposed inthe settlement recesses 1180 a and 1185 a provided in two first sideportions of the bobbin 1110 located so as to be opposite each other, thesecond magnet 1180 and the third magnet 1185 may be balanced in weight,influence on AF driving force due to magnetic field interference betweenthe first magnet 1130 and the second magnet 1180 and influence on AFdriving force due to magnetic field interference between the firstmagnet 1130 and the third magnet 1185 may be offset, whereby accuracy inautofocus (AF) driving may be improved in the embodiment.

A screw thread 1011 for coupling with the lens or the lens barrel may beprovided in the inner circumferential surface of the bobbin 1110. Thescrew thread 1011 may be formed in the inner circumferential surface ofthe bobbin 1110 in the state in which the bobbin 1110 is fixed using ajig. Jig fixing recesses 1015 a and 1015 b may be provided in the uppersurface of the bobbin 1110. For example, the jig fixing recesses 1015 aand 1015 b may be provided in the upper surfaces of two first sideportions 1110 b-1 or two second side portions 1110 b-2 of the bobbin1110 located so as to be opposite each other. However, the disclosure isnot limited thereto. The jig fixing recesses 1015 a and 1015 b may alsoperform the function of a foreign matter collection unit for collectingforeign matter.

The first coil 1120 is disposed on the outer surface of the bobbin 1110.

The first coil 1120 may be disposed under the second and third magnets1180 and 1185. However, the disclosure is not limited thereto. Forexample, the first coil 1120 may be disposed under the protrusion 1115of the bobbin 1110. However, the disclosure is not limited thereto.

For example, the first coil 1120 may not overlap the second and thirdmagnets 1180 and 1185 in a direction perpendicular to the optical axis.However, the disclosure is not limited thereto.

For example, the first coil 1120 may be disposed in the settlementrecess 1105 of the bobbin 1110, the second magnet 1180 may be insertedinto or disposed in the settlement recess 1180 a of the bobbin 1110, andthe third magnet 1185 may be inserted into or disposed in the settlementrecess 1185 a of the bobbin 1110.

Each of the second magnet 1180 and the third magnet 1185 disposed at thebobbin 1110 may be spaced apart from the first coil 1120 in theoptical-axis (OA) direction. However, the disclosure is not limitedthereto. In another embodiment, each of the second magnet 1180 and thethird magnet 1185 disposed at the bobbin 1110 may abut the first coil1120, or may overlap the first coil 1120 in a direction perpendicular tothe optical axis.

The first coil 1120 may wrap the outer surface of the bobbin 1110 in adirection that rotates about the optical axis OA.

The first coil 1120 may be directly wound around the outer surface ofthe bobbin 1110. However, the disclosure is not limited thereto. Inanother embodiment, the first coil 1120 may be wound around the bobbin1110 using a coil ring, or may be configured as an angular ring-shapedcoil block.

A power or driving signal may be provided to the first coil 1120. Thepower or driving signal provided to the first coil 1120 may be adirect-current signal or an alternating-current signal, or may includethe direct-current signal and the alternating-current signal, and mayhave the form of voltage or current.

When a driving signal (e.g. driving current) is supplied to the firstcoil 1120, electromagnetic force may be formed through electromagneticinteraction between the first coil and the first magnet 1130, and thebobbin 1110 may be moved in the optical-axis (OA) direction by theformed electromagnetic force.

At an initial position of an AF operation unit, the bobbin 1110 may bemoved in an upward or downward direction, which is referred to asbidirectional driving of the AF operation unit. Alternatively, at theinitial position of the AF operation unit, the bobbin 1110 may be movedin the upward direction, which is referred to as unidirectional drivingof the AF operation unit.

At the initial position of the AF operation unit, the first coil 1120may be disposed so as to correspond to or overlap the first magnet 1130disposed at the housing 1140 the first magnet in a directionperpendicular to the optical axis OA and parallel to a straight linepassing through the optical axis.

For example, the AF operation unit may include the bobbin 1110 andcomponents coupled to the bobbin 1110 (e.g. the first coil 1120 and thesecond and third magnets 1180 and 1185).

The initial position of the AF operation unit may be the originalposition of the AF operation unit in the state in which no power isapplied to the first coil 1120 or the position at which the AF operationunit is located as the result of the upper and lower elastic members1150 and 1160 being elastically deformed due only to the weight of theAF operation unit.

In addition, the initial position of the bobbin 1110 may be the positionat which the AF operation unit is located when gravity acts in thedirection from the bobbin 1110 to the base 1210 or when gravity acts inthe direction from the base 1210 to the bobbin 1110.

The second magnet 1180 may also be referred to as a “sensing magnet” inthat the second magnet provides a magnetic field that is sensed by thefirst position sensor 1170, and the third magnet 1185 may also bereferred to as a “balancing magnet” in that the third magnet offsets theeffect of a magnetic field of the sensing magnet 1180 and is providedfor balancing in weight with the sensing magnet 1180.

The second magnet 1180 may be disposed in the settlement recess 1180 aof the bobbin 1110, and may be disposed so as to face the first positionsensor 1170.

A portion of one surface of the second magnet 1180 facing the firstposition sensor 1170 may be exposed from the settlement recess 1180 a.However, the disclosure is not limited thereto. In another embodiment, aportion of one surface of the second magnet 1180 facing the firstposition sensor 1170 may not be exposed from the settlement recess 1180a.

For example, the interface between an N pole and an S pole of each ofthe second and third magnets 1180 and 1185 disposed at the bobbin 1110may be parallel to a direction perpendicular to the optical axis OA. Forexample, the surfaces of the second and third magnets 1180 and 1185facing the first position sensor 1170 may have an N pole and an S pole,respectively. However, the disclosure is not limited thereto.

For example, in another embodiment, the interface between the N pole andthe S pole of each of the second and third magnets 1180 and 1185disposed at the bobbin 1110 may be parallel to the optical axis OA.

For example, each of the second and third magnets 1180 and 1185 may be amonopolar magnetized magnet having a single N pole and a single S pole.However, the disclosure is not limited thereto. In another embodiment,each of the second and third magnets 1180 and 1185 may be a bipolarmagnetized magnet or a four-polar magnet having two N poles and two Spoles.

Each of the second and third magnets 1180 and 1185 may include a firstmagnet portion 1017 a, a second magnet portion 1017 b, and a partition1017 c disposed between the first magnet portion 1017 a and the secondmagnet portion 1017 b. Here, the partition 1017 c may also be referredto as a “nonmagnetic partition.”

The first magnet portion 1017 a may include an N pole, an S pole, and afirst border portion between the N pole and the S pole. The first borderportion may be a portion having substantially no magnetism, may includea section having little polarity, and may be a portion that is naturallygenerated in order to form a magnet including a single N pole and asingle S pole.

The second magnet portion 1017 b may include an N pole, an S pole, and asecond border portion between the N pole and the S pole. The secondborder portion may be a portion having substantially no magnetism, mayinclude a section having little polarity, and may be a portion that isnaturally generated in order to form a magnet including a single N poleand a single S pole.

The partition 1017 c may be a portion that separates or isolates thefirst magnet portion 1017 a and the second magnet portion 1017 b, may bea portion having substantially no magnetism, and may be a portion havinglittle polarity. For example, the partition may be a nonmagneticmaterial or air. The nonmagnetic partition may also be referred to as a“neutral zone.”

The partition 1017 c is a portion that is artificially formed when thefirst magnet portion 1017 a and the second magnet portion 1017 b aremagnetized, and the width of the partition 1017 c may be larger than thewidth of the first border portion (or the width of the second borderportion). Here, the width of the partition 1017 c may be the length ofthe partition in the direction from the first magnet portion 1017 a tothe second magnet portion 1017 b. The width of the first border portion(or the width of the second border portion) may be the length of thefirst border portion in the direction from the N pole to the S pole ofeach of the first and second magnet portions 1017 a and 1017 b.

The second magnet 1180 may be moved together with the bobbin 1110 in theoptical-axis direction, and the first position sensor 1170 may sense theintensity of a magnetic field or magnetic force of the second magnet1180 moved in the optical-axis direction, and may output an outputsignal based on the result of sensing.

For example, the intensity of the magnetic field or the magnetic forcesensed by the first position sensor 1170 may vary depending on thedisplacement of the bobbin 1110 in the optical-axis direction, the firstposition sensor 1170 may output an output signal proportional to thesensed intensity of the magnetic field, and the displacement of thebobbin 1110 in the optical-axis direction may be sensed using the outputsignal of the first position sensor 1170.

The housing 1140 receives the bobbin 1110 therein, and supports thefirst magnet 1130, the first position sensor 1170, and the circuit board1190.

FIG. 20A is a perspective view of the housing 1140, the circuit board1190, the first position sensor 1170, and the capacitor 1195 shown inFIG. 17 , and FIG. 20B is a coupled perspective view of the housing1140, the first magnet 1130, the circuit board 1190, the first positionsensor 1170, and the capacitor 1195. In another embodiment, thedescription of the housing 1140, the circuit board 1190, the firstposition sensor 1170, and the capacitor 1195 may be applied to thehousing 140, the circuit board 190, the first position sensor 170, and acapacitor of FIG. 1 , and vice versa.

Referring to FIGS. 20A and 20B, the housing 1140 may generally have ahollow pillar shape. For example, the housing 1140 may have a polygonal(e.g. quadrangular or octagonal) or circular opening, and an opening ofthe housing 1140 may be a through hole formed through the housing 1140in the optical-axis direction.

The housing 1140 may include a plurality of side portions 1141-1 to1141-4 and a plurality of corners 1142-1 to 1142-4.

For example, the housing 1140 may include first to fourth side portions1141-1 to 1141-4 spaced apart from each other and first to fourthcorners 1142-1 to 1142-4 spaced apart from each other.

Each of the corners 1142-1 to 1142-4 of the housing 1140 may be disposedor located between two adjacent side portions 1141-1 and 1141-2, 1141-2and 1141-3, 1141-3 and 1141-4, or 1141-4 and 1141-1, and mayinterconnect the side portions 1141-1 to 1141-4.

For example, the corners 1142-1 to 1142-4 may be located at the cornerportions of the housing 1140. For example, the number of side portionsof the housing 1140 may be four, and the number of corners thereof maybe four. However, the disclosure is not limited thereto. The number ofside portions may be five or more, and the number of corners may be fiveor more.

Each of the side portions 1141-1 to 1141-4 of the housing 1140 may bedisposed parallel to a corresponding one of the side plates of the covermember 1300.

For example, the side portions 1141-1 to 1141-4 of the housing 1140 maycorrespond to the first side portions 1110 b-1 of the bobbin 1110, andthe corners 1142-1 to 1142-4 of the housing 1140 may correspond to ormay be opposite the second side portions 1110 b-2 of the bobbin 1110.

The first magnet 1130 may be disposed or installed at each of thecorners 1142-1 to 1142-4 of the housing 1140.

For example, a settlement portion 1141 a or a receiving portion forreceiving the magnet 1130 may be provided in each of the corner portionsor the corners 1142-1 to 1142-4 of the housing 1140.

The settlement portion 1141 a of the housing 1140 may be provided in thelower portion or the lower end of at least one of the corners 1142-1 to1142-4 of the housing 1140.

For example, the settlement portion 1141 a of the housing 1140 may beprovided inside the lower portion or the lower end of each of the fourcorners 1142-1 to 1142-4.

The settlement portion 1141 a of the housing 1140 may be a recess havinga shape corresponding to the first magnet 1130, e.g. a concave recess.However, the disclosure is not limited thereto.

For example, a first opening may be formed in the side surface of thesettlement portion 1141 a of the housing 1140 facing the first coil1120, and a second opening may be formed in the lower surface of thesettlement portion 1141 a of the housing 1140 facing the second coil1230, for easy mounting of the first magnet 1130.

For example, a first surface 1011 a of the first magnet 1130 fixed ordisposed in the settlement portion 1141 a of the housing 1140 may beexposed through the first opening of the settlement portion 1141 a. Inaddition, a lower surface 1011 c of the first magnet 1130 fixed ordisposed in the settlement portion 1141 a of the housing 1140 may beexposed through the second opening of the settlement portion 1141 a.

The housing 1140 may have an escape recess 1041 provided in the uppersurface of each of the corners in order to avoid spatial interferencewith the first frame connection portion 1153 of the upper elastic member1150.

For example, the escape recess 1041 of the housing 1140 may be depressedfrom the upper surface of the housing 1140, and may be located so as tobe closer to the center of the housing 1140 than a stopper 1145 or anadhesive injection hole 1147. For example, the escape recess 1041 may belocated inside the stopper 1145 of the housing 1140, which is adirection toward the center of the housing 1140, and adhesive injectionholes 1146 a and 1146 b may be located outside the stopper, which is theopposite direction.

A recess 1025 a may be provided in each of the corners 1142-1 to 1142-4of the housing 1140 so as to correspond to or to be opposite theprotrusion 1115 of the bobbin 1110. The recess 1025 a of the housing1140 may be located on the settlement portion 1141 a of the housing1140. For example, the recess 1025 a of the housing 1140 may be formedat the bottom surface of the escape recess 1041. For example, the bottomsurface of the recess 1025 a may be located lower than the bottomsurface of the escape recess 1041. The settlement portion 1141 a of thehousing 1140 may be located lower than the bottom surface of the escaperecess 1041.

The first magnet 1130 may be fixed to the settlement portion 1141 ausing an adhesive. However, the disclosure is not limited thereto.

For example, at least one adhesive injection hole 1146 a and 1146 b forinjecting an adhesive may be provided in each of the corners 1142-1 to1142-4 of the housing 1140. The at least one adhesive injection hole1146 a and 1146 b may be depressed from the upper surface of each of thecorners 1142-1 to 1142-4.

The at least one adhesive injection hole 1146 a and 1146 b may include athrough hole formed through each of the corners 1142-1 to 1142-4, andthe adhesive injection holes 1146 a and 1146 b may be connected to ormay communicate with the settlement portion 1141 a of the housing 1140and may expose at least a portion of the first magnet 1130 (for example,a portion of the upper surface of the magnet 1130). The adhesiveinjection holes 1146 a and 1146 b may expose at least a portion of thefirst magnet 1130 (for example, a portion of the upper surface of themagnet 1130), whereby the adhesive may be sufficiently coated on thefirst magnet 1130 and thus force of fixing between the first magnet 1130and the housing 1140 may be increased.

The housing 1140 may be provided with at least one stopper 1147 aprotruding from the outer surfaces of the side portions 1141-1 to1141-4. The at least one stopper 1147 a may prevent the housing 1140from colliding with the side plate of the cover member 1300 when movedin a direction perpendicular to the optical axis.

In order to prevent the lower surface of the housing 1140 from collidingwith the base 1210 and/or the circuit board 1250, the housing 1140 maybe further provided with a stopper (not shown) protruding from the lowersurface thereof.

The housing 1140 may have a mounting recess 1014 a (or a settlementrecess) for receiving the circuit board 1190, a mounting recess 1014 b(or a settlement recess) for receiving the first position sensor 1170,and a mounting recess 1014 c (or a settlement recess) for receiving thecapacitor 1195.

The mounting recess 1014 a of the housing 1140 may be provided in theupper portion or the upper end of one of the side portions 1141-1 to1141-4 of the housing 1140 (for example, 1141-1).

The mounting recess 1014 a of the housing 1140 may be a recess, theupper portion of which is open and which has a side surface and abottom, for easy mounting of the circuit board 1190, and may have anopening formed toward the inside of the housing 1140. The shape of themounting recess 1014 a of the housing 1140 may correspond to or coincidewith the shape of the circuit board 1190.

The mounting recess 1014 b of the housing 1140 may be provided in theinner surface of the first side portion 1141-1 of the housing 1140, andmay be connected to the mounting recess 1014 a.

The mounting recess 1014 c of the housing 1140 may be disposed at oneside of the mounting recess 1014 b, and a protrusion or a projection forseparating or isolating the capacitor 1195 and the first position sensor1170 from each other may be provided between the mounting recess 1014 band the mounting recess 1014 c. The reason for this is that thecapacitor 1195 and the first position sensor 1170 are located adjacentto each other in order to reduce the length of a path for connectiontherebetween, thereby reducing noise due to an increase in length of thepath.

The capacitor 1195 may be disposed or mounted on a second surface 1019 aof the circuit board 1190.

The capacitor 1195 may have the form of a chip. In this case, the chipmay include a first terminal corresponding to one end of the capacitor1195 and a second terminal corresponding to the other end of thecapacitor 1195. The capacitor 1195 may also be referred to as a“capacitive element” or a condenser.

In another embodiment, the capacitor may be realized so as to beincluded in the circuit board 1190. For example, the circuit board 1190may have a capacitor including a first conductive layer, a secondconductive layer, and an insulating layer (for example, a dielectriclayer) disposed between the first conductive layer and the secondconductive layer.

The capacitor 1195 may be connected in parallel to first and secondterminals B1 and B2 of the circuit board 1190 for providing power (or adriving signal) to the position sensor 1170 from the outside.

Alternatively, the capacitor 1195 may be connected in parallel toterminals of the first position sensor 1170 connected to the first andsecond terminals B1 and B2 of the circuit board 1190.

For example, one end of the capacitor 1195 (or the first terminal of thecapacitor chip) may be connected to the first terminal B1 of the circuitboard 1190, and the other end of the capacitor 1195 (or the secondterminal of the capacitor chip) may be connected to the second terminalB2 of the circuit board 1190.

Since the capacitor 1195 is connected in parallel to the first andsecond terminals B1 and B2 of the circuit board 1190, the capacitor mayserve as a smoothing circuit for removing a ripple component from powersignals GND and VDD provided to the first position sensor 1170 from theoutside, whereby a stable and uniform power signal may be provided tothe first position sensor 1170.

Since the capacitor 1195 is connected in parallel to the first andsecond terminals B1 and B2 of the circuit board 1190, the capacitor mayprotect the first position sensor 1170 from high-frequency noise or ESDintroduced from the outside.

In addition, the capacitor 1195 may prevent overcurrent caused byhigh-frequency noise or ESD introduced from the outside from beingapplied to the first position sensor 1170, and may prevent a phenomenonin which a value of calibration about displacement of the bobbin 1110acquired based on an output signal of the first position sensor 1170 isreset due to the overcurrent.

In addition, the mounting recess 1014 b of the housing 1140 may be openin the upper portion thereof for easy mounting of the first positionsensor 1170, and may have an opening formed toward the inner surface ofthe first side portion 1141-1 of the housing 1140 in order to increasesensitivity in sensing. The shape of the mounting recess 1014 b of thehousing 1140 may correspond to or coincide with the shape of the firstposition sensor 1170.

For example, the circuit board 1190 may be fixed to the mounting recess1014 a of the housing 1140 using an adhesive. For example, the adhesivemay be epoxy or double-side tape. However, the disclosure is not limitedthereto.

Supporting members 1220-1 to 1220-4 may be disposed at the corners1142-1 to 1142-4 of the housing 1140.

Holes 1147 defining paths along which the supporting members 1220-1 to1220-4 extend may be provided in the corners 1142-1 to 1142-4 of thehousing 1140. For example, the housing 1140 may include holes 1147formed through the upper portions of the corners 1142-1 to 1142-4.

In another embodiment, the holes provided in the corners 1142-1 to1142-4 of the housing 1140 may be depressed from the outer surfaces ofthe corners of the housing 1140, and at least a portion of each of theholes may be open toward the outer surface of a corresponding one of thecorners. The number of holes 1147 of the housing 1140 may be equal tothe number of supporting members.

One end of the supporting member 1220 may be connected or bonded to theupper elastic member 1150 via a corresponding one of the holes 1147.

For example, the diameter of each hole 1147 may gradually increase inthe direction from the upper surface to the lower surface of the housing1140 for easy application of a damper. However, the disclosure is notlimited thereto. In another embodiment, the diameter of each hole 1147may be uniform.

In order to define paths along which the supporting members 1220-1 to1220-4 extend and to avoid spatial interference between the supportingmembers 1220-1 to 1220-4 and the corners 1142-1 to 1142-4 of the housing1140, an escape recess 1148 a may be provided in the outer surface 1148of each of the corners 1142-1 to 1142-4. The escape recess 1148 a may beconnected to the hole 1147 of the housing 1140, and may be hemisphericalor semi-oval. However, the disclosure is not limited thereto. The lowerportion or the lower end of the escape recess 1148 a may be connected tothe lower surface of the housing 1140.

For example, the diameter of the escape recess 1148 a may graduallydecrease in the direction from the upper portion to the lower portionthereof. However, the disclosure is not limited thereto.

In addition, the housing 1140 may be provided on the upper portion, theupper end, or the upper surface thereof with a stopper 1145 in order toprevent the housing from directly colliding with the inner surface ofthe upper plate of the cover member 1300.

For example, the stopper 1145 may be provided at the upper surface ofeach of the corners 1142-1 to 1142-4 of the housing 1140. However, thedisclosure is not limited thereto.

In addition, the housing 1140 may be provided on the lower portion, thelower end, or the lower surface thereof with a stopper (not shown) inorder to prevent the lower surface of the housing 1140 from collidingwith the base 1210 and/or the circuit board 1250.

In addition, the housing 1140 may be provided on the edge of the uppersurface of each of the corners 1142-1 to 1142-4 thereof with a guideprotrusion 1144 for preventing overflow of the damper.

For example, the hole 1147 of the housing 1140 may be located betweenthe edge of the upper surface of each of the corners 1142-1 to 1142-4 ofthe housing 1140 (for example, the guide protrusion 1144) and thestopper 1145.

The housing 1140 may be provided on the upper portion, the upper end, orthe upper surface thereof with at least one first coupling portion 1143coupled to a first outer frame 1152 of the upper elastic member 1150.

The first coupling portion 1143 of the housing 1140 may be disposed atat least one of the side portions 1141-1 to 1141-4 or the corners 1142-1to 1142-4 of the housing 1140.

The housing 1140 may be provided on the lower portion, the lower end, orthe lower surface thereof with at least one second coupling portion 1149coupled and fixed to a second outer frame 1162 of the lower elasticmember 1160.

For example, each of the first and second coupling portions 1143 and1149 of the housing 1140 may be a protrusion. However, the disclosure isnot limited thereto. In another embodiment, the coupling portion may bea recess or a plane.

For example, the first coupling portion 1143 of the housing 1140 may becoupled to a hole 1152 a of the first outer frame 1152 of the upperelastic member 1150, and the second coupling portion 1149 of the housing1140 may be coupled to a hole 1162 a of the second outer frame 1162 ofthe lower elastic member 1160, using an adhesive member (for example,solder) or thermal fusion.

In order to avoid spatial interference between each of second outerframes 1162-1 to 1162-3 and a second frame connection portion 1163 ofthe lower elastic member 1160, an escape recess 1044 a may be providedin the lower surface of at least one of the side portions 1141-1 to1141-4 of the housing 1140.

The first magnet 1130 may be disposed at at least one of the cornerportions (or the corners 114201 to 1142-4) of the housing 1140. Forexample, the first magnet 1130 may be disposed at each of the cornerportions of the housing 1140.

At the initial position of the AF operation unit, the first magnets 1130(1130-1 to 1130-4) may be disposed at the housing 1140 such that atleast a portion of each thereof overlaps the first coil 1120 in adirection perpendicular to the optical axis OA and parallel to astraight line passing through the optical axis OA.

For example, each of the first magnets 1130 (1130-1 to 1130-4) may beinserted into or disposed in the settlement portion 1141 a of acorresponding one of the corners 1142-1 to 1142-4 of the housing 1140.

In another embodiment, the first magnet 1130 may be disposed at theouter surface of each of the corners 1142-1 to 1142-4 of the housing1140.

The shape of the first magnet 1130 may be polyhedral such that the firstmagnet is easily settled at each corner of the housing 1140.

For example, the area of the first surface 1011 a of the first magnet1130 may be larger than the area of a second surface 1011 b thereof. Thefirst surface 1011 a of the first magnet 1130 may be a surface facingone surface of the first coil 1120 (or the outer surface of the bobbin1110), and the second surface 1011 b thereof may be opposite the firstsurface 1011 a.

For example, the transverse length of the second surface 1011 b of thefirst magnet 1130 may be smaller than the transverse length of the firstsurface 1011 a thereof.

For example, the transverse direction of the first surface 1011 a of thefirst magnet 1130 may be a direction of the first surface 1011 a of thefirst magnet 1130 perpendicular to the direction from the lower surfaceto the upper surface of the first magnet 1130 or a direction of thefirst surface 1011 a of the first magnet 1130 perpendicular to theoptical-axis direction.

For example, the transverse direction of the second surface 1011 b ofthe first magnet 1130 may be a direction of the second surface 1011 b ofthe first magnet 1130 perpendicular to the direction from the lowersurface to the upper surface of the first magnet 1130 or a direction ofthe second surface 1011 b of the first magnet 1130 perpendicular to theoptical-axis direction.

For example, the first magnet 1130 may include a portion Q2 having atransverse length L2 gradually decreasing from the center of the housing1140 to the corner 1142-1, 1142-2, 1142-3, or 1142-4 of the housing1140.

For example, the first magnet 1130 may include a portion Q2 having atransverse length L2 decreasing from the first surface 1011 a to thesecond surface 1011 b of the first magnet 1130. For example, thetransverse direction of the first magnet 1130 may be a directionparallel to the first surface 1011 a of the first magnet 1130.

Each of the first magnets 1130-1 to 1130-4 may be configured in a singlebody, and may be disposed such that the first surface 1011 a facing thefirst coil 1120 has an S pole and the second surface 1011 b has an Npole. However, the disclosure is not limited thereto. In anotherembodiment, the first surface 1011 a of each of the first magnets 1130-1to 1130-4 may have an N pole, and the second surface 1011 b thereof mayhave an S pole.

The first magnets may be disposed or installed at the corners of thehousing 1140 such that at least two thereof face each other.

For example, two pairs of first magnets facing each other so as tointersect each other may be disposed at the corners 1142-1 to 1142-4 ofthe housing 1140. In this case, the planar shape of each of the firstmagnets 1130-1 to 1130-4 in the horizontal direction thereof may bepolygonal, such as triangular, pentagonal, hexagonal, or rhombic.

In another embodiment, a pair of first magnets facing each other may bedisposed at only two corners of the housing 1140 facing each other.

In another embodiment, the description of the first magnet 1130 may beapplied to the first magnet 130 of FIG. 1 , and vice versa.

FIG. 21 is a sectional view of the lens moving apparatus 1100 shown inFIG. 18 in an AB direction, and FIG. 22 is a sectional view of the lensmoving apparatus 1100 shown in FIG. 18 in a CD direction.

Referring to FIGS. 21 and 22 , each of the second and third magnets 1180and 1185 may not overlap the first coil 1120 in a directionperpendicular to the optical axis OA or in a direction perpendicular tothe optical axis and parallel to a straight line passing through theoptical axis. However, the disclosure is not limited thereto. In anotherembodiment, each of the second and third magnets 1180 and 1185 mayoverlap the first coil 1120.

In addition, at the initial position of the AF operation unit, thesecond magnet 1180 may overlap or be aligned with the third magnet 1185in a direction perpendicular to the optical axis OA or in a directionperpendicular to the optical axis and parallel to a straight linepassing through the optical axis. However, the disclosure is not limitedthereto.

In addition, at the initial position of the AF operation unit, the firstposition sensor 1170 may overlap each of the second and third magnets1180 and 1185 in a direction perpendicular to the optical axis OA or ina direction perpendicular to the optical axis and parallel to a straightline passing through the optical axis. However, the disclosure is notlimited thereto. In another embodiment, the first position sensor 1170may not overlap at least one of the second or third magnet 1180 or 1185.

In addition, the first position sensor 1170 may not overlap the firstmagnet 1130 in a direction perpendicular to the optical axis OA or in adirection perpendicular to the optical axis and parallel to a straightline passing through the optical axis.

For example, the first position sensor 1170 may not overlap the firstmagnet 1130 in a direction from the first position sensor 1170 to thefirst coil 1120 or in a direction perpendicular to the outer surface ofthe first side portion 1141-1 of the housing 1140.

The circuit board 1190 may be disposed at the side portion 1141-1 of thehousing 1140, and the first position sensor 1170 may be disposed ormounted on the circuit board 1190. For example, the circuit board 1190may be disposed in the mounting recess 1014 a of the housing 1140.

For example, the circuit board 1190 may be disposed between the firstcorner 1142-1 and the second corner 1142-2 of the housing 1140, andfirst to fourth terminals B1 to B4 of the circuit board 1190 may beconnected to the first position sensor 1170.

For example, the circuit board 1190 may not overlap an imaginary linethat links one of the corners (for example, the first corner 1142-1) (orone of the corner portions) and the optical axis OA. The reason for thisis that it is necessary to prevent spatial interference between thesupporting member 1220 and the circuit board 1190.

FIG. 23 is an enlarged view of the circuit board 1190 and the firstposition sensor 1170 of FIG. 17 .

Referring to FIG. 23 , the circuit board 1190 may have terminals B1 toB6 configured to be connected to external terminals or externalapparatuses.

The first position sensor 1170 may be disposed at a first surface 1019 bof the circuit board 1190, and the terminals B1 to B6 may be disposed ata second surface 1019 a of the circuit board 1190.

Here, the second surface 1019 a of the circuit board 1190 may beopposite the first surface 1019 b of the circuit board 1190. Forexample, the second surface 1019 a of the circuit board 1190 may be thesurface of the circuit board 1190 that faces the bobbin 1110.

The circuit board 1190 may include a body portion S1 and an extensionportion S2 located under the body portion S1. The body portion S1 mayalso be referred to as an “upper end portion,” and the extension portionS2 may also be referred to as a “lower end portion.”

The extension portion S2 may extend downwards from the body portion S1.

The body portion S1 may protrude from side surfaces 1016 a and 1016 b ofthe extension portion S2. For example, the side surfaces 1016 a and 1016b of the extension portion S2 may be surfaces that interconnect a firstsurface 19 b and a second surface 19 a of the extension portion S2.

The body portion S1 may include a first extension region A1 extendingtoward the first corner 1142-1 of the housing 1140 and a secondextension region A2 extending toward the second corner 1142-2 of thehousing 1140.

For example, the first extension region A1 may extend or protrude fromthe first side surface 1016 a of the extension portion S2, and thesecond extension region A2 may extend or protrude from the second sidesurface 1016 b of the extension portion S2.

For example, in FIG. 23 , the transverse length of the first extensionregion A1 is larger than the transverse length of the second extensionregion A2. However, the disclosure is not limited thereto. In anotherembodiment, the transverse length of the first extension region A1 maybe equal to or smaller than the transverse length of the secondextension region A2.

For example, the transverse length of the body portion S1 of the circuitboard 1190 may be larger than the transverse length of the extensionportion S2.

For example, the first to fourth terminals B1 to B4 of the circuit board1190 may be disposed at the first surface 1019 b of the body portion S1so as to be spaced apart from each other. For example, the fourterminals B1 to B4 may be arranged in a line in the transverse directionof the circuit board 1190.

The first terminal B1 and the second terminal B2 may be disposed atopposite ends of the body portion S1 of the circuit board 1190 so as tobe adjacent thereto. That is, each of the first terminal B1 and thesecond terminal B2 may be disposed at a corresponding one of theopposite ends of the body portion S1 of the circuit board 1190 so as tobe adjacent thereto.

For example, the first terminal B1 of the circuit board 1190 may bedisposed at one end of the circuit board 1190 (for example, one end ofthe upper end portion), the second terminal B2 may be disposed at theother end of the circuit board 1190, the third terminal B3 may bedisposed between the first terminal B1 and the second terminal B2, andthe fourth terminal B4 may be disposed between the third terminal B3 andthe first terminal B1.

The first terminal B1 of the circuit board 1190 may be disposed at thefirst extension region A1 of the body portion S1 of the circuit board1190, and the second terminal B2 may be disposed at the second extensionregion A2 of the body portion S1 of the circuit board 1190.

The first to fourth terminals B1 to B4 may be disposed so as to becloser to the upper surface 1019 c than the lower surface of the circuitboard 1190.

For example, the first to fourth terminals B1 to B4 may be formed so asto abut the second surface 1019 a of the circuit board 1190 and theupper surface 1019 c of the body portion S1 of the circuit board 1190that abuts the second surface 1019 a.

In addition, for example, at least one of the first to fourth terminalsB1 to B4 may include a recess 1007 a or a via formed in the uppersurface 1019 c of the circuit board 1190.

For example, each of the third terminal B3 and the fourth terminal B4may include a curved portion, such as a semicircular via or recess 1007a, recessed from the upper surface 1019 c of the circuit board 1190.

The area of contact between solder and the terminals B3 and B4 may beincreased by the recess 1007 a, whereby adhesive force and solderabilitymay be improved.

The fifth terminal B5 and the sixth terminal B6 of the circuit board1190 may be disposed at the first surface 1019 b of the extensionportion S2 of the circuit board 1190 so as to be spaced apart from eachother.

The circuit board 1190 may have a recess 1008 a or a hole providedbetween the fifth terminal B5 and the sixth terminal B6. The recess 1008a may be depressed from the lower surface of the circuit board 1190, andmay be open to the first surface 1019 b and the second surface 1019 a ofthe circuit board 1190.

The distance between the fifth terminal B5 and the sixth terminal B6 maybe smaller than the distance between two adjacent ones of the first tofourth terminals B1 to B4. At the time of soldering for connection withthe outside, no solder may be formed between the fifth terminal B5 andthe sixth terminal B6 due to the recess 1008 a, whereby short circuitbetween the fifth terminal B5 and the sixth terminal B6 may beprevented.

In addition, for example, at least one of the fifth or sixth terminal B5or B6 may include a recess 1007 b or a via formed in the lower surfaceof the circuit board 1190.

For example, each of the fifth terminal B5 and the sixth terminal B6 mayinclude a curved portion, such as a semicircular via or recess, recessedfrom the lower surface of the circuit board 1190.

The area of contact between solder and the fifth and sixth terminals B5and B6 may be increased by the recess 1007 b, whereby adhesive force andsolderability may be improved.

The circuit board 1190 may have a recess 1090 a disposed between thesecond terminal B2 and the third terminal B3 and a recess 1090 bdisposed between the first terminal B1 and the fourth terminal B4. Here,each of the recesses 1090 a and 1090 b may also be referred to as an“escape recess.”

Each of the first recess 1090 a and the second recess 1090 b may bedepressed from the upper surface 1019 c of the circuit board 1190, andmay be open to the first surface 1019 b and the second surface 1019 a ofthe circuit board 1190.

The first recess 1090 a of the circuit board 1190 may be formed in orderto avoid spatial interference with a first outer frame 1152 of a thirdupper elastic unit 1150-3, and the second recess 1090 b of the circuitboard 1190 may be formed in order to avoid spatial interference with afirst outer frame 1151 of a fourth upper elastic unit 1150-4.

For example, the circuit board 1190 may be a printed circuit board or anFPCB.

The circuit board 1190 may include a circuit pattern or wiring (notshown) for interconnecting the first to sixth terminals B1 to B6 and thefirst position sensor 1170.

The first position sensor 1170 may sense a magnetic field of the secondmagnet 1180 mounted to the bobbin 1110 or the intensity of the magneticfield when the bobbin 1110 is moved, and may output an output signalbased on the result of sensing.

The first position sensor 1170 may be mounted to the circuit board 1190disposed at the housing 1140, and may be fixed to the housing 1140. Forexample, the first position sensor 1170 may be disposed in the mountingrecess 1014 b of the housing 1190, and may be moved together with thehousing 1140 at the time of handshake compensation.

The first position sensor 1170 may be disposed at the second surface1019 a of the circuit board 1190. In another embodiment, the firstposition sensor 1170 may be disposed at the first surface 1019 b of thecircuit board 1190.

The first position sensor 1170 may be configured in the form of a drivershown in FIG. 9 , and the description given with reference to FIG. 9 maybe applied thereto.

The first position sensor 1170 may include first to fourth terminals fortwo power signals VDD and GND, a clock signal SCL, and data SDA andfifth and sixth terminals for providing a driving signal to the firstcoil 1120.

Each of the first to fourth terminals of the first position sensor 1170may be connected to a corresponding one of the first to fourth terminalsB1 to B4 of the circuit board 1190, and each of the fifth and sixthterminals of the first position sensor 1170 may be connected to acorresponding one of the fifth and sixth terminals B5 and B6 of thecircuit board 1190.

In another embodiment, the first position sensor 1170 may be realized asa position detection sensor, such as a Hall sensor, alone.

The first to fourth terminals B1 to B4 of the circuit board 1190 may beconnected to terminals 1251-1 to 1251-n (n being a natural numbergreater than 1) of the circuit board 1250 via upper elastic units 1150-1to 1150-4 and the supporting members 1220-1 to 1220-4, whereby the firstposition sensor 1170 may be connected to the terminals 1251-1 to 1251-n(for example, n=4) of the circuit board 1250.

In addition, the fifth and sixth terminals B5 and B6 of the circuitboard 1190 may be coupled to the lower elastic members 1160-1 and1160-2, and the first position sensor 1170 may be connected to the firstcoil 1120 via the lower elastic members 1160-1 and 1160-2.

For example, the fifth terminal B5 of the circuit board 1190 may becoupled to the first lower elastic member 1160-1, and the sixth terminalB6 of the circuit board 1190 may be coupled to the second lower elasticmember 1160-2.

Next, the upper elastic member 1150, the lower elastic member 1160, andthe supporting member 1220 will be described.

FIG. 24 shows the upper elastic member 1150 shown in FIG. 17 , FIG. 25shows the lower elastic member 1160 shown in FIG. 17 , FIG. 26 is acoupled perspective view of the upper elastic member 1150, the lowerelastic member 1160, the base 1210, the supporting member 1220, thesecond coil 1230, and the circuit board 1250, FIG. 27 shows couplingbetween the first to fourth terminals B1 to B4 of the circuit board 1190and the upper elastic units 1150-1 to 1150-4, FIG. 28 is a bottom viewof the fifth and sixth terminals B5 and B6 of the circuit board 1190 andthe lower elastic units 1160-1 and 1160-2, FIG. 29 is a separatedperspective view of the second coil 1230, the circuit board 1250, thebase 1210, and the second position sensor 1240, and FIG. 30 is a bottomview of the housing 1140, the first magnet 1130, the lower elasticmember 1160, and the circuit board 1190. FIG. 28 is a perspective viewof a dotted-line portion 1039 a of FIG. 30 .

Referring to FIGS. 24 to 30 , the upper elastic member 1150 may becoupled to the upper portion, the upper end, or the upper surface of thebobbin 1110, and the lower elastic member 1160 may be coupled to thelower portion, the lower end, or the lower surface of the bobbin 1110.

For example, the upper elastic member 1150 may be coupled to the upperportion, the upper end, or the upper surface of the bobbin 1110 and tothe upper portion, the upper end, or the upper surface of the housing1140, and the lower elastic member 1160 may be coupled to the lowerportion, the lower end, or the lower surface of the bobbin 1110 and tothe lower portion, the lower end, or the lower surface of the housing1140.

The upper elastic member 1150 and the lower elastic member 1160 mayelastically support the bobbin 1110 relative to the housing 1140.

The supporting member 1220 may support the housing 1140 so as to bemovable relative to the base 1210 in a direction perpendicular to theoptical axis, and may connect at least one of the upper or lower elasticmember 1150 or 1160 to the circuit board 1250.

Referring to FIG. 24 , the upper elastic member 1150 may include aplurality of upper elastic units 1150-1 to 1150-4 separated from eachother. FIG. 26 shows four upper elastic units separated from each other;however, the disclosure is not limited as to the number thereof. Thenumber of upper elastic units may be three or more.

The upper elastic member 1150 may include first to fourth upper elasticunits 1150-1 to 1150-4 directly bonded to the first to fourth terminalsB1 to B4 of the circuit board 1190 so as to be connected thereto.

A portion of each of the upper elastic units may be disposed at thefirst side portion 1141-1 of the housing 1140 at which the circuit board1190 is disposed, and at least one upper elastic unit may be disposed ateach of the second to fourth side portions 1141-2 to 1141-4, excludingthe first side portion 1141-1 of the housing 1140.

Each of the first to fourth upper elastic units 1150-1 to 1150-4 mayinclude a first outer frame 1152 coupled to the housing 1140.

At least one of the first to fourth upper elastic units 1150-1 to 1150-4may further include a first inner frame 1151 coupled to the bobbin 1110and a first frame connection portion 1153 for interconnecting the firstinner frame 1151 and the first outer frame 1152.

In the embodiment of FIG. 24 , each of the first and second upperelastic units 1150-1 and 1150-2 includes only the first outer frame, butdoes not include the first inner frame and the first frame connectionportion. Each of the first and second upper elastic units 1150-1 and1150-2 may be spaced apart from the bobbin 1110.

Each of the third and fourth upper elastic units 1150-3 and 1150-4includes the first inner frame 1151, the first outer frame, and thefirst frame connection portion 1153. However, the disclosure is notlimited thereto.

For example, a hole 1151 a, to which the first coupling portion 1113 ofthe bobbin 1110 is coupled, may be provided in the first inner frame1151 of each of the third and fourth upper elastic units 1150-3 and1150-4. However, the disclosure is not limited thereto. For example, thehole 1152 a of the first inner frame 1151 may have at least one cutportion 1051 a, through which an adhesive member permeates a gap betweenthe first coupling portion 1143 of the bobbin 1110 and the hole 1151 a.

A hole 1152 a, to which the first coupling portion 1143 of the housing1140 is coupled, may be provided in the first outer frame 1152 of eachof the first to fourth upper elastic units 1150-1 to 1150-4.

The first outer frames 1151 of the first to fourth upper elastic units1150-1 to 1150-4 may include body portions coupled to the housing 1140and connection terminals P1 to P4 connected to the first to fourthterminals B1 to B4 of the circuit board 1190. Here, the connectionterminals P1 to P4 may also be referred to as “extension portions.”

The first outer frame 1151 of the first to fourth upper elastic units1150-1 to 1150-4 may include first coupling portions 1520 coupled to thehousing 1140, second coupling portions 1510 coupled to the supportingmembers 1220-1 to 1220-4, connection portions 1530 for interconnectingthe first coupling portions 1520 and the second coupling portions 1510,and extension portions P1 to P4 connected to the second couplingportions 1510 and extending to the first side portion 1141-1 of thehousing 1140.

The body portion of each of the first to fourth upper elastic units1150-1 to 1150-4 may include a first coupling portion 1520. In addition,the body portion of each of the first to fourth upper elastic units1150-1 to 1150-4 may further include at least one of a second couplingportion 1510 or a connection portion 1530.

For example, one end of the first supporting member 1220-1 may becoupled to the second coupling portion 1510 of the first upper elasticunit 1150-1, one end of the second supporting member 1220-2 may becoupled to the second coupling portion 1510 of the second upper elasticunit 1150-2, one end of the third supporting member 1220-3 may becoupled to the second coupling portion 1510 of the third upper elasticunit 1150-3, and one end of the fourth supporting member 1220-4 may becoupled to the second coupling portion 1510 of the fourth upper elasticunit 1150-4, via solder or a conductive adhesive member.

The second coupling portion 1510 may have a hole 1052 through which eachof the supporting members 1220-1 to 1220-4 extends. One end of each ofthe supporting members 1220-1 to 1220-4 extending through the hole 1052may be directly coupled to the second coupling portion 1510 via aconductive adhesive member or solder 1901 (see FIG. 26 ), and the secondcoupling portion 1510 may be connected to each of the supporting members1220-1 to 1220-4.

For example, the second coupling portion 1510 is a region in which thesolder 1901 is disposed for coupling with each of the supporting members1220-1 to 1220-4, and may include a hole 1052 and a region around thehole 1052.

The first coupling portion 1520 may include at least one coupling region1005 a and 1005 b coupled to the housing 1140 (for example, each of thecorners 1142-1 to 1142-4).

For example, the coupling regions 1005 a and 1005 b of the firstcoupling portion 1520 may include at least one hole 1152 a coupled tothe first coupling portion 1143 of the housing 1140.

For example, each of the coupling regions 1005 a and 1005 b may have oneor more holes, and one more first coupling portions correspondingthereto may be provided at each of the corners 1142-1 to 1142-4 of thehousing 1140.

For example, in order to support the housing 1140 in a balanced state,the coupling regions 1005 a and 1005 b of the first coupling portions1520 of the first to fourth upper elastic units 1150-1 to 1150-4 may besymmetrical with respect to reference lines 1501 and 1502. However, thedisclosure is not limited thereto.

In addition, the first coupling portions 1143 of the housing 1140 may besymmetrical with respect to the reference lines 1501 and 1502, and twofirst coupling portions may be provided at each of both sides of eachreference line. However, the disclosure is not limited as to the numberthereof.

Each of the reference lines 1501 and 1502 may be a straight line passingthrough a central point 1101 and a corresponding one of the corners1142-1 to 1142-4 of the housing 1140. For example, each of the referencelines 1501 and 1502 may be a straight line passing through the centralpoint 1101 and two side portions facing each other in a diagonaldirection of the housing 1140, among the edges of the corners 1142-1 to1142-4 of the housing 1140.

Here, the central point 1101 may be the center of the housing 1140, thecenter of the bobbin 1110, or the center of the upper elastic member1150. In addition, for example, the edges of the corners of the housing1140 may be edges aligned with or corresponding to the middles of thecorners of the housing 1140.

In the embodiment of FIG. 24 , each of the coupling regions 1005 a and1005 b of the first coupling portion 1520 is realized so as to include ahole 1152 a. However, the disclosure is not limited thereto. In anotherembodiment, the coupling regions may be realized in various formssufficient to be coupled to the housing 1140, such as recesses.

For example, the hole 1152 a of the first coupling portion 1520 may haveat least one cut portion 1052 a, through which an adhesive memberpermeates a gap between the first coupling portion 1143 of the housing1140 and the hole 1152 a.

The connection portion 1530 may interconnect the second coupling portion1510 and the first coupling portion 1520. For example, the connectionportion 1530 may interconnect the second coupling portion 1510 and thecoupling regions 1005 a and 1005 b of the first coupling portion 1520.

For example, the connection portion 1530 may include a first connectionportion 1530 a for interconnecting the first coupling region 1005 a ofthe first coupling portion 1520 of each of the first to fourth uppersprings 1150-1 to 1150-4 and the second coupling portion 1510 and asecond connection portion 1530 b for interconnecting the second couplingregion 1005 b of the first coupling portion 1520 and the second couplingportion 1510.

For example, the first outer frame 1151 may include a connection regionfor directly interconnecting the first coupling region 1005 a and thesecond coupling region 1005 b. However, the disclosure is not limitedthereto.

Each of the first and second connection portions 1530 a and 1530 b mayinclude a bent portion that is bent at least once or a curved portionthat is curved at least once. However, the disclosure is not limitedthereto. In another embodiment, each connection portion may be straight.

The width of the connection portion 1530 may be smaller than the widthof the first coupling portion 1520. In addition, the width of theconnection portion 1530 may be smaller than the width (or the diameter)of the second coupling portion. In another embodiment, the width of theconnection portion 1530 may be equal to the width of the first couplingportion 1520, and may be equal to the width (or the diameter) of thesecond coupling portion.

For example, the first coupling portion 1520 may contact the uppersurface of each of the corners 1142-1 to 1142-4 of the housing 1140, andmay be supported by each of the corners 1142-1 to 1142-4 of the housing1140. For example, the connection portion 1530 may not be supported bythe upper surface of the housing 1140, and may be spaced apart from thehousing 1140. In addition, an empty space between the connection portion1530 and the housing 1140 may be filled with a damper (not shown) inorder to prevent oscillation due to vibration.

The width of each of the first and second connection portions 1530 a and1530 b may be smaller than the width of the first coupling portion 1520,whereby the connection portion 1530 may be easily moved in the firstdirection, and therefore stress applied to the upper elastic units1150-1 to 1150-4 and stress applied to the supporting members 1220-1 to1220-4 may be dispersed.

Each of the first and second extension portions P1 and P2 of the firstouter frames of the first and second upper elastic units 1150-1 and1150-2 may extend from the first coupling portion 1520 (for example, thefirst coupling region 1005 a) toward a corresponding one of the firstand second terminals B1 and B2 of the circuit board 1190 disposed at thefirst side portion 1141-1 of the housing 1140.

The first coupling portion 1520 of the third upper elastic unit 1150-3may further include at least one coupling regions 1006 a and 1006 bconnected to at least one of the fourth side portion 1141-4 or thesecond corner 1142-2 of the housing 1140.

In addition, the first coupling portion 1520 of the fourth upper elasticunit 1150-4 may further include at least one coupling regions 1006 c and1006 d connected to at least one of the second side portion 1141-2 orthe first corner 1142-1 of the housing 1140.

Each of the third and fourth extension portions P3 and P4 of the firstouter frames of the third and fourth upper elastic units 1150-3 and1150-4 may extend from the first coupling portion 1520 (for example, acorresponding one of coupling regions 1006 b and 1006 d) toward acorresponding one of the third and fourth terminals B3 and B4 of thecircuit board 1190 disposed at the first side portion 1141-1 of thehousing 1140.

One end of each of the first to fourth extension portions P1 to P4 maybe coupled to a corresponding one of the first to fourth terminals B1 toB4 of the circuit board 1190 via solder or a conductive adhesive member.

Each of the first and second extension portions P1 and P2 may be astraight line.

Each of the third and fourth extension portions P3 and P4 may include abent portion or a curved portion so as to be easily coupled to acorresponding one of the third and fourth terminals B3 and B4 of thecircuit board 1190.

The first outer frame of the third upper elastic unit 1150-3 may furtherinclude a first extension frame 1154-1 connected between the firstcoupling portion 1520 and the extension portion P3 and disposed at thefourth side portion 1141-4 and the fourth corner 1142-4 of the housing1140.

In order to increase force of coupling with the housing 1140 and thus toprevent loosening of the third upper elastic unit 1150-3, the firstextension frame 1154-1 may include at least one coupling regions 1006 aand 1006 b coupled to the housing 1140, and each of the coupling regions1006 a and 1006 b may have a hole to which the first coupling portion1143 of the housing 1140 is coupled.

The first outer frame of the fourth upper elastic unit 1150-4 mayfurther include a second extension frame 1154-2 connected between thefirst coupling portion 1520 and the extension portion P4 and disposed atthe second side portion 1141-2 and the first corner 1142-1 of thehousing 1140.

In order to increase force of coupling with the housing 1140 and thus toprevent loosening of the fourth upper elastic unit 1150-4, the secondextension frame 1154-2 may include at least one coupling regions 1006 cand 1006 d coupled to the housing 1140, and each of the coupling regions1006 c and 1006 d may have a hole, to which the first coupling portion1143 of the housing 1140 is coupled.

In FIG. 24 , each of the third upper elastic unit 1150-3 and the fourthupper elastic unit 1150-4 includes two first frame connection portions.However, the disclosure is not limited thereto. The number of firstframe connection portions may be one or three or more.

As described above, the first to fourth upper elastic units may includeextension portions P1 to P4 disposed on the first side portion 1141-1 ofthe housing 1140, and the upper elastic units 1150-1 to 1150-4 may beeasily coupled to the first to fourth terminals B1 to B4 provided at thebody portion S1 of the circuit board 1190 via the extension portions P1to P4.

Since the four terminals B1 to B4 provided at the body portion S1 of thecircuit board 1190 disposed at the first side portion 1141-1 of thehousing 1140 are directly connected to the first to fourth upper elasticunits 1150-1 to 1150-4, a portion of the first outer frame 1151 of eachof the first to fourth upper elastic units 1150-1 to 1150-4 may bedisposed at the first side portion 1141-1 of the housing 1140.

Each of the upper elastic units 1150-1 to 1150-4 may be disposed at acorresponding one of the corners 1142-1 to 1142-4 of the housing 1140,and may have a corresponding one of the extension portions P1 to P4extending to the first side portion 1141-1 of the housing 1140.

The extension portions P1 to P4 of the upper elastic units 1150-1 to1150-4 may be directly coupled to the four terminals B1 to B4 providedat the body portion S1 of the circuit board 1190 via a conductiveadhesive member 1071, such as solder.

The first outer frame 1151 of the first upper elastic unit 1150-1 may bedisposed at the first corner 1142-1 of the housing 1140, the first outerframe 1151 of the second upper elastic unit 1150-2 may be disposed atthe second corner 1142-2 of the housing 1140, the first outer frame 1151of the third upper elastic unit 1150-3 may be disposed at the thirdcorner 1142-3 of the housing 1140, and the first outer frame 1151 of thefourth upper elastic unit 1150-4 may be disposed at the fourth corner1142-4 of the housing 1140.

A portion of the third upper elastic unit 1150-3 may be disposed in thefirst recess 1090 a of the first circuit board 1190, and the end of theportion of the third upper elastic unit 1150-3 may be coupled to thethird terminal B3 of the circuit board 1190.

A portion of the fourth upper elastic unit 1150-4 may be disposed in thesecond recess 1090 b of the first circuit board 1190, and the end of theportion of the fourth upper elastic unit 1150-4 may be coupled to thefourth terminal B4 of the circuit board 1190.

The third extension portion P3 of the third upper elastic unit 1150-3may extend toward the third terminal B3 of the circuit board 1190through the first recess 1090 a of the circuit board 1190, and may bebent at least twice.

In addition, the fourth extension portion P4 of the fourth upper elasticunit 1150-4 may extend toward the fourth terminal B4 of the circuitboard 1190 through the second recess 1090 b of the circuit board 1190,and may be bent at least twice.

The third extension portion P3 (or the “third connection terminal”) ofthe third upper elastic unit 1150-3 may include at least two bentregions 1002 a and 1002 b.

For example, the third extension portion P3 of the third upper elasticunit 1150-3 may include a first portion 1001 a extending from the firstcoupling portion 1520 (for example, the coupling region 1006 b) of thethird upper elastic unit 1150-3, a first bent region 1002 a (or a “firstbent portion”) bent from the first portion 1001 a, a second portion 1001b extending from the first bent region 1002 a, a second bent region 1002b (or a “second bent portion”) bent from the second portion 1001 b, anda third portion 1001 c extending from the second bent region 1002 b inthe direction toward the third terminal B3.

For example, the second portion 1001 b of the third extension portion P3(or the third connection terminal) may be bent from the first portion1001 a, and the third portion 1001 c may be bent from the second portion1001 b.

The second portion 1001 b of the third extension portion P3 may bedisposed between the first bent region 1002 a and the second bent region1002 b, and may interconnect the first and second bent regions 1002 aand 1002 b.

For example, each of the first portion 1001 a and the third portion 1001c of the third extension portion P3 may extend in the direction from thesecond corner 1142-2 to the first corner 1141-1 of the housing 1140. Forexample, the second portion 1001 b of the third extension portion P3 mayextend from the inner surface to the outer surface of the housing 1140.

A portion (for example, the second portion 1001 b) of the thirdextension portion P3 of the third upper elastic unit 1150-3 may bedisposed in the first recess 1090 a of the circuit board 1190 or mayextend through the first recess 1090 a.

The fourth extension portion P4 (or the “fourth connection terminal”) ofthe fourth upper elastic unit 1150-4 may include at least two bentregions 1002 c and 1002 d.

For example, the fourth extension portion P4 of the fourth upper elasticunit 1150-4 may include a fourth portion 1001 d extending from the firstcoupling portion 1520 (for example, the coupling region 1006 d) of thefourth upper elastic unit 1150-4, a third bent region 1002 c (or a“third bent portion”) bent from the fourth portion 1001 d, a fifthportion 1001 e extending from the third bent region 1002 c, a fourthbent region 1002 d (or a “fourth bent portion”) bent from the fifthportion 1001 e, and a sixth portion 1001 f extending from the fourthbent region 1002 d in the direction toward the fourth terminal B4.

For example, the fifth portion 1001 e of the fourth extension portion P4(or the fourth connection terminal) may be bent from the fourth portion1001 d, and the sixth portion 1001 f may be bent from the fifth portion1001 e.

The fifth portion 1001 e of the fourth extension portion P4 may bedisposed between the third bent region 1002 c and the fourth bent region1002 d, and may interconnect the third and fourth bent regions 1002 cand 1002 d.

For example, each of the fourth portion 1001 d and the sixth portion1001 f of the fourth extension portion P4 may extend in the directionfrom the first corner 1142-1 to the second corner 1141-2 of the housing1140. For example, the fifth portion 1001 e of the fourth extensionportion P4 may extend from the inner surface to the outer surface of thehousing 1140.

A portion (for example, the fifth portion 1001 e) of the fourthextension portion P4 of the fourth upper elastic unit 1150-4 may bedisposed in the second recess 1090 b of the circuit board 1190 or mayextend through the second recess 1090 b.

Referring to FIG. 25 , the lower elastic member 1160 may include aplurality of lower elastic units 1160-1 and 1160-2.

For example, each of the first and second lower elastic units 1160-1 and1160-2 may include a second inner frame 1161 coupled or fixed to thelower portion, the lower surface, or the lower end of the bobbin 1110,second outer frames 1162-1 to 1162-3 coupled or fixed to the lowerportion, the lower surface, or the lower end of the housing 1140, and asecond frame connection portion 1163 for interconnecting the secondinner frame 1161 and the second outer frames 1162-1 to 1162-3.

The second inner frame 1161 may be provided with a hole 1161 a, to whichthe second coupling portion 1117 of the bobbin 1110 is coupled, and eachof the second outer frames 1162-1 to 1162-3 may be provided with a hole1162 a, to which the second coupling portion 1149 of the housing 1140 iscoupled.

For example, each of the first and second lower elastic units 1160-1 and1160-2 may include three second outer frames 1162-1 to 1162-3 coupled tothe housing 1140 and two second frame connection portions 1163. However,the disclosure is not limited thereto. In another embodiment, each ofthe first and second lower elastic units may include one or more secondouter frames and one or more second frame connection portions.

Each of the first and second lower elastic units 1160-1 and 1160-2 mayinclude connection frames 1164-1 and 1164-2 for interconnecting thesecond outer frames 1162-1 to 1162-3.

The width of each of the connection frames 1164-1 and 1164-2 may besmaller than the width of each of the second outer frames 1162-1 to1162-3. However, the disclosure is not limited thereto.

The connection frames 1164-1 and 1164-2 may be located outside coilunits 1230-1 to 1230-4 and the first magnets 1130-1 to 1130-4 based onthe coil units 1230-1 to 1230-4 and the first magnets 1130-1 to 1130-4in order to avoid spatial interference with the second coil 1230 and thefirst magnet 1130. In this case, the outside of the coil units 1230-1 to1230-4 and the first magnets 1130-1 to 1130-4 may be opposite a regionin which the center of the bobbin 1110 or the center of the 1 housing140 is located based on the coil units 1230-1 to 1230-4 and the firstmagnets 1130-1 to 1130-4.

In addition, for example, the connection frames 1164-1 and 1164-2 may belocated so as not to overlap the coil units 1230-1 to 1230-4 and/or thefirst magnets 1130-1 to 1130-4 in the optical-axis direction. However,the disclosure is not limited thereto. In another embodiment, at leastportions of the connection frames 1164-1 and 1164-2 may be aligned withor overlap the coil units 1230-1 to 1230-4 and/or the first magnets1130-1 to 1130-4 in the optical-axis direction.

Each of the upper elastic units 1150-1 to 1150-4 and the lower elasticunits 1160-1 and 1160-2 may be realized as a leaf spring; however, thedisclosure is not limited thereto. Each of the upper elastic units andthe lower elastic units may be realized as a coil spring or the like.The “elastic unit 1150 or 1160” may also be referred to as a “spring,”the “outer frame 1152 or 1162” may also be referred to as an “outerportion,” the “inner frame 1151 or 1161” may also be referred to as an“inner portion,” and the supporting member 1220 may also be referred toas a wire.

The supporting members 1220-1 to 1220-4 may be disposed in the corners1142-1 to 1142-4 of the housing 1140, and may interconnect the upperelastic units 1150-1 to 1150-4 and the circuit board 1250.

Each of the supporting members 1220-1 to 1220-4 may be coupled to acorresponding one of the first to fourth upper elastic units 1150-1 to1150-4, and may connect a corresponding one of the first to fourth upperelastic units 1150-1 to 1150-4 to a corresponding one of the terminals1251-1 to 1251-n (for example, n=4) of the circuit board 1250.

The supporting members 1220-1 to 1220-4 may be spaced apart from thehousing 1140, not fixed to the housing 1140, and one end of each of thesupporting members 1220-1 to 1220-4 may be directly connected or coupledto the second coupling portion 1510. In addition, the other end of eachof the supporting members 1220-1 to 1220-4 may be directly connected orcoupled to the circuit board 1250.

For example, each of the supporting members 1220-1 to 1220-4 may extendthrough the hole 1147 formed in a corresponding one of the corners1142-1 to 1142-4 of the housing 1140. However, the disclosure is notlimited thereto. In another embodiment, the supporting members may bedisposed adjacent to boundary lines between the side portions 1141-1 to1141-4 and the corners 1142-1 to 1142-4 of the housing 1140, and may notextend through the corners 1142-1 to 1142-4 of the housing 1140.

The first coil 1120 may be directly connected or coupled to acorresponding one of the second inner frames of the first and secondlower elastic units 1160-1 and 1160-2. For example, the second innerframe 1161 of the first lower elastic unit 1160-1 may include a firstbonding portion 1043 a coupled to one end of the first coil 1120, andthe second inner frame 1161 of the second lower elastic unit 1160-2 mayinclude a second bonding portion 1043 b coupled to the other end of thefirst coil 1120. A recess 1008 for guiding the coil 1120 may be providedin each of the first and second bonding portions 1043 a and 1043 b.

The first supporting member 1220-1 may be disposed at the first corner1142-1 of the housing 1140, and may be coupled to the second couplingportion 1510 of the first upper elastic unit 1150-1.

The second supporting member 1220-2 may be disposed at the second corner1142-2 of the housing 1140, and may be coupled to the second couplingportion 1510 of the second upper elastic unit 1150-2.

The third supporting member 1220-3 may be disposed at the third corner1142-3 of the housing 1140, and may be coupled to the second couplingportion 1510 of the third upper elastic unit 1150-3.

The fourth supporting member 1220-4 may be disposed at the fourth corner1142-4 of the housing 1140, and may be coupled to the second couplingportion 1510 of the fourth upper elastic unit 1150-4.

The first terminal B1 of the circuit board 1190 may be connected to thefirst supporting member 1220-1, the second terminal B2 of the circuitboard 1190 may be connected to the second supporting member 1220-2, thethird terminal B3 of the circuit board 1190 may be connected to thethird supporting member 1220-3, and the fourth terminal B4 of thecircuit board 1190 may be connected to the fourth supporting member1220-4.

Each of the first to fourth supporting members 1220-1 to 1220-4 may beconnected to a corresponding one of the first to fourth terminals 1251-1to 1251-n (n=4) of the circuit board 1250.

For example, power signals VDD and GND may be provided to the first andsecond supporting members 1220-1 and 1220-2 via the first and secondterminals 1251-1 and 1251-2 of the circuit board 1250.

The power signals VDD and GND may be provided to the first and secondterminals B1 and B2 of the circuit board 1190 via the first and secondupper elastic units 1150-1 and 1150-2. The first position sensor 1170may receive the power signals VDD and GND via the first and secondterminals B1 and B2 of the circuit board 1190.

For example, the first terminal B1 of the circuit board 1190 may be oneof a VDD terminal or a GND terminal, and the second terminal B2 of thecircuit board 1190 may be the other of the VDD terminal or the GNDterminal.

In addition, a clock signal SCL and a data signal SDA may be provided tothe third and fourth supporting members 1220-3 and 1220-4 via the thirdand fourth terminals 1251-3 and 1251-4 of the circuit board 1250, andthe clock signal SCL and the data signal SDA may be provided to thethird and fourth terminals B3 and B4 of the circuit board 1190 via thethird and fourth upper elastic units 1150-3 and 1150-4. The firstposition sensor 1170 may receive the clock signal SCL and the datasignal SDA via the third and fourth terminals B3 and B4 of the circuitboard 1190.

For example, the power signal VDD may be provided to the first positionsensor 1170 via the first terminal 1251-1 of the circuit board 1250, thefirst supporting member 1220-1, the first upper elastic unit 1150-1, andthe first terminal B1 of the circuit board 1190. The power signal GNDmay be provided to the first position sensor 1170 via the secondterminal 1251-2 of the circuit board 1250, the second supporting member1220-2, the second upper elastic unit 1150-2, and the second terminal B2of the circuit board 1190.

In addition, for example, the clock signal SCL may be provided to thefirst position sensor 1170 via the third terminal 1251-3 of the circuitboard 1250, the third supporting member 1220-3, the third upper elasticunit 1150-3, and the third terminal B3 of the circuit board 1190. Thedata signal SDA may be provided to the first position sensor 1170 viathe fourth terminal 1251-4 of the circuit board 1250, the fourthsupporting member 1220-4, the fourth upper elastic unit 1150-4, and thefourth terminal B4 of the circuit board 1190.

Each of the fifth and sixth terminals B5 and B6 of the circuit board1190 may be connected or coupled to the second outer frame 1162-1 of acorresponding one of the first and second lower elastic units 1160-1 and1160-2.

The second outer frame 1162-1 of the first lower elastic unit 1160-1 mayhave a first bonding portion 1081 a, to which the fifth terminal B5 ofthe circuit board 1190 is coupled using solder or a conductive adhesivemember. In addition, the second outer frame 1162-1 of the second lowerelastic unit 1160-2 may have a second bonding portion 1081 b, to whichthe sixth terminal B6 of the circuit board 1190 is coupled using solderor a conductive adhesive member.

For example, the second outer frame 1162-1 of the first lower elasticunit 1160-1 may have a first hole 1082 a (or a first recess), into whichthe fifth terminal B5 of the circuit board 1190 is inserted or disposed,and the second outer frame 1162-1 of the second lower elastic unit1160-2 may have a second hole 1082 b (or a second recess), into whichthe sixth terminal B6 of the circuit board 1190 is inserted or disposed.

For example, each of the first and second holes 1082 a and 1082 b may beformed through the second outer frame 1162-1, and may have an openingformed in one surface of the second outer frame 1162-1. However, thedisclosure is not limited thereto. In another embodiment, each of thefirst and second holes may not have an opening formed in one surface ofthe second outer frame 1162-1.

Since, in the state in which the fifth terminal B5 (or the sixthterminal B6) of the circuit board 1190 is inserted into the first recess1082 a (or the second recess 1082 b) of the second outer frame 1162-1 ofthe first lower elastic unit 1160-1, the fifth terminal B5 (or the sixthterminal B6) is coupled to the first bonding portion 1081 a (or thesecond bonding portion 1081 b), in which the first recess 1082 a (or thesecond recess 1082 b) is provided, using solder or a conductive adhesivemember, coupling area may be increased, whereby adhesive force andsolderability therebetween may be improved.

Referring to FIG. 28 , one end (for example, the lower end or the lowersurface) of each of the fifth and sixth terminals B5 and B6 may belocated lower than the lower end or the lower surface of the secondouter frame 1162-1 of a corresponding one of the first and second lowerelastic units 1160-1 and 1160-2. Since FIG. 28 is a bottom view, thelower surface of each of the fifth and sixth terminals B5 and B6 may beshown as being located lower than the lower end or the lower surface ofthe second outer frame 1162-1. This configuration is provided to improvesolderability between one end of each of the fifth and sixth terminalsB5 and B6 and the first and second bonding portions 1081 a and 1081 b ofthe first and second lower elastic units 1160-1 and 1160-2.

In addition, referring to FIG. 28 , the housing 1140 may include arecess 1031 recessed from the lower surface of the first side portion1141-1. For example, the bottom surface of the recess 1031 of thehousing 1140 may have a lower surface and a terminal of the housing 1140in the optical-axis direction. For example, the bottom surface of therecess 1031 of the housing 1140 may be located higher than the lowersurface of the housing 1140.

The recess 1031 of the housing 1140 may overlap the first and secondbonding portions 1081 a and 1081 b of the first and second lower elasticunits 1160-1 and 1160-2 in the optical-axis direction.

In addition, the recess 1031 of the housing 1140 may overlap the holes1082 a and 1082 b of the second outer frames 1161-1 of the first andsecond lower elastic units 1160-1 and 1160-2 in the optical-axisdirection.

It is possible to increase the area by which the fifth and sixthterminals B5 and B6 of the circuit board 1190 are open from the housingand to secure a space in which solder or a conductive adhesive membercan be settled by the provision of the recess 1031 of the housing 1140,whereby it is possible to improve solderability. In addition, it ispossible to reduce the extent to which the solder protrudes under thelower surface of the second outer frame 1162-1, whereby it is possibleto inhibit or prevent spatial interference with the second coil 1230,the circuit board 1250, or the base 1210 disposed under the lowerelastic unit.

In addition, the lower surface 1011 c of the first magnet 1130 disposedat the settlement portion 1141 a of the housing 1140 may be locatedlower than the lower surfaces of the second outer frames 1162-1 to1162-3 of the first and second lower elastic units 1160-1 and 1160-2.However, the disclosure is not limited thereto. In another embodiment,the lower surface 1011 c of the first magnet 1130 may have a heighthigher than or equal to the height of the lower surface 1011 c of thehousing 1140.

The other end of the supporting member 1220 may be coupled to thecircuit board 1250 (or the circuit member 1231) at a position lower thanthe lower surface 1011 c of the first magnet 1130 such that the firstmagnet 1130 is spaced apart from the second coil 1230 and the circuitboard 1250.

The supporting member 1220 may be realized as a member that isconductive and is capable of performing a supporting function based onelasticity, such as a suspension wire, a leaf spring, or a coil spring.Also, in another embodiment, the supporting member may be formedintegrally with the upper elastic member 1150.

In another embodiment, the description of the upper elastic member 1150,the lower elastic member 1160, and the supporting member 1220 may beapplied to the upper elastic member 150, the lower elastic member 160,and the supporting member 220 of FIG. 1 , and vice versa.

Next, the base 1210, the circuit board 1250, and the second coil 1230will be described.

Referring to FIG. 29 , the base 1210 may have an opening correspondingto the opening of the bobbin 1110 and/or the opening of the housing1140, and may be configured in a shape coinciding with or correspondingto the shape of the cover member 1300, such as a quadrangular shape. Forexample, the opening of the base 1210 may be a through hole formedthrough the base 1210 in the optical-axis direction.

The base 1210 may be provided with a stair 1211, which may be coatedwith an adhesive when fixing the cover member 1300 by adhesion. In thiscase, the stair 1211 may guide the side plate of the cover member 1300coupled to the upper side thereof, and the lower end of the side plateof the cover member 1300 may contact the stair 1211. The stair 1211 ofthe base 1210 may be fixed to the lower end of the side plate of thecover member 1300 by adhesion using an adhesive.

A prop portion 1255 may be provided at a region of the base 210 facing aterminal surface 1253 of the circuit board 1250 at which the terminals1251-1 to 1251-n are provided. The prop portion 1255 may support theterminal surface 1253 of the circuit board 1250 at which the terminals1251-1 to 1251-n of the circuit board 1250 are formed.

The base 1210 may be provided in the corner regions thereofcorresponding to the corners of the cover member 1300 with concaverecesses 1212. In the case in which the corners of the cover member 1300protrude, protrusions of the cover member 1300 may be fastened to thebase 1210 in second concave recesses 1212.

In addition, the base 1210 may be provided in the upper surface thereofwith settlement recesses 1215-1 and 1215-2, in which the second positionsensor 1240 is disposed. A settlement portion (not shown), at which afilter 1610 of a camera module 200 is installed, may be formed in thelower surface of the base 1210.

In addition, the base 1210 may be provided at the upper surface aroundthe opening thereof with a protrusion 1019, which is coupled to theopening of the circuit board 1250 and the opening of the circuit member1231.

The second coil 1230 may be disposed at the upper portion of the circuitboard 1250, and OIS position sensors 1240 a and 1240 b may be disposedin the settlement recesses 1215-1 and 1215-2 of the base 1210 locatedunder the circuit board 1250.

The second position sensor 1240 may include first and second OISposition sensors 1240 a and 1240 b, and the OIS position sensors 1240 aand 1240 b may sense displacement of an OIS operation unit in adirection perpendicular to the optical axis. Here, the OIS operationunit may include the AF operation unit and components mounted to thehousing 1140.

For example, the OIS operation unit may include the AF operation unitand the housing 1140. In some embodiments, the first magnets 1130 may befurther included. For example, the AF operation unit may include thebobbin 1110 and components mounted to the bobbin 1110 so as to bemovable with the bobbin 1110. For example, the AF operation unit mayinclude the bobbin 1110 and the lens (not shown), the first coil 1120,the second magnet 1180, and the third magnet 1185 mounted to the bobbin1110.

The circuit board 1250 is disposed on the upper surface of the base1210, and may have an opening corresponding to the opening of the bobbin1110, the opening of the housing 1140, and/or the opening of the base1210. The opening of the circuit board 1250 may be a through hole.

The circuit board 1250 may be configured in a shape coinciding with orcorresponding to the shape of the upper surface of the base 1210, suchas a quadrangular shape.

The circuit board 1250 may be provided with at least one terminalsurface 1253 which is bent from the upper surface thereof and at which aplurality of terminals 1251-1 to 1251-n (n being a natural numbergreater than 1) or pins for receiving electrical signals from outside isprovided.

The second coil 1230 may be disposed under the bobbin 1110.

The second coil 1230 is disposed at the upper portion of the circuitboard 1250 so as to correspond to or be opposite the first magnets1130-1 to 1130-4 disposed at the housing 1140.

The second coil 1230 may be disposed so as to be opposite or overlap thefirst magnets 1130-1 to 1130-4 disposed at the corners 1142-1 to 1142-4of the housing 1140 in the optical-axis direction.

For example, the second coil 1230 may include a circuit member 1231 anda plurality of coil units 1230-1 to 1230-4 disposed or formed at thecircuit member 1231. Here, the circuit member 1231 may also be referredto as a “board,” a “circuit board,” or a “coil board.”

For example, the four coil units 1230-1 to 1230-4 may be disposed orformed at the corners or the corner regions of the polygonal (forexample, quadrangular) circuit member 1231.

For example, the second coil 1230 may include two coil units 1230-1 and1230-3 for the second direction and two coil units 1230-2 and 1230-4 forthe third direction. However, the disclosure is not limited thereto. Forexample, the coil units 1230-1 and 1230-3 may be disposed at two cornerregions of the circuit member 1231 facing each other in a first diagonaldirection of the circuit member 1231, and the coil units 1230-2 and1230-4 may be disposed at two corner regions of the circuit member 1231facing each other in a second diagonal direction of the circuit member1231. The first diagonal direction and the second diagonal direction mayperpendicular to each other.

In another embodiment, the second coil 1230 may include a single coilunit for the second direction and a single coil unit for the thirddirection, or may include four or more coil units.

A power or driving signal from the circuit board 1250 may be provided tothe second coil 1230. The power or driving signal provided to the secondcoil 1230 may be a direct-current signal or an alternating-currentsignal, or may include the direct-current signal and thealternating-current signal, and may have the form of voltage or current.

The housing 1140 may be moved in the second and/or third direction, e.g.in the x-axis and/or y-axis direction, due to interaction between thefirst magnets 1130-1 to 1130-4 and the second coils 1230-1 to 1230-4 towhich the driving signal is provided, whereby handshake compensation maybe performed.

The coil units 1230-1 to 1230-4 may be connected to corresponding onesof the terminals 1251-1 to 1251-n of the circuit board 1250 in order toreceive a driving signal from the circuit board 1250.

The circuit board 1250 may include pads 1027 a, 1027 b, 1028 a, and 1028b, which are connected to the coil units 1230-1 to 1230-4. Here, thepads 1027 a, 1027 b, 1028 a, and 1028 b may also be referred to as“terminals” or “bonding portions.”

For example, the two coil units 1230-1 and 1230-3 for the seconddirection may be connected to each other in series, one end of the coilunits 1230-1 and 1230-3 connected to each other in series may beconnected to the first pad 1027 a of the circuit board 1250, and theother end of the coil units 1230-1 and 1230-3 connected to each other inseries may be connected to the second pad 1028 a of the circuit board1250.

In addition for example, the two coil units 1230-2 and 1230-4 for thethird direction may be connected to each other in series, one end of thecoil units 1230-2 and 1230-4 connected to each other in series may beconnected to the third pad 1028 a of the circuit board 1250, and theother end of the coil units 1230-2 and 1230-4 connected to each other inseries may be connected to the fourth pad 1028 b of the circuit board1250.

The first and second pads 1027 a and 1027 b of the circuit board 1250may be connected to two corresponding ones of the terminals 1251-1 to1251-n of the circuit board 1250, and a first driving signal may beprovided to the coil units 1230-1 and 1230-3 connected to each other inseries via the two terminals of the circuit board 1250.

The third and fourth pads 1028 a and 1028 b of the circuit board 1250may be connected to corresponding two ones of the terminals 1251-1 to1251-n of the circuit board 1250, and a second driving signal may beprovided to the coil units 1230-1 and 1230-3 connected to each other inseries via the two terminals of the circuit board 1250.

In FIG. 29 , each of the coil units 1230-1 to 1230-4 is realized in theform of a circuit pattern, such as an FP coil, formed at the circuitmember 1231, rather than the circuit board 1250. However, the disclosureis not limited thereto. In another embodiment, each of the coil units1230-1 to 1230-4 may be realized in the form of a ring-shaped coil blockwith the circuit member 1231 omitted, or may be realized in the form ofa circuit pattern, such as an FP coil, formed at the circuit board 1250.

An escape recess 1024 for avoiding spatial interference with the fifthand sixth terminals B5 and B6 of the circuit board 1190 may be providedin the circuit member 1231. The escape recess 1024 may be formed in oneside of the circuit member 1231. For example, the escape recess 1024 maybe disposed between the first coil unit 1230-1 and the second coil unit1230-2.

The circuit board 1250 and the circuit member 1231 are separatecomponents, which are referred to individually. However, the disclosureis not limited thereto. In another embodiment, the circuit board 1250and the circuit member 1231 may be commonly referred to as a “circuitmember” or a “board.” In this case, the other end of each of thesupporting members may be coupled to the “circuit member” (for example,the lower surface of the circuit member).

In order to avoid spatial interference with the supporting member 1220,a hole 1023 (for example, a through hole), through which the supportingmember 1220 extends, may be provided in each corner of the circuitmember 1231. In another embodiment, a recess may be provided in eachcorner of the circuit member 1231 instead of the through hole.

Each of the OIS position sensors 1240 a and 1240 b may be a Hall sensor.Any sensor may be used as long as the sensor is capable of sensing theintensity of a magnetic field. For example, each of the OIS positionsensors 1240 a and 1240 b may be realized as a position detectionsensor, such as a Hall sensor, alone, or may be configured in the formof a driver including a Hall sensor.

Terminals 1251-1 to 1251-n may be provided at the terminal surface 1253of the circuit board 1250.

Signals SCL, SDA, VDD, and GND for data communication with the firstposition sensor 1190 may be transmitted and received through theterminals 1251-1 to 1251-n installed at the terminal surface 1253 of thecircuit board 1250, driving signals may be supplied to the OIS positionsensors 1240 a and 1240 b, and signals output from the OIS positionsensors 1240 a and 1240 b may be received and output to the outside.

According to the embodiment, the circuit board 1250 may be a flexibleprinted circuit board (FPCB). However, the disclosure is not limitedthereto. The terminals of the circuit board 1250 may be directly formedon the surface of the base 1210 using a surface electrode method or thelike.

The circuit board 1250 may include holes 1250 a through which thesupporting members 1220-1 to 1220-4 extend. The position and number ofholes 1250 a may correspond to or coincide with the position and numberof supporting members 1220-1 to 1220-4.

The supporting members 1220-1 to 1220-4 may extend through the holes1250 a of the circuit board 1250 and may be connected to the pads (orthe circuit patterns) formed on the lower surface of the circuit board1250 using solder or a conductive adhesive member. However, thedisclosure is not limited thereto.

In another embodiment, the circuit board 1250 may have no holes, and thesupporting members 1220-1 to 1220-4 may be connected to the circuitpatterns or the pads formed on the upper surface of the circuit board1250 using solder or a conductive adhesive member.

Alternatively, in another embodiment, the supporting members 1220-1 to1220-4 may connect the upper elastic units 1150-1 to 1150-4 to thecircuit member 1231, and the circuit member 1231 may be connected to thecircuit board 1250.

Since a driving signal is directly provided from the first positionsensor 1170 to the first coil 1120 in the embodiment, it is possible toreduce the number of supporting members and to simplify the connectionstructure, compared to the case in which a driving signal is directlyprovided to the first coil 1120 through the circuit board 1250.

In addition, since the first position sensor 1170 may be realized as adriver IC capable of measuring temperature, the output of the Hallsensor may be compensated so as to have the minimum change depending ona change in temperature, or the output of the Hall sensor may becompensated so as to have a uniform gradient depending on a change intemperature, whereby it is possible to improve accuracy of AF drivingirrespective of a change in temperature.

In another embodiment, the description of the base 1210, the circuitboard 1250, and the second coil 1230 may be applied to the base 210, thecircuit board 250, and the second coil 230 of FIG. 1 , and vice versa.

The cover member 1300 receives the bobbin 1110, the first coil 1120, thefirst magnet 1130, the housing 1140, the upper elastic member 1150, thelower elastic member 1160, the first position sensor 1170, the secondmagnet 1180, the circuit board 1190, the supporting member 1220, thesecond coil 1230, the second position sensor 1240, and the circuit board1250 in a receiving space formed together with the base 1210.

The cover member 1300 may be formed in the shape of a box, the lowerportion of which is open and which includes an upper plate and sideplates. The lower portion of the cover member 1300 may be coupled to theupper portion of the base 1210. The shape of the upper plate of thecover member 1300 may be polygonal, e.g. quadrangular or octagonal.

The cover member 1300 may be provided in the upper plate thereof with anopening, through which a lens (not shown) coupled to the bobbin 1110 isexposed to external light. The cover member 1300 may be made of anonmagnetic material, such as SUS, in order to prevent a phenomenon inwhich the first magnet 1130 attracts the cover member. Alternatively,the cover member may be made of a magnetic material so as to perform thefunction of a yoke that increases electromagnetic force between thefirst coil 1120 and the first magnet 1130.

FIG. 31 shows arrangement of the first magnets 1130 (1130-1 to 1130-4),the second and third magnets 1180 and 1185, the first position sensor1170, the capacitor 1195, and the circuit board 1190, and FIG. 32 is aside view of FIG. 31 .

Referring to FIGS. 31 and 32 , the first magnet 1130-1 may be configuredsuch that the transverse length of the first magnet 1130-1 increases andthen decreases in the direction from the first surface 1011 a of thefirst magnet 1130-1 to the second surface 1011 b of the first magnet1130-1.

For example, the first magnet 1130 may include a first portion Q1 havinga transverse length L1 gradually increasing in the direction from thefirst surface 1011 a of the first magnet 1130 to the second surface 1011b of the first magnet 1130-1 and a second portion Q2 having a transverselength L2 gradually decreasing in the direction from the first surface1011 a to the second surface 1011 b.

The first portion Q1 of the first magnet 1130 may include the firstsurface 1011 a or may abut the first surface 1011 a. The second portionQ2 of the first magnet 1130 may include the second surface 1011 b or mayabut the second surface 1011 b.

The reason that the transverse length L2 of the second portion Q2 of thefirst magnet 1130 decreases is that the first magnet 1130 is disposed ineach of the corners 1142-1 to 1142-4 of the housing 1140.

The reason that the length of the first portion Q1 of the first magnet1130 decreases is that it is necessary to prevent the first magnet 1130settled at the settlement portion 1141 a of the housing 1140 from beingseparated to the inside the housing 1140. In addition, since thetransverse length L1 of the first portion Q1 gradually decreases in thedirection from the second surface 1011 b to the first surface 1011 a,the effect of magnetic field interference between the first magnet 1130and the second magnet 1180 and magnetic field interference between thefirst magnet 1130 and the third magnet 1185 may be reduced.

The length d1 of the first portion Q1 of the first magnet 1130 in thedirection from the first surface 1011 a to the second surface 1011 b maybe smaller than the length d2 of the second portion Q2 of the firstmagnet 1130 in the direction from the first surface 1011 a to the secondsurface 1011 b (d1<d2). In the case in which d1>d2, the area of thefirst surface 1011 a may be reduced, whereby electromagnetic force dueto interaction between the first coil 1120 and the first magnet 1130 maybe reduced and thus desired electromagnetic force may not be secured.

For example, the first to fourth terminals B1 to B4 of the circuit board1190 may be located higher than the upper surface 1011 d of the firstmagnet 1130.

In addition, for example, the fifth and sixth terminals B5 and B6 of thecircuit board 1190 may be located between two first magnets 1130-1 and1130-2 disposed at two corners 1142-1 and 1142-2 of the housing 1140adjacent to the first side portion 1141-1 of the housing 1140, at whichthe first position sensor 1170 is disposed.

The upper surface of the first position sensor 1170 may be locatedhigher than the upper surface 1011 d of the first magnet 1130, and thelower surface of the first position sensor 1170 may be located equal toor higher than the upper surface 1011 d of the first magnet 1130. Inanother embodiment, the lower surface of the first position sensor 1170may be located lower than the upper surface of the first magnet 1130.

The first terminal B1 of the circuit board 1190 may overlap the firstmagnet 1130-1 disposed in the first corner 1142-1 of the housing 1140 inthe optical-axis direction, and the second terminal B2 of the circuitboard 1190 may overlap the first magnet 1130-2 disposed in the secondcorner 1142-2 of the housing 1140 in the optical-axis direction.

In addition, for example, at the initial position of the bobbin 1110,the upper surface of the second magnet 1180 (and/or the upper surface ofthe third magnet 1185) may be located higher than the upper surface 1011d of the first magnet 1130, and the lower surface of the second magnet1180 (and/or the lower surface of the third magnet 1185) may be locatedlower than the upper surface 1011 d of the first magnet 1130.

In another embodiment, the lower surface of the second magnet 1180(and/or the lower surface of the third magnet 1185) may be locatedhigher than or equal to the upper surface 1011 d of the first magnet1130.

The following construction may be provided in order to reduce the lengthof a path along which power signals GND and VDD are transmitted to thefirst position sensor 1170.

First, the first and second terminals B1 and B2 of the circuit board1190 for providing the power signals GND and VDD may be connected to thefirst and second supporting members 1220-1 and 1220-2 disposed at twocorners 1142-1 and 1142-1 adjacent to the first side portion 1141-1 ofthe housing 1140, at which the first position sensor 1170 is disposed,whereby the length of the path may be reduced.

In addition, the first and second terminals B1 and B2 of the circuitboard 1190 may be disposed at the body portion S1 of the circuit board1190, whereby the length of the path may be reduced.

In addition, the first terminal B1 of the circuit board 1190 may bedisposed at one end of the circuit board 1190 such that the firstterminal B1 overlaps the first corner 1142-1 of the housing 1140 in theoptical-axis direction, and the second terminal B2 of the circuit board1190 may be disposed at the other end of the circuit board 1190 suchthat the second terminal B2 overlaps the second corner 1142-2 of thehousing 1140 in the optical-axis direction, whereby the length of thepath may be reduced.

In addition, the distance (for example, the shortest distance) betweenthe first terminal B1 of the circuit board 1190 and the first supportingmember 1220-1 is smaller than the distance (for example, the shortestdistance) between the third terminal B3 of the circuit board 1190 andthe first supporting member 1220-1 and the distance (for example, theshortest distance) between the fourth terminal B4 of the circuit board1190 and the first supporting member 1220-1.

In addition, the distance (for example, the shortest distance) betweenthe second terminal B2 of the circuit board 1190 and the secondsupporting member 1220-2 is smaller than the distance (for example, theshortest distance) between the third terminal B3 of the circuit board1190 and the second supporting member 1220-2 and the distance (forexample, the shortest distance) between the fourth terminal B4 of thecircuit board 1190 and the second supporting member 1220-2.

As the length of the path is reduced for the above reasons, the lengthof each of the first and second extension portions P1 and P2 may bereduced, whereby resistance of the path (for example, resistance of thefirst and second upper elastic units 1150-1 and 1150-2) may be reduced.

In addition, each of the first upper elastic unit 1150-1 connected tothe first terminal B1 of the circuit board 1190 and the second upperelastic unit 1150-2 connected to the second terminal B2 has the firstouter frame coupled to the housing 1140 but does not have the firstinner frame 1151 and the first frame connection portion, wherebyresistance may be reduced compared to the third and fourth upper elasticunit 1150-3 and 1150-4.

As the length of the path along which the power signals GND and VDD aretransmitted to the first position sensor 1170 is reduced for the abovereasons in the embodiment, resistance of the path (for example,resistance of the first and second upper elastic units 1150-1 and1150-2) may be reduced, whereby it is possible to prevent reduction inthe power signals GND and VDD, to reduce power consumption, and toreduce operating voltage of the driver IC of the first position sensor1170.

In the embodiment, in order to easily perform soldering for couplingwith the first to fourth extension portions P1 to P4 of the upperelastic units 1150-1 to 1150-4 and thus to improve solderability, thefirst to sixth terminals P1 to P6 may be disposed at the first surface1019 b of the circuit board 1190.

If the first to sixth terminals P1 to P6 are disposed at the secondsurface 1019 a of the circuit board 1190, soldering may be difficult,solderability may be deteriorated, and foreign matter due to soldering(for example, contaminants) may be introduced into the lens movingapparatus 1100, whereby the lens moving apparatus 1100 may malfunction.

Since the third and fourth terminals B3 and B4 are disposed between thefirst terminal B1 and the second terminal B2, and the circuit board 1190extends or protrudes to the first corner 1142-1 or the second corner1142-2 of the housing 1140 in order to reduce the length of the path, aportion of each of the third upper elastic unit 1150-3 and the fourthupper elastic unit 1150-4 (for example, the third extension portion P3or the fourth extension portion P4) may be coupled to the third andfourth terminals B3 and B4 through the circuit board 1190.

The fifth and sixth terminals B5 and B6 of the circuit board 1190 may bedisposed at the extension portion S2 of the circuit board 1190 so as tobe easily coupled to the lower elastic units 1160-1 and 1160-2.

Since magnetic field interference between the second and third magnets1180 and 1185 and the first magnet 1130 is alleviated in the embodiment,it is possible to prevent a reduction in AF driving force due tomagnetic field interference and thus to obtain desired AF driving forcewithout a separate yoke.

In the embodiment, as described above, it is possible to reduce thenumber of supporting members and to reduce the size of the lens movingapparatus as the result of reducing the number of supporting members.

In addition, since the number of supporting members is reduced, it ispossible to reduce resistance of the supporting members, whereby it ispossible to reduce consumption of current and to improve sensitivity ofOIS driving.

In addition, it is possible to increase the thickness of the supportingmembers in order to obtain the same elastic force instead of reducingthe number of supporting members, and it is possible to reduce theinfluence of external impact on the OIS operation unit as the thicknessof the supporting members is increased.

FIG. 33 is a perspective view of a lens moving apparatus 2100 accordingto another embodiment, FIG. 34 is an exploded view of the lens movingapparatus 2100 shown in FIG. 33 , and FIG. 35 is an assembled view ofthe lens moving apparatus 2100 of FIG. 33 with a cover member 2300removed.

Referring to FIGS. 33 to 35 , the lens moving apparatus 2100 may includea bobbin 2110, a first coil 2120, a magnet 2130, a housing 2140, anupper elastic member 2150, a lower elastic member 2160, and a coil chip2170.

In addition, the lens moving apparatus 2100 may further include acircuit board 2250 connected to the first coil 2120 and the coil chip2170.

In addition, the lens moving apparatus 2100 may further include asupporting member 2220 and a base 2210.

In addition, the lens moving apparatus 2100 may further include a secondcoil 2230 for optical image stabilizer (OIS) driving, and may furtherinclude a second position sensor 2240 for OIS feedback driving.

In addition, the lens moving apparatus 2100 may further include a covermember 2300.

The cover member 2300 will be described.

The cover member 2300 receives the other components 2110, 2120, 2130,2140, 2150, 2160, 2170, 2220, 2230, and 2250 in a receiving space formedtogether with the base 2210.

The cover member 2300 may be formed in the shape of a box, the lowerportion of which is open and which includes an upper plate and sideplates. The lower portion of the cover member 2300 may be coupled to thebase 2210. The shape of the upper plate of the cover member 2300 may bepolygonal, e.g. quadrangular or octagonal.

The cover member 2300 may be provided in the upper plate thereof with anopening, through which a lens (not shown) coupled to the bobbin 2110 isexposed to external light. The cover member 2300 may be made of anonmagnetic material, such as SUS in order to prevent a phenomenon inwhich the magnet 2130 attracts the cover member. Alternatively, thecover member may be made of a magnetic material so as to perform thefunction of a yoke that increases electromagnetic force between thefirst coil 2120 and the magnet 2130.

Next, the bobbin 2110 will be described.

A lens or a lens barrel may be mounted to the bobbin 2110, and thebobbin is disposed in the housing 2140. The bobbin 2110 may have anopening, in which the lens or the lens barrel is mounted. The shape ofthe opening of the bobbin 110 may be circular, oval, or polygonal.However, the disclosure is not limited thereto.

FIG. 36A is a perspective view of the bobbin 2110 shown in FIG. 34 , andFIG. 36B is a bottom perspective view of the bobbin 2110 and the firstcoil 2120.

Referring to FIGS. 36A and 36B, the bobbin 2110 may include a firstprotrusion 2111 protruding from the upper surface thereof in the firstdirection and a second protrusion 2112 protruding from the outer surface2110 b of the bobbin 2110 in the second and/or third direction.

The bobbin 2110 may include first side portions 2110 b-1 and second sideportions 2110 b-2.

Each of the first side portions 2110 b-1 of the bobbin 2110 maycorrespond to or be opposite the magnet 2130. Each of the second sideportions 2110 b-2 of the bobbin 2110 may be disposed between twoadjacent first side portions.

The first protrusion 2111 of the bobbin 2110 may include a first guideportion 2111 a and a first stopper 2111 b. The first guide portion 2111a of the bobbin 2110 may guide the installation position of a firstframe connection portion 2153 of the upper elastic member 2150, or maysupport a damper located between the first frame connection portion 2153and the bobbin 2110.

The second protrusion 2112 of the bobbin 2110 may be formed so as toprotrude from the outer surface of each of the first side portions 2110b-1 of the bobbin 2110 in a direction perpendicular to the optical axisOA or in the second and/or third direction.

The first stopper 2111 b and the second protrusion 2112 of the bobbin2110 may serve to prevent the upper surface and/or the side surface ofthe bobbin 2110 from directly colliding with the inside of the covermember 2300 even in the case in which the bobbin 2110 is moved beyond apredetermined range due to external impact when the bobbin 2110 is movedin the first direction in order to perform an autofocus function.

The bobbin 2110 may include a third protrusion 2115 protruding from theouter surface of each of the second side portions 2110 b-2 in adirection perpendicular to the optical axis OA. For example, the bobbin2110 may include two third protrusions 2115 provided at two facingsecond side portions 2110 b-2.

The third protrusion 2115 of the bobbin 2110 may correspond to a recess2025 a of the housing 2140, may be inserted into or disposed in therecess 2025 a of the housing 2140, and may inhibit or prevent the bobbin21110 from being rotated about the optical axis while deviating from apredetermined range.

The bobbin 2110 may have a second stopper 2116 protruding from the lowersurface thereof, and the second stopper 2116 may serve to prevent thelower surface of the bobbin 2110 from directly colliding with the base2210, the second coil 2230, or the circuit board 2250 even in the casein which the bobbin 2110 is moved beyond the predetermined range due toexternal impact when the bobbin 2110 is moved in the first direction inorder to perform the autofocus function.

The bobbin 2110 may have at least one first coil recess (not shown), inwhich the first coil 2120 is disposed or installed. For example, thefirst coil recess may be provided in the first side portions 2110 b-1and the second side portions 2110 b-2 of the bobbin 2110. However, thedisclosure is not limited thereto.

The shape and number of the first coil recesses may correspond to theshape and number of the first coils 2120 disposed at the outer surfaceof the bobbin 2110. For example, the first coil recesses provided in thefirst side portions 2110 b-1 and the second side portions 2110 b-2 ofthe bobbin 2110 may be ring-shaped. However, the disclosure is notlimited thereto.

In addition, the bobbin 2110 may have a first recess 2012 a and a secondrecess 2012 b provided in the outer surface thereof so as to be spacedapart from each other. For example, the first recess 2012 a and thesecond recess 2012 b may be provided in the outer surface of the firstside portion and the outer surface of the second side portion.

The first recess 2012 a and the second recess 2012 b may be located atthe upper side of the coil 2120 disposed at the bobbin 2110, and may beconnected to the first coil recess.

A first portion extending from one end of the first coil 2120 disposedat the outer surface of the bobbin 2110 may be disposed in the firstrecess 2012 a, and a second portion extending from the other end of thefirst coil 2120 disposed at the outer surface of the bobbin 2110 may bedisposed in the second recess 2012 b.

In this case, the first portion of the first coil 2120 may extend to theupper surface of the bobbin 2110 so as to be connected to a first outerframe 2151 of a first upper spring 2150-1, and the second portion of thefirst coil 2120 may extend to the upper surface of the bobbin 2110 so asto be connected to a second outer frame 2151 of a second upper spring2150-2.

In the embodiment, the first coil 2120 extends to the upper surface ofthe bobbin 2110 for connection with the first and second upper springs.However, the disclosure is not limited thereto. In another embodiment,the first and second recesses may be located under the coil 2120, thefirst and second portions of the coil may extend to the lower surface ofthe bobbin 2110 and may be connected to lower springs of the lowerelastic member.

In another embodiment, the bobbin 2110 may have no first coil recess,and the first coil 2120 may be directly wound around the outer surfaceof the bobbin 2110 and may be fixed thereto.

In addition, the bobbin 2110 may be provided at the upper surfacethereof with a first upper protrusion 2113, which is coupled to a hole2151 a of a first inner frame 2151.

The first upper protrusion 2113 may be provided at the upper surface ofeach of the first side portions 2110 b-1 of the bobbin 2110. However,the disclosure is not limited thereto.

The bobbin 2110 may be provided at the lower surface thereof with afirst lower protrusion 2117, which is coupled and fixed to a hole 2161 aof the lower elastic member 2160.

A screw thread 2011 for coupling with the lens or the lens barrel may beprovided in the inner surface of the bobbin 2110. The screw thread 2011may be formed in the inner surface of the bobbin 2110 in the state inwhich the bobbin 2110 is fixed using a jig. Jig fixing recesses 2015 aand 2015 b may be provided in the upper surface of the bobbin 2110. Forexample, the jig fixing recesses 2015 a and 2015 b may be provided inthe upper surfaces of two facing second side portions 2110 b-2 of thebobbin 2110 at which the third protrusion 2115 is disposed. However, thedisclosure is not limited thereto.

Next, the first coil 2120 will be described.

The first coil 2120 may be a driving coil that is disposed at the outersurface of the bobbin 2110 and performs electromagnetic interaction withthe magnet 2130 disposed at the housing 2140.

In order to generate electromagnetic force due to interaction with themagnet 2130, a driving signal (e.g. driving current or voltage) may beapplied to the first coil 2120.

The driving signal applied to the first coil 2120 may be adirect-current signal or an alternating-current signal. For example, thedriving signal may have the form of current or voltage.

In order to generate induced voltage at the coil chip 2170 due to mutualinduction between the first coil 2120 and the coil chip 2170, thedriving signal applied to the first coil 2120 may include analternating-current signal.

For example, the driving signal may be a sinusoidal signal or a pulsesignal (for example, a pulse width modulation (PWM) signal).

Alternatively, in another embodiment, the driving signal applied to thefirst coil 2120 may be an alternating-current signal.

An AF operation unit may be moved in the first direction, e.g. in theupward direction (a positive X-axis direction) or the downward direction(a negative X-axis direction) due to electromagnetic force caused byinteraction between the first coil 2120 and the magnet 2130. Theintensity and/or polarity (for example, the current flow direction) ofthe driving signal applied to the first coil 2120 may be controlled inorder to control intensity and/or direction of electromagnetic forcecaused by interaction between the first coil 2120 and the magnet 2130,whereby it is possible to control motion of the AF operation unit in thefirst direction and thus to perform an autofocus function.

The AF operation unit may include the bobbin 2110 elastically supportedby the upper elastic member 2150 and the lower elastic member 2160 andcomponents mounted to the bobbin 2110 so as to be movable with thebobbin 2110. For example, the AF operation unit may include the bobbin2110 and the first coil 2120. In addition, for example, the AF operationunit may further include the lens (not shown) mounted to the bobbin2110.

The first coil 2120 may be disposed at the bobbin 2110 so as to have aclosed-loop shape. For example, the first coil 2120 may be wound ordisposed around the outer surface of the bobbin 2110 in the clockwisedirection or in the counterclockwise direction about the optical axis.In another embodiment, the first coil 2120 may be realized so as to havethe shape of a coil ring wound or disposed in the clockwise direction orin the counterclockwise direction about an axis perpendicular to theoptical axis OA. The number of coil rings may be equal to the number ofmagnets 2130. However, the disclosure is not limited thereto.

The first coil 2120 may be connected to at least one of the upperelastic member 2150 or the lower elastic member 2160, and may beconnected to the circuit board 2250 via the upper elastic member 2150 orthe lower elastic member 2160 and the supporting member 2220.

For example, the first coil 2120 may be connected to a first inner frame2151 of each of third and fourth upper springs 2150-3 and 2150-4, andmay be connected to the circuit board 2250 via third and fourthsupporting members 2220-3 and 2220-4.

The housing 2140 receives the bobbin 2110, at which the first coil 2120is mounted or disposed, therein.

FIG. 37A is a first perspective view of the housing 2140 shown in FIG.34 , FIG. 37B is a second perspective view of the housing 2140 shown inFIG. 37A, FIG. 38A is a perspective view of the upper elastic member2150, FIG. 38B is a perspective view of the lower elastic member 2160,FIG. 39 shows the housing 2140, the upper elastic member 2150, and thecoil chip 2170, FIG. 40 is an enlarged view of the coil chip 2170 shownin FIG. 39 , FIG. 41 is a perspective view of the upper elastic member2150, the lower elastic member 2160, the coil chip 2170, the supportingmember 2220, the second coil 2230, the circuit board 2250, and the base2210 of FIG. 34 , FIG. 42 is a separated perspective view of the base2210, the circuit board 2260, and the second coil 2230 of FIG. 34 , andFIG. 43 is a sectional view of the lens moving apparatus 2100 shown inFIG. 35 in an AB direction.

Referring to FIGS. 37A and 37B, the housing 2140 may generally have theform of an open pillar, and may include a plurality of first sideportions 2141 and second side portions 2142 defining an opening.

For example, the housing 2140 may include first side portions 2141spaced apart from each other and second side portions 2142 spaced apartfrom each other, and each of the first side portions 2141 may bedisposed or located between two adjacent second side portions 2142, andmay interconnect the second side portions 2142.

The second side portions 2142 of the housing 2140 may referred to as“corners” in that the second side portions 2142 of the housing 2140 maybe located at corner regions of the housing 2140.

For example, in FIG. 37A, the first side portions 2141 of the housing2140 may include a first side portion, a second side portion, a thirdside portion, and a fourth side portion, and the corners of the housing2140 may include a first corner 2501 a, a second corner 2501 b, a thirdcorner 2501 c, and a fourth corner 2501 d.

The first side portions 2141 of the housing 2140 may correspond to thefirst side portions 2110 b-1 of the bobbin 2110, and the second sideportions 2142 of the housing 2140 may correspond to the second sideportions 2110 b-2 of the bobbin 2110. However, the disclosure is notlimited thereto.

Magnets 2130 (2130-1 to 2130-4) may be disposed or installed at thefirst side portions 2141 of the housing 2140, and supporting members2220 (2220-1 to 2220-4) may be disposed at the second side portions 2142of the housing 2140.

The housing 2140 may have magnet settlement portions 2141 a provided atthe inner surfaces of the first side portions 2141 in order to supportor receive the magnets 2130 (2130-1 to 2130-4).

The housing 2140 may be provided in the first side portions 2141 thereofwith recesses or holes 2061 for injecting an adhesive used to attach themagnets 2130 to the magnet settlement portions 2141 a of the housing2140. For example, the holes 2061 may be through holes.

The first side portions 2141 of the housing 2140 may be disposedparallel to the side surface of the cover member 2300. Holes 2147 a,through which the supporting members 2220 extend, may be provided in thesecond side portions 2142 of the housing 2140.

For example, the diameter of each of the holes 2147 a may graduallyincrease in the direction from the upper surface to the lower surface ofthe housing 2140 for easy coating of a damper. However, the disclosureis not limited thereto. In another embodiment, the diameter of each ofthe holes 2147 a may be uniform.

In addition, a second stopper 2144 may be provided at the upper surfaceof the housing 2140 in order to prevent direct collision with the innersurface of the cover member 2300. For example, the second stopper 2144may be disposed at each of the first to fourth corners 2501 a to 2501 dof the housing 2140. However, the disclosure is not limited thereto.

In addition, the housing 2140 may be provided at the upper surfacethereof with a second guide portion 2146 for guiding the installationposition of the first outer frame 2152 of the upper elastic member 2150and preventing direct collision with the inner surface of the covermember 2300 when the upper elastic member 2150 is disposed at the uppersurface of the housing 2140. Referring to FIG. 43 , the height of thesecond guide portion 2146 is greater than the height of the secondstopper 2144. However, the disclosure is not limited thereto. In anotherembodiment, the height of the second guide portion 2146 and the heightof the second stopper 2144 may be equal to each other, or the height ofthe second stopper 2144 is greater than the height of the second guideportion 2146.

The second guide portion 2146 may be disposed at each of the corners2501 a to 2501 d of the housing 2140 so as to be spaced apart from thesecond stopper 2144. For example, the second guide portion 2146 and thesecond stopper 2144 may face each other in a diagonal direction. Here,the diagonal direction may be a direction from the center of the housing2140 toward the second stopper 2144.

The housing 2140 may have at least one second upper protrusion 2143provided at the upper surfaces of the second side portions 2142 so as tobe coupled to holes 2152 a of the first outer frame 2152 of the upperelastic member 2150.

The second upper protrusion 2143 may be disposed at the upper surface ofat least one of the first to fourth corners 2501 a to 2501 d of thehousing 2140.

The second upper protrusion 2143 may be disposed on at least one of oneside or the other side of the second guide portion 2146 of the housing2140.

In addition, the housing 2140 may have at least one second lowerprotrusion 2145 provided at the lower surfaces of the second sideportions 2142 so as to be coupled and fixed to holes 2162 a of thesecond outer frame 2162 of the lower elastic member 2160. For example,the second lower protrusion 2145 may be disposed at the lower surface ofat least one of the first to fourth corners 2501 a to 2501 d of thehousing 2140. However, the disclosure is not limited thereto.

In order to define a path along which the supporting member 2220 extendsand to secure a space for filling with silicone capable of performing adamping function, the housing 2140 may have concave recesses 2142 aprovided in the lower portions of the second side portions 2142 thereof.For example, the concave recesses 2142 a of the housing 2140 may befilled with damping silicone.

The housing 2140 may have a third stopper 2149 provided at the outersurface of at least one of the first side portions 2141 thereof. Forexample, the third stopper 2149 may protrude in a directionperpendicular to the outer surface of the at least one first sideportion of the housing 2140. The third stopper 2149 is provided toprevent the outer surface of the first side portion 2141 of the housing2140 from directly colliding with the inner surface of the side plate ofthe cover member 2300 when the housing 2140 is moved in the seconddirection and/or the third direction.

In order to prevent the bottom surface of the housing 2140 fromcolliding with the base 2100, the second coil 2230, and/or the circuitboard 2250, a description of which will follow, the housing 2140 mayfurther have a fourth stopper (not shown) protruding from the lowersurface of the housing 2140.

In order to avoid spatial interference with the coil chip 2170, thehousing 2140 may have a first recess 2024 a provided in the innersurface of one of the corners 2501 a to 2501 d (for example, 2501 a)thereof.

The first recess 2024 a of the housing 2140 may include openings formedin the inner surface and the upper surface of the corner 2501 a of thehousing 2140.

The first recess 2024 a may be disposed in the upper surface of a corner2510 a of the housing 2140 corresponding to the position between thefirst upper spring 2150-1 and the second upper spring 2150-2, adescription of which will follow.

For example, the first recess 2024 a may be disposed in the uppersurface of the corner 2510 a of the housing 2140 corresponding to theposition between a first extension portion P1 of the first upper spring2150-1 and a second extension portion P2 of the second upper spring2150-2.

As shown in FIG. 39 , the transverse length of the first recess 2024 aof the housing 2140 may be larger than the transverse length of the coilchip 2170, and the longitudinal length of the first recess 2024 a of thehousing 2140 may be larger than the longitudinal length of the coil chip2170. The transverse direction of the first recess 2024 a may be adirection parallel to the transverse direction of the inner surface ofthe corner 2501 a of the housing 2140, and the longitudinal direction ofthe first recess 2024 a may be a direction parallel to the longitudinaldirection of the inner surface of the corner 2501 a of the housing 2140.

The housing 2140 may have a second recess 2025 a provided in the innersurface of each of the second side portions 2141 or the corners 2501 ato 2501 d so as to correspond to the third protrusion 2115 of the bobbin2110.

For example, the second recess 2025 a of the housing 2140 may beprovided in each of the inner surfaces of two facing corners 2501 b and2501 d, among the corners 2501 a to 2501 d. The second recess 2025 a maybe formed in each of the corners 2501 b and 2501 d, not the corner 2501a of the housing 2140 in which the first recess 2024 a is formed.

In the embodiment shown in FIG. 37A, the first recess 2024 a and thesecond recess 2025 a may have the same shape. However, the disclosure isnot limited thereto. In another embodiment, the first recess and thesecond recess may have different shapes.

The housing 2140 may further have a third recess 2026 a provided in theinner surface of the corner 2501 c, which is opposite the corner 2501 aof the housing 2140 in which the first recess 2024 a is formed. Thethird recess 2026 a may have the same shape as the first recess 2024 aand may be disposed at corresponding positions for weight balance. Inanother embodiment, the third recess may be omitted.

Next, the magnet 2130 will be described.

At the initial position of the bobbin 2110, the magnet 2130 may bedisposed at each of the first side portions 2141 of the housing 2140such that at least a portion of the magnet overlaps the first coil 2120in a direction perpendicular to the optical axis OA or in the second orthird direction. For example, the magnet 2130 may be inserted into ordisposed in the settlement portion 2141 a of the housing 2140.

Here, the initial position of the bobbin 2110 may be the originalposition of the AF operation unit (for example, the bobbin) in the statein which no power or driving signal is applied to the first coil 2120 orthe position at which the AF operation unit is located as the result ofthe upper elastic member 2150 and the lower elastic member 2160 beingelastically deformed due only to the weight of the AF operation unit.

In addition, the initial position of the bobbin 2110 may be the positionat which the AF operation unit is located when gravity acts in thedirection from the bobbin 2110 to the base 2210 or when gravity acts inthe direction from the base 2210 to the bobbin 2110.

In another embodiment, the magnet 2130 may be disposed at the outersurface of each of the first side portions 2141 of the housing 2140.Alternatively, in another embodiment, the magnet may be disposed at theinner surface or the outer surface of each of the second side portions2142 of the housing 2140.

The magnet 2130 may have a shape corresponding to the shape of each ofthe first side portions 2141 of the housing 2140, such as a rectangularparallelepiped shape. However, the disclosure is not limited thereto.The surface of the magnet facing the first coil 2120 may be formed so asto correspond to or coincide with the curvature of a correspondingsurface of the first coil 2120.

The magnet 2130 may be a monopolar magnetized magnet configured suchthat a first surface thereof facing the coil 2120 has an N pole and asecond surface opposite the first surface has an S pole or a bipolarmagnetized magnet. However, the disclosure is not limited thereto. Theopposite configuration is also possible.

Alternatively, in another embodiment, the first surface and the secondsurface of the magnet 2130 may be divided into an N pole and an S pole.

For example, the magnet 2130 may be a bipolar magnetized magnet dividedinto two parts in a direction perpendicular to the optical axis. In thiscase, the magnet 2130 may be realized by a ferrite, alnico, orrare-earth magnet.

For example, the magnet 2130 having a bipolar magnetized structure mayinclude a first magnet portion including, a second magnet portionincluding, and a nonmagnetic partition. The first magnet portion and thesecond magnet portion may be spaced apart from each other, and thenonmagnetic partition may be located between the first magnet portionand the second magnet portion.

The nonmagnetic partition may be a portion having substantially nomagnetism, may include a section having little polarity, and may befilled with air or may be made of a nonmagnetic material.

In the embodiment, the number of magnets 2130 is four; however, thedisclosure is not limited thereto. The number of magnets 2130 may be twoor more, and the first surface of each magnet 2130 that faces the firstcoil 2120 may be planar; however, the disclosure is not limited thereto.The first surface of each magnet may be curved.

At least two magnets 2130 may be disposed at first side portions of thehousing 2140 that face each other, and may be disposed so as to faceeach other.

For example, magnets 2130-1 to 2130-4 may be disposed at the first sideportions 2141 of the housing 2140. Two pairs of magnets 2130-1 to 2130-4that face each other so as to intersect may be disposed at the firstside portions 2141 of the housing 2140. In this case, each of themagnets 2130-1 to 2130-4 may generally have a quadrangular shape.Alternatively, each magnet may have a triangular or rhombic shape.

In the embodiment shown in FIG. 37A, the magnets 2130-1 to 2130-4 aredisposed at the housing 2140. However, the disclosure is not limitedthereto.

In another embodiment, the housing 2140 may be omitted, and the magnets2130-1 to 2130-4 may be disposed at the cover member 2300. In a furtherembodiment, the housing 2140 may not be omitted, and the magnets 2130-1to 2130-4 may be disposed at the cover member 2300.

For example, in another embodiment, the magnets 2130-1 to 2130-4 may bedisposed at the side surfaces of the cover member 2300, e.g. the innersurfaces of the side surfaces thereof.

Next, the coil chip 2170 will be described.

The coil chip 2170 is also referred to as a “chip conductor,” isdisposed at the housing 2140, and is coupled to the upper elastic member2150.

For example, the coil chip 2170 may be disposed at the corner 2501 a ofthe housing 2140. That is, the coil chip 2170 may be located in thefirst recess 2024 a provided in the corner 2501 a of the housing 2140.

Referring to FIG. 39 , at the initial position of the bobbin 2110, thecoil chip 2170 may be located at the upper side of the first coil 2120based on the lower surface of the bobbin 2110.

At the initial position of the bobbin 2110, the coil chip 2170 may notoverlap the first coil 2120 in the optical-axis direction or the firstdirection.

In addition, at the initial position of the bobbin 2110, the coil chip2170 may not overlap the first coil 2120 in a direction perpendicular tothe optical axis.

In addition, the coil chip 2170 may be located under the first outerframe 2152 of each of the upper springs 2150-1 and 2150-2.

The coil chip 2170 may not overlap the magnet 2130 in the optical-axisdirection or the first direction. In addition, the coil chip 2170 maynot overlap the magnet 2130 in a direction perpendicular to the opticalaxis. The reason for this is that it is necessary to reduce interferencebetween induced voltage generated in the coil chip 2170 due to mutualinduction with the first coil 2120 and a line of magnetic force of themagnet 2130.

That is, the magnet may be disposed at the first side portion of thehousing 2140 and the coil chip 2170 may be disposed at the corner of thehousing 2140 such that the magnet 2130 and the coil chip 2170 are spacedapart from each other. In the embodiment, therefore, it possible toreduce the influence of the line of magnetic force of the magnet 2130 onthe induced voltage of the coil chip 2170, whereby it is possible toimprove the performance of AF operation.

In another embodiment, the coil chip 2170 may overlap the magnet 2130 ina direction perpendicular to the optical axis.

Referring to FIG. 40 , the coil chip 2170 may include a coil portion2171 including a coil and ferrite, a first electrode 2172 a connected toone end of the coil of the coil portion 2171, and a second electrode2172 b. In the first electrode 2172 a and the second electrode 2172 b,the “electrode” may also be referred to as a “pad,” a terminal, or alead.

The coil portion 2171 may have a structure in which a coil is woundaround a ferrite core or a structure in which a coil is patterned on aferrite sheet. However, the disclosure is not limited thereto. The coilportion may be realized in various forms.

The first electrode 2172 a may be connected to one end of the coilportion 2171, and the second electrode 2172 b may be connected to theother end of the coil portion 2171.

The coil chip 2170 may secure high inductance due to ferrite, and mayincrease the magnitude of voltage induced in the coil chip 2170 due tohigh inductance. Since high induced voltage is secured, it is possibleto more accurately sense displacement of the bobbin 2110, to easilycontrol AF driving, and to improve accuracy in AF feedback driving.

The frequency of a driving signal applied to the first coil 2120, e.g.the frequency of an alternating-current signal included in the drivingsignal, may be set to be lower than a self-resonant frequency of thecoil chip 2170.

Induced voltage is generated in the coil chip 2170 due to mutualinduction between the first coil 2120 to which the driving signal (forexample, driving current) is applied and the coil chip 2170.

The first coil 2120 may be moved together with the bobbin 2110 in thefirst direction due to electromagnetic force caused by electromagneticinteraction between current flowing in the first coil 2120 due to thedriving signal and the magnet 2130.

As the first coil 2120 is moved in the first direction, the distancebetween the first coil 2120 and the coil chip 2170 may vary, and as thedistance therebetween is changed, the magnitude of the voltage inducedin the coil chip 2170 may vary.

For example, as the distance between the first coil 2120 and the coilchip 2170 decreases, the induced voltage generated in the coil chip 2170may increase, and as the distance therebetween increases, the inducedvoltage generated in the coil chip 2170 may decrease.

Displacement of the bobbin 2110 may be sensed based on the magnitude ofthe voltage induced in the coil chip 2170, and the displacement of thebobbin 2110 or the driving signal may be feedback-controlled based onthe sensed displacement of the bobbin 2110.

The first electrode 2172 a and the second electrode 2172 b of the coilchip 2170 may be connected or bonded to the first outer frames 2152 ofthe first and second upper springs 2150-1 and 2150-2 of the upperelastic member 2150 via a conductive member, such as solder.

Next, the upper elastic member 2150, the lower elastic member 2160, andthe supporting member 2220 will be described.

The upper elastic member 2150 and the lower elastic member 2160 arecoupled to the bobbin 2110 and to the housing 2140, and support thebobbin 2110.

For example, the upper elastic member 2150 may be coupled to the upperportion, the upper surface, or the upper end of the bobbin 2110 and tothe upper portion, the upper surface, or the upper end of the housing2140, and the lower elastic member 2160 may be coupled to the lowerportion, the lower surface, or the lower end of the bobbin 2110 and tothe lower portion, the lower surface, or the lower end of the housing2140.

The supporting member 2220 may support the housing 2140 relative to thebase 2210, and may connect at least one of the upper elastic member 2150or the lower elastic member 2160 to the circuit board 2250.

Referring to FIGS. 38 a and 38 b , at least one of the upper elasticmember 2150 or the lower elastic member 2160 may be divided or separatedinto two or more parts.

For example, the upper elastic member 2150 may include first to fourthupper springs 2150-1 to 2150-4 spaced or separated from each other.

Each of the upper elastic member 2150 and the lower elastic member 2160may be realized as a leaf spring; however, the disclosure is not limitedthereto. Each elastic member may be realized as a coil spring or asuspension wire.

Each of the first to fourth upper springs 2150-1 to 2150-4 may include afirst inner frame 2151 coupled to the upper portion, the upper surface,or the upper end of the bobbin 2110, a first outer frame 2152 coupled tothe upper portion, the upper surface, or the upper end of the housing2140, and a first frame connection portion 2153 for interconnecting thefirst inner frame 2151 and the first outer frame 2152.

A hole 2151 a, to which the first coupling portion 2113 of the bobbin2110 is coupled, may be provided in the first inner frame 2151, and thehole 2151 a may have at least one cut portion 2016, through which anadhesive member or a damper permeates.

The first outer frame 2152 of each of the first to fourth upper springs2150-1 to 2150-4 may include a first coupling portion 2510 coupled to acorresponding one of the supporting members 1220-1 to 1220-4, a secondcoupling portion 2520 coupled to at least one of a corresponding one ofthe corners 2501 a to 2501 d of the housing 2140 and/or an edge adjacentthereto, and a connection portion 2530 for interconnecting the firstcoupling portion 2510 and the second coupling portion 2520.

The second coupling portion 2520 may include at least one couplingregion coupled to the corners 2501 a to 2501 d (for example, the secondupper protrusions 2143) of the housing 2140. For example, the at leastone coupling region may include holes 2152 a.

For example, the second coupling portion 2520 may include a firstcoupling region located at one side of the second guide portion 2146 ofthe housing 2140 and a second coupling region located at the other sideof the second guide portion 2146. However, the disclosure is not limitedthereto.

In the embodiment of FIG. 38A, each of the coupling regions of thesecond coupling portions 2520 of the first to fourth upper springs2150-1 to 2150-4 is realized as including a hole. However, thedisclosure is not limited thereto. In another embodiment, each of thecoupling regions may be realized in various forms sufficient to becoupled to the housing 2140, such as a recess.

For example, the holes 2152 a of the second coupling portion 2520 mayhave at least one cut portion, through which an adhesive member or adamper permeates gaps between the second upper protrusion 2143 and theholes 2152 a.

The first coupling portion 2510 may have a hole 2052, through which eachof the supporting members 2220-1 to 2220-4 extends. One end of each ofthe supporting members 2220-1 to 2220-4 that have extended through thehole 2052 may be coupled to the first coupling portion 2510 via aconductive adhesive member or solder 2901, and the first couplingportion 2510 may be connected to each of the supporting members 2220-1to 2220-4.

The second coupling portion 2510 is a region in which the solder 2901 isdisposed, and may include a hole 2052 and a region around the hole 2052.

The connection portion 2530 may interconnect the coupling region of thesecond coupling portion 2520 disposed at each of the corners 2501 a to2501 d and the first coupling portion 2510.

For example, the connection portion 2530 may include a first connectionportion 2530-1 for interconnecting the first coupling region of thefirst coupling portion 2520 of each of the first to fourth upper springs2150-1 to 2150-4 and the first coupling portion 2510 and a secondconnection portion 2530-2 for interconnecting the second coupling regionof the second coupling portion 2520 and the first coupling portion 2510.

The connection portion 2530 may include a bent portion that is bent atleast once or a curved portion that is curved at least once. However,the disclosure is not limited thereto. In another embodiment, theconnection portion may be straight.

The width of the connection portion 2530 may be smaller than the widthof the second coupling portion 2520, whereby the connection portion 2530may be easily moved in the first direction, and therefore stress appliedto the upper elastic member 2150 and stress applied to the supportingmember 2220 may be dispersed.

Also, in order to support the housing 2140 in a balanced state, theconnection portion 2530 may be symmetrical with respect to a referenceline 2102. However, the disclosure is not limited thereto. In anotherembodiment, the connection portion may not be symmetrical.

The reference line 2102 may be a straight line passing through a centralpoint 2101 (see FIG. 38A) and a corresponding one of the corners 2501 ato 2501 d of the housing 2140. Here, the central point 2101 may be thecenter of the housing 2140.

The first outer frame 2152 of each of the first and second upper springs2150-1 and 2150-2 may have extension portions P1 and P2 contacting orconnected to a corresponding one of the first and second electrodes 2172a and 2172 b of the coil chip 2170.

Each of the first and second upper springs 2150-1 and 2150-2 may haveextension portions P1 and P2 extending from the coupling region of thesecond coupling portion 2520 to the coil chip 2170 disposed at thecorner 2501 a of the housing 2140.

For example, the first extension portion P1 may directly contact thefirst electrode 2172 a of the coil chip 2170 and may be coupled orbonded to the first electrode 2172 a using solder, and the secondextension portion P2 may directly contact the second electrode 2172 b ofthe coil chip 2170 and may be coupled or bonded to the second electrode2172 b using solder.

Since the first and second upper springs 2150-1 and 2150-2 are bonded tothe first electrode 2172 a and the second electrode 2172 b of the coilchip 2170 using solder, it is possible to increase force of couplingbetween the coil chip 2170 and the upper elastic member 2150 and toprevent the occurrence of open circuit.

The lower elastic member 2160 may include a second inner frame 2161coupled to the lower portion, the lower surface, or the lower end of thebobbin 2110, a second outer frame 2162 coupled to the lower portion, thelower surface, or the lower end of the housing 2140, and a second frameconnection portion 2163 for interconnecting the inner frame 2161 and thesecond outer frame 2162.

In addition, the lower elastic member 2160 may have a hole 2161 aprovided in the second inner frame 2161 and coupled to the first lowerprotrusion 2117 of the bobbin 2110 via solder or a conductive adhesivemember, and a hole 2162 a provided in the second outer frame 2162 andcoupled to the second lower protrusion 2147 of the housing 2140

Each of the first and second frame connection portions 2153 and 2163 ofthe upper and lower elastic members 2150 and 2160 may be formed so as tobe bent or curved at least once in order to form a predeterminedpattern. Upward and/or downward movement of the bobbin 2110 in the firstdirection may be flexibly (or elastically) supported throughdisplacement and micro-scale deformation of the first and second frameconnection portions 2153 and 2163.

In order to absorb or buffer vibration of the bobbin 2110, the lensmoving apparatus 2100 may further have a first damper (not shown)disposed between each of the upper springs 2150-1 to 2150-4 and thehousing 2140.

For example, the first damper (not shown) may be disposed in a spacebetween the first frame connection portion 2153 of each of the uppersprings 2150-1 to 2150-4 and the housing 2140.

In addition, for example, the lens moving apparatus 2100 may furtherhave a second damper (not shown) disposed between the second frameconnection portion 2163 of the lower elastic member 2160 and the housing2140.

In addition, for example, the lens moving apparatus 2100 may furtherhave a third damper (not shown) disposed between the supporting member2220 and the hole 2147 a of the housing 2140.

In addition, for example, the lens moving apparatus 2100 may furtherhave a fourth damper (not shown) disposed between the first couplingportion 2510 and one end of the supporting member 2220, and may furtherhave a fifth damper (not shown) disposed between the other end of thesupporting member 2220 and the circuit board 2250.

In addition, a damper (not shown) may be further disposed between theinner surface of the housing 2140 and the outer circumferential surfaceof the bobbin 2110.

Next, the supporting member 2220 will be described.

One end of the supporting member 2220 may be coupled to the first outerframe 2151 of the upper elastic member 2150, and the other end of thesupporting member 2220 may be coupled to the circuit board 2250, viasolder or a conductive adhesive member.

A plurality of supporting members 2220 may be provided, and each of thesupporting members 2220-1 to 2220-4 may be coupled to the first couplingportion 2510 of a corresponding one of the upper springs 2150-1 to2150-4 via solder 2901 and may be connected to the first couplingportion 2510. For example, each of the supporting members 2220-1 to2220-4 may be disposed at a corresponding one of the four corners 2501 ato 2501 d.

The supporting members 2220-1 to 2220-4 may support the bobbin 2110 andthe housing 2140 such that the bobbin 2110 and the housing 2140 aremovable in a direction perpendicular to the first direction. In FIGS. 35and 41 , one supporting member is disposed at each of the edges 2142 orthe corners 2501 a to 2501 d of the housing 2140. However, thedisclosure is not limited thereto.

In another embodiment, two or more supporting members may be disposed atat least one of the second corners of the housing 2140.

Each of the supporting members 2220-1 to 2220-4 may be spaced apart fromthe housing 2140, and may be directly connected to the first couplingportion 2510 of the first outer frame 2152 of a corresponding one of theupper springs 2150-1 to 2150-4, rather than fixed to the housing 2140.

In another embodiment, the supporting member 2220 may be disposed ateach of the first side portions 2141 of the housing 2140 in the form ofa leaf spring.

A driving signal may be transmitted from the second circuit board 2250to the first coil 2120 via the supporting members 2220-1 to 2220-4 andthe upper springs 2150-1 to 2150-4, and induced voltage of the coil chip2170 may be transmitted to the circuit board 2250.

For example, induced voltage of the coil chip 2170 may be transmitted tothe circuit board 2250 via the first and second upper springs 2150-1 and2150-2 and the first and second supporting members 2220-1 and 2220-2.

In addition, for example, a driving signal may be transmitted from thecircuit board 2250 to the first coil 2120 via the third and fourth uppersprings 2150-3 and 2150-4 and the third and fourth supporting members2220-3 and 2220-4.

Each of the supporting members 2220-1 to 2220-4 may be formed of amember that is separate from the upper elastic member 2150, and may berealized as an elastic supporting member, such as a leaf spring, a coilspring, or a suspension wire. Also, in another embodiment, thesupporting members 2220-1 to 2220-4 may be integrally formed with theupper elastic member 2150.

The base 2210 may have an opening corresponding to the opening of thebobbin 2110 and/or the opening of the housing 2140, and may have a shapecoinciding with or corresponding to the shape of the cover member 2300,such as a quadrangular shape.

Referring to FIG. 42 , the base 2210 may have a stair 2211, which may becoated with an adhesive when fixing the cover member 2300 by adhesion.In this case, the stair 2211 may guide the cover member 2300 coupled tothe upper side thereof, and may face the lower end of the side plate ofthe cover member 2300.

The base 2210 may be disposed under the bobbin 2110 and the housing2140, and a supporting recess or prop portion 2255 may be formed at theside surface of the base 2210 facing the portion of the circuit board2250 at which a terminal 2251 is formed. The prop portion 2255 of thebase 2210 may support a terminal surface 2253 of the circuit board 2250.

The base 2210 may be provided in each corner thereof with a concaverecess 2212. In the case in which the corners of the cover member 2300protrude, protrusions of the cover member 2300 may be fastened to thebase 2210 in the concave recesses 2212. However, the disclosure is notlimited thereto. In another embodiment, the base 2210 may have noconcave recess 2212.

The base 2210 may be provided in the upper surface thereof withsettlement recesses 2215-1 and 2215-2, in which the position sensor 2240mounted at the circuit board 2250 may be disposed or settled. Accordingto the embodiment, two settlement recesses 2215-1 and 2215-2 may beprovided in the base 2210.

The second coil 2230 may be disposed at the upper portion of the circuitboard 2250, and the position sensor 2240 may be disposed at the lowerportion of the circuit board 2250.

For example, the position sensor 2240 may be disposed at the lowersurface of the circuit board 2250, and the lower surface of the circuitboard 2250 may be a surface that faces the upper surface of the base2210.

The circuit board 2250 may be located under the housing 2140, may bedisposed on the upper surface of the base 2210, and may have an openingcorresponding to the opening of the bobbin 2110, the opening of thehousing 2140, and/or the opening of the base 2210. The outercircumferential surface of the circuit board 2250 may be configured in ashape coinciding with or corresponding to the shape of the upper surfaceof the base 2210, such as a quadrangular shape.

The circuit board 2250 may be provided with at least one terminalsurface 2253 which is bent from the upper surface thereof and at which aplurality of terminals 2251 or pins for connection with the outside isprovided.

A plurality of terminals 251 may be installed at the terminal surface2253 of the circuit board 2250. For example, a driving signal fordriving the first coil 2120, the second coil 2230, and the positionsensor 2240 may be received through the terminals 2251 installed at theterminal surface 2253 of the circuit board 2250, and induced voltage ofthe coil chip 2170 may be output to the outside through the terminals2251.

According to the embodiment, the circuit board 2250 may be an FPCB.However, the disclosure is not limited thereto. The terminals of thecircuit board 2250 may be directly formed on the surface of the base2210 using a surface electrode method or the like.

The circuit board 2250 may include holes 2250 a through which thesupporting members 2220-1 to 2220-4 extend. The position and number ofholes 2250 a may correspond to or coincide with the position and numberof supporting members 2220-1 to 2220-4. Each of the supporting members2220-1 to 2220-4 may be disposed so as to be spaced apart from the innersurface of a corresponding one of the holes 2250 a of the circuit board2250.

The supporting members 2220-1 to 2220-4 may extend through the holes2250 a of the circuit board 2250 and may be connected to circuitpatterns disposed on the lower surface of the circuit board 2250 throughsoldering.

Also, in another embodiment, the circuit board 2250 may have no holes,and the supporting members 2220-1 to 2220-4 may be connected to circuitpatterns or pads formed on the upper surface of the circuit board 2250through soldering.

The second coil 2230 may be located under the housing 2140, and may bedisposed at the upper portion of the second circuit board 2250 so as tocorrespond to the magnet 2130 disposed at the housing 2140.

For example, the second coil 2230 may include four OIS coils 2230-1 and2230-4 disposed so as to correspond to four sides of the circuit board2250. However, the disclosure is not limited thereto. One coil for thesecond direction and one coil for the third direction may be installed,and four or more coils may be installed.

In FIG. 42 , the second coil 2230 is provided at a separate circuitmember 2231, rather than the circuit board 2250. However, the disclosureis not limited thereto. In another embodiment, the second coil 2230 maybe realized in the form of a circuit pattern formed at the circuit board1250.

Alternatively, in another embodiment, the circuit member 2231 may beomitted, and the second coil 2230 may be configured in the form of aring-shaped coil block or an FP coil, which is separate from the circuitboard 2250.

An escape recess 2023 may be provided at each corner of the circuitmember 2231 at which the second coil 2230 is provided. The escape recess2023 may be formed by chamfering each corner of the circuit member 2231.Also, in another embodiment, a hole, through which the supporting member2220 extends, may be provided in each corner of the circuit member 2231.

As described above, the housing 2140 may be moved in the seconddirection and/or the third direction due to interaction between thefirst magnet 2130 and the second coil 2230 corresponding thereto,whereby handshake compensation may be performed.

The position sensor 2240 may sense the intensity of a magnetic field ofthe magnet 2130 disposed at the housing 2140 due to movement of thehousing 2140 in a direction perpendicular to the optical axis, and mayoutput an output signal (e.g. output voltage) based on the result ofsensing.

The displacement of the housing 2140 relative to the base 2210 in adirection (e.g. the X axis or the Y axis) perpendicular to the opticalaxis (e.g. the Z axis) may be detected based on the output signal fromthe position sensor 2240.

The position sensor 2240 may include two OIS position sensors 2240 a and2240 b in order to detect the displacement of the housing 2140 in asecond direction (e.g. the X axis) perpendicular to the optical axis anda third (e.g. the Y axis) perpendicular to the optical axis.

For example, the OIS position sensor 2240 a may sense the intensity of amagnetic field of the magnet 2130 due to movement of the housing 2140and may output a first output signal based on the result of sensing, andthe OIS position sensor 2240 b may sense the intensity of a magneticfield of the first magnet 2130 due to movement of the housing 2140 andmay output a second output signal based on the result of sensing. Thecontroller 830 of the camera module or a controller 780 of a portableterminal 200A may detect the displacement of the housing 2140 based onthe first output signal and the second output signal, and may performOIS feedback driving based on the detected displacement of the housing2140.

Each of the OIS position sensors 2240 a and 2240 b may be a Hall sensor.Any sensor may be used as long as the sensor is capable of sensing theintensity of a magnetic field. For example, each of the OIS positionsensors 2240 a and 2240 b may be configured in the form of a driverincluding a Hall sensor, or may be realized as a position detectionsensor, such as a Hall sensor, alone.

Each of the OIS position sensors 2240 a and 2240 b may be mounted on thecircuit board 2250, and the circuit board 2250 may be provided withterminals connected to the OIS position sensors 2240 a and 2240 b.

For coupling between the second circuit board 2250 and the base 2210, acoupling protrusion (not shown) may be provided on the upper surface ofthe base 2210, a hole (not shown), to which the coupling protrusion ofthe base 2210 is coupled, may be provided in the second circuit board2250, and both may be fixed to each other by thermal fusion or using anadhesive member such as an epoxy.

In addition, a protrusion 2029 may be provided in the upper surface ofthe base 2210 around the opening, and the opening 2029 may be insertedinto the opening of the circuit board 2250 and into the opening of thecircuit member 2231.

In general, for autofocus (AF) feedback control, the AF operation unit,e.g. an AF position sensor for sensing displacement of the bobbin, asensing magnet, and a separate power connection structure for drivingthe AF position sensor, is necessary for autofocus (AF) feedbackcontrol. As a result, the structure of the lens moving apparatus may becomplicated, cost may be increased, and the manufacturing process may bedifficult.

In addition, the linear section of a graph between the movement distanceof the bobbin and magnetic flux of the sensing magnet sensed by theposition sensor (hereinafter referred to as a “first linear section”)may be restricted by a positional relationship between the sensingmagnet and the position sensor.

Since no additional position sensor for sensing displacement of thebobbin 2110 is necessary in the embodiment, it is possible to reducecost of the lens moving apparatus and to improve ease in manufacturingprocess.

In the case in which the AF position sensor is used, six supportingmembers are necessary for connection among the first coil, the AFposition sensor, and the circuit board. In contrast, the position sensorand the sensing magnet are omitted and the AF feedback control isperformed using the coil chip 2170 in the embodiment, whereby a drivingsignal may be provided to the first coil 2120 using four supportingmembers, and induced voltage of the coil chip 2170 may be transmitted tothe circuit board 2250.

In addition, since mutual induction between the first coil 2120 and thecoil chip 2170 is used, a second linear section of a correlation graphbetween the movement distance of the bobbin and induced voltage of thecoil chip 2170 may be wider than the first linear section. In theembodiment, therefore, it is possible to secure linearity over a widesection, to reduce a process defect rate, and to perform more accurateAF feedback control.

In general, since the magnitude of voltage induced in the coil chip 2170is changed depending on a change in ambient temperature, a camera moduleor an optical instrument may execute a temperature compensationalgorithm in order to restrain occurrence of malfunction in AF drivingdepending on a change in ambient temperature.

A change in ambient temperature for temperature compensation may bemeasured using the value of resistance of the coil chip 2170.

The value of resistance of the coil chip 2170 may be changed dependingon a change in ambient temperature. A change in ambient temperature fora temperature compensation algorithm may be measured using a change inthe value of resistance of the coil chip 2170 depending on a change inambient temperature. For example, a driving signal for temperaturecompensation, such as alternating current or direct current, may beapplied to the coil chip 2170 and a change in voltage of the coil chip2170 based on the driving signal for temperature compensation may bemeasured, whereby a change in ambient temperature may be measured.

The embodiment described with reference to FIGS. 33 to 43 is illustratedas having a single coil chip 2170. However, the disclosure is notlimited thereto. A lens moving apparatus according to another embodimentmay include another coil chip (referred to as a “second coil chip”)disposed at the inner surface of the corner 2501 c opposite the corner2501 a of the housing 2140 at which the coil chip 2170 (referred to as a“first coil chip”). In this case, the upper elastic member may includefirst to sixth upper springs, and the supporting member may includefirst to sixth supporting members.

The first and second upper springs may be connected to the first coilchip, and the first and second upper springs may be connected to thefirst and second terminals of the circuit board 2250 via the first andsecond supporting members.

The third and fourth upper springs may be connected to the second coilchip, and the third and fourth upper springs may be connected to thethird and fourth terminals of the circuit board 2250 via the third andfourth supporting members.

The first coil chip may be connected to the fifth and sixth uppersprings, and the fifth and sixth upper springs may be connected to thefifth and sixth terminals of the circuit board 2250 via the fifth andsixth supporting members.

FIG. 44A shows a recess 2024 a 1 for mounting a coil chip 2170 accordingto another embodiment, and FIG. 44B shows the upper springs 2150-1 to2150-4 connected to the coil chip 2170 disposed in the recess 2024 a 1of FIG. 44A.

Referring to FIGS. 44A and 44B, the recess 2024 a 1 shown in FIGS. 44Aand 44B may contact the coil chip 2170 and may support the coil chip2170, although the recess 2024 a shown in FIG. 39A is spaced apart fromthe coil chip 2170. For example, the coil chip 21 may be fixed to therecess 2024 a 1 using an adhesive member. For example, the coil chip 21may be fixed to the recess 2024 a 1, whereby the coil chip 2170 may bestably fixed to the housing 2140.

FIG. 45 shows arrangement of a coil chip 2170 according to anotherembodiment, FIG. 46 shows another embodiment of the upper elastic member2150 configured to be coupled to the coil chip 2170 shown in FIG. 45 ,and FIG. 47 shows a connection relationship between the coil chip 2170of FIG. 46 and upper springs of FIG. 46 .

Referring to FIGS. 45 to 47 , the housing 2140 may have a recess 2062 aprovided in the upper surface of one of the side portions 2141 thereofin order to mount the coil chip 2170. In this case, the first recess2024 a and the third recess 2026 a described with reference to FIG. 37 amay be provided in the housing 2140. In another embodiment, however, thefirst recess 2024 a and the third recess 2026 a may be omitted.

For example, the recess 2062 a may be disposed in the upper surface ofthe housing 2140 corresponding to the position between the first upperspring 2150 a and the second upper spring 2150 b.

For example, the recess 2062 a may be disposed in the upper surface ofthe housing 2140 corresponding to the position between the extensionportion 2055 a of the first upper spring 2150 a and the extensionportion 2055 b of the second upper spring 2150 b.

The recess 2062 a of the housing 2140 may have an opening formed in theupper surface of one of the first side portions of the housing 2140.

For weight balance of the housing 2140, the housing 2140 may furtherhave a recess 2062 a corresponding to the recess 2062 a.

The recess 2062 a of the housing 2140 may have a shape corresponding tothe shape of the coil chip 2170, and the coil chip 2170 may be disposedor settled in the recess 2062 a. The first electrode 2172 a and thesecond electrode 2172 b of the coil chip 2170 may be exposed through theopening of the recess 2062 a. That is, the first electrode 2172 a andthe second electrode 2172 b of the coil chip 2170 disposed in the recess2062 a may be exposed to the upper surface of a corresponding one of thefirst side portions of the housing 2140.

The coil chip 2170 disposed in the recess 2062 a may not protrude fromthe upper surface of the first side portion of the housing 2140 in whichthe recess 2062 a is provided.

The upper elastic member shown in FIG. 46 may include upper springs 2150a to 2150 d. The upper springs 2150 a to 2150 d shown in FIG. 46 mayhave a structure similar to the structure of the first to fourth uppersprings 2150-1 to 2150-4 shown in FIG. 38A. In FIG. 46 , the extensionportions P1 and P2 shown in FIG. 29A may be omitted.

The first outer frame 2152 of the first upper spring 2150 a may includean extension portion 2055 a from the coupling region of the secondcoupling portion 2520 to one of the first side portions of the housing2140.

In addition, the first outer frame 2152 of the second upper spring 2150b may include an extension portion 2055 b from the coupling region ofthe second coupling portion 2520 to one of the first side portions ofthe housing 2140.

The extension portion 2055 a of the first upper spring 2150 a may becoupled or bonded to the first electrode 2172 a of the coil chip exposedfrom the recess 2062 a via a conductive adhesive member, such as solder.

In addition, the extension portion 2055 b of the second upper spring2150 b may be coupled or bonded to the second electrode 2172 b of thecoil chip exposed from the recess 2062 a via a conductive adhesivemember, such as solder.

Since the coil chip 2170 is disposed in the recess 2062 a, the coil chipmay not spatially interfere with the first and second upper springs 2150a and 2150 b, and may be directly bonded to the first and second uppersprings 2150 a and 2150 b using solder.

The coil chip 2170 shown in FIG. 37 may be disposed on the magnet2130-3, and may overlap the magnet 2130-3 in the optical-axis direction.

The coil chip 2170 of FIG. 37 may not overlap the magnet 2130 in adirection perpendicular to the optical axis. The reason for this is thatit is necessary to reduce interference between induced voltage generatedin the coil chip 2170 due to mutual induction with the first coil 2120and a line of magnetic force of the magnet 2130.

FIG. 48 shows arrangement of a coil chip 2170 according to anotherembodiment, and FIG. 49 shows first and second upper springs 2150 a-1and 2150 b-1 according to another embodiment configured to be coupled tothe coil chip 2170 of FIG. 48 .

The first and second upper springs 2150 a-1 and 2150 b-1 of FIG. 49 maybe a modification of the first and second upper springs 2150 a and 2150b of FIG. 46 .

Referring to FIGS. 48 and 49 , a recess 2063 a may be provided in theinner surface of each of the first side portions 2141 of the housing2140. The recess 2063 a of FIG. 48 may have an opening formed in theinner surface of each of the first side portions of the housing 2140.

The coil chip 2170 may be disposed or settled in the recess 2063 a ofthe housing 2140. The first electrode 2172 a and the second electrode2172 b of the coil chip 2170 disposed or settled in the recess 2063 amay be exposed through the opening of the recess 2063 a. That is, thefirst electrode 2172 a and the second electrode 2172 b of the coil chip2170 disposed in the recess 2063 a may be exposed to the inner surfaceof a corresponding one of the first side portions of the housing 2140.

The first outer frame 2152 of the first upper spring 2150 a-1 mayinclude a first bent portion 2056 a bent from the extension portion 2055a to the inner surface of the housing 2140.

The first bent portion 2056 a may be connected to one side surface ofthe extension portion 2055 a, and may be bent and extend to the firstelectrode 2172 a of the coil chip 2170 disposed in the recess 2063 a.

The first bent portion 2056 a may be connected or bonded to the firstelectrode 2172 a of the coil chip 2170 via a conductive adhesive member,such as solder.

The first outer frame 2152 of the second upper spring 2150 b-1 mayinclude a second bent portion 2056 b bent from the extension portion2055 b to the inner surface of the housing 2140.

The second bent portion 2056 b may be connected to one side surface ofthe extension portion 2055 b, and may be bent and extend to the secondelectrode 2172 b of the coil chip 2170 disposed in the recess 2063 a.

The second bent portion 2056 b may be connected or bonded to the secondelectrode 2172 b of the coil chip 2170 via a conductive adhesive member,such as solder.

At the initial position of the bobbin 2110, the coil chip 2170 of FIG.47 or 49 may be located at the upper side of the first coil 2120 basedon the lower surface of the bobbin 2110.

At the initial position of the bobbin 2110, the coil chip 2170 of FIG.47 or 49 may not overlap the first coil 2120 in the optical-axisdirection or the first direction.

In addition, the coil chip 2170 of FIG. 47 or 49 may be located underthe first outer frame 2152 of each of the upper springs 2150 a and 2150b or 2150 a-1 or 2150 b-1.

Meanwhile, the lens moving apparatus 100 according to the aboveembodiment may be used in various fields, such as a camera module or anoptical instrument.

For example, the lens moving apparatus 100, 1100, or 2100 according tothe embodiment may be included in an optical instrument configured toform an image of an object in a space using reflection, refraction,absorption, interference, diffraction, etc., which are characteristicsof light, to increase the visual power of the eyes, to record orreproduce an image formed by a lens, to perform optical measurement, orto propagate or transfer an image. For example, an optical instrumentaccording to an embodiment may include a smartphone or a portableterminal equipped with a camera.

FIG. 50 is an exploded perspective view of a camera module 200 accordingto an embodiment.

Referring to FIG. 50 , the camera module may include a lens barrel 400,a lens moving apparatus 100, an adhesive member 612, a filter 610, afirst holder 600, a second holder 800, an image sensor 810, a motionsensor 820, a controller 830, and a connector 840. FIG. 50 shows thelens moving apparatus 100 according to the embodiment of FIG. 1 .However, the disclosure is not limited thereto. A camera moduleaccording to another embodiment may include the lens moving apparatus1100 of FIG. 17 or the lens moving apparatus 2100 of FIG. 33 , insteadof the lens moving apparatus 100.

The lens barrel 400 may be mounted in the bobbin 110 of the lens movingapparatus 100.

The first holder 600 may be disposed under the base 210 of the lensmoving apparatus 100. The filter 610 may be mounted to the first holder600, and the first holder 600 may be provided with a protrusion 500, onwhich the filter 610 is settled.

The adhesive member 612 may couple or adhere the base 210 of the lensmoving apparatus 100 to the first holder 600. The adhesive member 612may function to prevent foreign matter from being introduced into thelens moving apparatus in addition to the function of adhesion.

For example, the adhesive member 612 may be epoxy, a thermo-hardeningadhesive, or an ultraviolet-hardening adhesive.

The filter 610 may function to prevent a specific-frequency-bandcomponent of light passing through the lens barrel 400 from beingincident on the image sensor 810. The filter 610 may be an infraredcutoff filter; however, the disclosure is not limited thereto. In thiscase, the filter 610 may be disposed parallel to the x-y plane.

An opening, through which light passing through the filter 610 isincident on the image sensor 810, may be formed in the region of thefirst holder 600 on which the filter 610 is mounted.

The second holder 800 may be disposed under the first holder 600, andthe image sensor 810 may be mounted on the second holder 600. The imagesensor 810 is a region on which light passing through the filter 610 isincident in order to form an image including the light.

The second holder 800 may be provided with various circuits, elements,and a controller in order to convert an image formed on the image sensor810 into an electrical signal and to transfer the electrical signal toan external apparatus.

The second holder 800 may be realized as a circuit board, on which theimage sensor may be mounted, on which a circuit pattern may be formed,and on which various elements are coupled to each other. The firstholder 600 may also be referred to as a “holder” or a “sensor base,” andthe second holder 800 may also be referred to as a “board” or a “circuitboard.”

The image sensor 810 may receive an image included in light incidentthrough the lens moving apparatus 100, and may convert the receivedimage into an electrical signal.

The filter 610 and the image sensor 810 may be disposed so as to bespaced apart from each other in the state of being opposite each otherin the first direction.

The motion sensor 820 may be mounted on the second holder 800, and maybe connected to the controller 830 via the circuit pattern provided onthe second holder 800.

The motion sensor 820 outputs information about rotational angularvelocity based on movement of the camera module 200. The motion sensor820 may be realized as a two-axis or three-axis gyro sensor or anangular velocity sensor.

The controller 830 may be mounted on the second holder 800, and may beconnected to the second position sensor 240 and the coil 230 of the lensmoving apparatus 100. For example, the second holder 800 may beconnected to the circuit board 250 of the lens moving apparatus 100, andthe controller 830 mounted on the second holder 700 may be connected tothe second position sensor 240 and the second coil 230 via the circuitboard 250.

The controller 830 may transmit a clock signal SCL, a data signal SDA,and power signals VDD and GND for I2C communication with the firstposition sensor 120, and may receive the clock signal SCL and the datasignal SDA from the first position sensor 170.

In addition, the controller 830 may control a driving signal forperforming handshake compensation with respect to the OIS operation unitof the lens moving apparatus 100 based on output signals provided by thesecond position sensor 240 of the lens moving apparatus 100.

The description of the adhesive member 612, the filter 610, the firstholder 600, the second holder 800, the image sensor 810, the motionsensor 820, and the controller 830 of the lens moving apparatus 100 maybe applied to the lens moving apparatus 1100 or 2100.

In addition, for example, the second holder 800 may be connected to thefirst coil 2120, the second coil 2230, the position sensor 2240, and thecoil chip 2170 of the lens moving apparatus 2100.

For example, a driving signal may be provided to each of the first coil2120, the second coil 2230, and the position sensor 2240 via the secondholder 800, and an output signal (for example, induced voltage) of thecoil chip 2170 may be transmitted to the second holder 800.

The connector 840 may be connected to the second holder 800, and mayhave a port for connection with an external apparatus.

FIG. 51 is a perspective view of a portable terminal 200A according toan embodiment, and FIG. 52 shows the construction of the portableterminal 200A shown in FIG. 51 .

Referring to FIGS. 51 and 52 , the portable terminal 200A (hereinafterreferred to as a “terminal”) may include a body 850, a wirelesscommunication unit 710, an A/V input unit 720, a sensing unit 740, aninput/output unit 750, a memory unit 760, an interface unit 770, acontroller 780, and a power supply unit 790.

The body 850 shown in FIG. 51 has a bar shape; however, the disclosureis not limited thereto. The body may have any of various structures,such as a slide type structure, a folder type structure, a swing typestructure, and a swivel type structure, in which two or more sub-bodiesare coupled so as to be movable relative to each other.

The body 850 may include a case (casing, housing, cover, etc.) thatdefines the external appearance thereof. For example, the body 850 maybe divided into a front case 851 and a rear case 852. Various electronicparts of the terminal may be mounted in a space defined between thefront case 851 and the rear case 852.

The wireless communication unit 710 may include one or more modules thatenable wireless communication between the terminal 200A and a wirelesscommunication system or between the terminal 200A and a network in whichthe terminal 200A is located. For example, the wireless communicationunit 710 may include a broadcast receiving module 711, a mobilecommunication module 712, a wireless Internet module 713, a nearfieldcommunication module 714, and a location information module 715.

The A/V (audio/video) input unit 720, which is provided to input anaudio signal or a video signal, may include a camera 721 and amicrophone 722.

The camera 721 may include the camera module 200 according to theembodiment shown in FIG. 50 .

The sensing unit 740 may sense the current state of the terminal 200A,such as the opening and closing state of the terminal 200A, the positionof the terminal 200A, whether a user contacts the terminal, theorientation of the terminal 200A, and acceleration/deceleration of theterminal 200A, in order to generate a sensing signal for controlling theoperation of the terminal 200A. For example, in the case in which theterminal 200A is a slide phone, the sensing unit may sense whether theslide phone is open or closed. In addition, the sensing unit senseswhether power is supplied from the power supply unit 790 and whether theinterface unit 770 is coupled to an external instrument.

The input/output unit 750 is provided to generate input or outputrelated to visual sensation, audible sensation, or tactile sensation.The input/output unit 750 may generate input data for controlling theoperation of the terminal 200A, and may display information processed bythe terminal 200A.

The input/output unit 750 may include a keypad unit 730, a displaymodule 751, a sound output module 752, and a touchscreen panel 753. Thekeypad unit 730 may generate input data through keypad input.

The display module 751 may include a plurality of pixels, the color ofwhich is changed according to an electrical signal. For example, thedisplay module 751 may include at least one of a liquid crystal display,a thin film transistor-liquid crystal display, an organic light-emittingdiode, a flexible display, or a three-dimensional (3D) display.

The sound output module 752 may output audio data received from thewireless communication unit 710 in a call signal reception mode, atelephone communication mode, a recording mode, a voice recognitionmode, or a broadcast reception mode, or may output audio data stored inthe memory unit 760.

The touchscreen panel 753 may convert a change in capacitance due to auser's touch on a specific region of the touchscreen into an electricalinput signal.

The memory unit 760 may store a program for processing and control ofthe controller 780, and may temporarily store input/output data (forexample, a telephone directory, messages, audio, still images,photographs, and video). For example, the memory unit 760 may storeimages, such as photographs or video, captured by the camera 721.

The interface unit 770 functions as a path for connection between theterminal 200A and an external instrument. The interface unit 770 mayreceive data from the external instrument, may receive electric powerand transmit the received electric power to internal components of theterminal 200A, or may transfer data in the terminal 200A to the externalinstrument. For example, the interface unit 770 may include awired/wireless headset port, an external charger port, a wired/wirelessdata port, a memory card port, a port for connection with an apparatushaving an identification module, an audio input/output (I/O) port, avideo input/output (I/O) port, and an earphone port.

The controller 780 may control the overall operation of the terminal200A. For example, the controller 780 may perform related control andprocessing for voice communication, data communication, and videocommunication.

The controller 780 may have a multimedia module 781 for multimediareproduction. The multimedia module 781 may be realized in thecontroller 780 or may be realized separately from the controller 780.

The controller 780 may perform pattern recognition processing that iscapable of recognizing writing input or drawing input performed on thetouchscreen as text or an image, respectively.

Instead of the controller 830 of the camera module 200, the controller780 of the optical instrument 200A may transmit a clock signal SCL, adata signal SDA, and power signals VDD and GND for I2C communicationwith the first position sensor 120, and may receive the clock signal SCLand the data signal SDA from the first position sensor 170.

The power supply unit 790 may receive external power and internal powerand supply required power to respective components under control of thecontroller 780.

The features, structures, and effects described in the above embodimentsare included in at least one embodiment, but are not limited only to oneembodiment. Furthermore, features, structures, and effects illustratedin each embodiment may be combined or modified in other embodiments bythose skilled in the art to which the embodiments pertain. Therefore, itis to be understood that such combinations and modifications fall withinthe scope of the present disclosure.

INDUSTRIAL APPLICABILITY

Embodiments may be used in a lens moving apparatus capable of reducingmagnetic field interference, reducing size, reducing currentconsumption, and improving sensitivity in OIS driving, and a cameramodule and optical instrument including the same.

What is claimed is:
 1. A lens moving apparatus comprising: a housing; abobbin disposed in the housing; a first coil disposed on the bobbin; afirst magnet disposed on the housing; a first circuit board disposed ona side portion of the housing and comprising a first terminal, a secondterminal, a third terminal, a fourth terminal, a fifth terminal and asixth terminal; a first position sensor disposed on the first circuitboard and connected to the first to sixth terminals of the first circuitboard; an upper elastic member coupled to an upper portion of thehousing and connected to the first to fourth terminals of the firstcircuit board; and a lower elastic member coupled to a lower portion ofthe housing and connected to the fifth and sixth terminals of the firstcircuit board, wherein the first coil is connected to the lower elasticmember, and wherein the first to fourth terminals are positioned higherthan the first position sensor and the fifth and sixth terminals arepositioned lower than the first positioned sensor.
 2. The lens movingapparatus according to claim 1, wherein the upper elastic membercomprises first to fourth upper elastic units, and wherein each of thefirst to fourth upper elastic units is coupled to a corresponding one ofthe first to fourth terminals of the first circuit board.
 3. The lensmoving apparatus according to claim 1, wherein the lower elastic membercomprises a first lower elastic unit coupled to one end of the firstcoil and a second lower elastic unit coupled to another end of the firstcoil.
 4. The lens moving apparatus according to claim 2, wherein thehousing comprises first to fourth side portions and first to fourthcorner portions, and wherein the first to fourth upper elastic units isdisposed on a corresponding one of the first to fourth corner portionsof the housing.
 5. The lens moving apparatus according to claim 4,comprising: a second circuit board disposed under the lower elasticmember; and a supporting member comprising first to fourth supportingmembers electrically connected the upper elastic member and the secondcircuit board, wherein each of the supporting members is disposed at acorresponding one of the first to fourth corner portions of the housing.6. The lens moving apparatus according to claim 4, wherein the firstmagnet comprises first to fourth magnet units, and each of the first tofourth magnet units is disposed on a corresponding one of the first tofourth corner portions of the housing.
 7. The lens moving apparatusaccording to claim 1, wherein the housing comprises a first recess and asecond recess, wherein the first circuit board is disposed in the firstrecess and the first position sensor is disposed in the second recess.8. The lens moving apparatus according to claim 1, wherein the firstposition sensor is configured to transmit signals for data communicationto the first circuit board or receive the signals for data communicationfrom the first circuit board through the first to fourth terminals. 9.The lens moving apparatus according to claim 5, comprising: a secondmagnet disposed on the bobbin so as to correspond to the first positionsensor; and a second coil disposed on the second circuit board so as tocorrespond to the first magnet.
 10. The lens moving apparatus accordingto claim 1, wherein the first and second terminals are for providing apower signal, and the third terminal is for providing a clock, and thefourth terminal is for providing a data signal.
 11. The lens movingapparatus according to claim 1, wherein the first position sensor isdisposed on a first surface of the first circuit board facing thebobbin, and the first to fourth terminals are disposed on a secondsurface of the first circuit board opposite the first surface of thefirst circuit board.
 12. The lens moving apparatus according to claim 4,wherein one end of the first upper elastic unit extends from the firstcorner to the first side portion so as to be coupled to the firstterminal, one end of the second upper elastic unit extends from thesecond corner to the first side portion so as to be coupled to thesecond terminal, one end of the third upper elastic unit extends fromthe third corner to the first side portion so as to be coupled to thethird terminal, and one end of the fourth upper elastic unit extendsfrom the fourth corner to the first side portion so as to be coupled tothe fourth terminal.
 13. The lens moving apparatus according to claim 3,wherein the fifth terminal is coupled to the first lower elastic unit bya solder or a conductive adhesive member and the sixth terminal iscoupled to the second lower elastic unit by a solder or a conductiveadhesive member.
 14. A lens moving apparatus comprising: a housing; abobbin disposed in the housing; a first coil disposed on the bobbin; afirst magnet disposed on the housing; a first circuit board disposed ona side portion of the housing and comprising a first terminal, a secondterminal, a third terminal, a fourth terminal, a fifth terminal and asixth terminal; a first position sensor disposed on the first circuitboard and connected to the first to sixth terminals of the first circuitboard; an upper elastic member coupled to an upper portion of thehousing and connected to the first to fourth terminals of the firstcircuit board; and a lower elastic member coupled to a lower portion ofthe housing and connected to the fifth and sixth terminals of the firstcircuit board, wherein the upper elastic member comprises first tofourth upper elastic units and wherein each of the first to fourth upperelastic units is coupled to a corresponding one of the first to fourthterminals of the first circuit board, wherein the first circuit boardcomprises a body portion and an extension portion disposed under thebody portion and extending downwards from the body portion, and whereinthe first to fourth terminals are disposed on the body portion and thefifth and sixth terminals are disposed on the extension portion.
 15. Thelens moving apparatus according to claim 14, wherein a transverse lengthof the body portion is larger than a transverse length of the extensionportion.
 16. The lens moving apparatus according to claim 14, whereinthe first terminal is disposed on a first end of the body portion andthe second terminal is disposed on a second end of the body portion, andthe third and fourth terminals are disposed between the first and secondterminals, and wherein the first and second terminals of the firstcircuit board are for providing a power signal to the first positionsensor, and the third terminal is for providing a clock, and the fourthterminal is for providing a data signal.
 17. The lens moving apparatusaccording to claim 16, wherein the first position sensor is disposed ona first surface of the first circuit board facing the bobbin, and thefirst to fourth terminals are disposed on a second surface of the firstcircuit board opposite the first surface of the first circuit board. 18.The lens moving apparatus according to claim 14, wherein the first coilis connected to the lower elastic member.
 19. A lens moving apparatuscomprising: a housing; a bobbin disposed in the housing; a first coildisposed on the bobbin; a first magnet disposed on the housing; a firstcircuit board disposed on a side portion of the housing and comprising afirst terminal, a second terminal, a third terminal, a fourth terminal,a fifth terminal and a sixth terminal; a first position sensor disposedon the first circuit board and connected to the first to sixth terminalsof the first circuit board; an upper elastic member coupled to an upperportion of the housing and comprising first to fourth upper elasticunits connected to the first to fourth terminals of the first circuitboard; and a lower elastic member coupled to a lower portion of thehousing and connected to the fifth and sixth terminals of the firstcircuit board, wherein the third and fourth terminals are disposedbetween the first and second terminals, wherein the first circuit boardcomprises: a first recess formed between the second terminal and thefourth terminal; and a second recess formed between the first terminaland the third terminal, wherein the third upper elastic unit comprises aportion disposed in the first recess of the first circuit board andcoupled to the third terminal of the circuit board, and wherein thefourth upper elastic unit comprises a portion disposed in the secondrecess of the first circuit board and coupled to the fourth terminal ofthe circuit board.
 20. A lens moving apparatus comprising: a housing; abobbin disposed in the housing; a first coil disposed on the bobbin; afirst magnet disposed on the housing; a first circuit board disposed ona side portion of the housing; a first position sensor disposed on thefirst circuit board; an upper elastic member coupled to an upper portionof the housing; and a lower elastic member coupled to a lower portion ofthe housing.